Wafer with regions of low oxygen concentration
A single crystal silicon wafer has a thickness between a first surface and an opposite second surface from 50 μm to 300 μm. The wafer includes a first region extending a first depth from the first surface. The first region has a reduced oxygen concentration relative to an adjacent region of the wafer. The wafer has a bulk minority carrier lifetime greater than 100 μs.
1. A semiconductor material comprising:
a single crystal silicon ribbon floating on molten silicon, wherein
the single crystal silicon ribbon has a thickness between a first surface and a second surface from 50 μm to 300 μm,
the first surface and the second surface are opposite each other,
the single crystal silicon ribbon includes a first region extending a first depth from the first surface toward the second surface,
the first region has a reduced oxygen concentration relative to a bulk region of the single crystal silicon ribbon, and
the single crystal silicon ribbon has a bulk minority carrier lifetime greater than 100 μs.
2. The semiconductor material of claim 1 , wherein the first surface and the second surface are flat.
3. The semiconductor material of claim 1 , wherein the first region has an oxygen concentration from 0.1 to 8.0 ppma.
4. The semiconductor material of claim 1 , wherein the bulk region of the single crystal silicon ribbon has an oxygen concentration from 8 to 25 ppma.
5. The semiconductor material of claim 1 , wherein the first depth is at least 5 μm.
6. The semiconductor material of claim 1 , wherein the first depth is from 10% to 90% of the thickness.
7. The semiconductor material of claim 6 , wherein the first depth is approximately 30% of the thickness.
8. The semiconductor material of claim 1 , wherein the first region has a reduced concentration of bulk micro defects relative to the bulk region of the single crystal silicon ribbon.
9. The semiconductor material of claim 1 , further comprising a second region extending a second depth from the second surface toward the first surface, and wherein the second region has a reduced oxygen concentration relative to the bulk region of the single crystal silicon ribbon disposed between the first region and the second region.
10. The semiconductor material of claim 9 , wherein the second region has an oxygen concentration from 0.1 to 8.0 ppma.
11. The semiconductor material of claim 9 , wherein the second depth is at least 5 μm.
12. The semiconductor material of claim 9 , wherein the first depth and the second depth combined is from 10% to 90% of the thickness.
13. The semiconductor material of claim 9 , wherein the second depth is approximately 10% of the thickness.
14. The semiconductor material of claim 9 , wherein the first region and the second region have a reduced concentration of bulk micro defects relative to the bulk region of the single crystal silicon ribbon disposed between the first region and the second region.
15. The semiconductor material of claim 9 , wherein the first depth and the second depth are different distances.
16. The semiconductor material of claim 1 , wherein the single crystal silicon ribbon is rectangular.
17. The semiconductor material of claim 1 , wherein the single crystal silicon ribbon further includes a dopant.
18. The semiconductor material of claim 1 , wherein the single crystal silicon ribbon has an average oxygen precipitate count from 0 to 1e11/cm3 in the first region.