Method for forming a doped silicon ingot of uniform resistivity

1. A method for forming a silicon ingot comprising the following steps:

providing a silicon ingot of variable electrical resistivity and containing interstitial oxygen;

determining the interstitial oxygen concentration in a plurality of different areas of the silicon ingot;

calculating a concentration of thermal donors to be created in each area of the plurality of different areas of the silicon ingot so that the electrical resistivity in each area is almost identical;

determining an annealing temperature for each area of the plurality of different areas of the silicon ingot, the annealing temperature being determined from the interstitial oxygen concentration of each area and from the concentration of thermal donors to be created in each area; and

subjecting each area of the plurality of different areas of the silicon ingot to annealing so as to form the thermal donors, wherein, for each area of the plurality of different areas, the annealing being defined by the annealing temperature and an annealing time.

2. The method according to claim 1 , wherein the plurality of different areas are distributed over the height of the ingot.

3. The method according to claim 1 , comprising a dicing step of the plurality of different areas of the silicon ingot.

4. The method according to claim 1 , wherein the annealing time is determined according to the following relation:

t

=

-

1

B

·

D

i

·

C

o

×

ln

(

1

-

N

DDT

·

n

2

A

·

C

o

3

)

,

where:

N DDT is the calculated thermal donor concentration;

C o is the interstitial oxygen concentration;

n is the electron content at the annealing temperature;

A and B are constants, wherein A is about 5.6×10 −6 and B is about 5.1×10 −5 ;

D i is the interstitial oxygen diffusion coefficient.

5. The method according to claim 4 , wherein A is equal to 5.6×10 −6 and B is equal to 5.1×10 −5 .

6. The method according to claim 1 , wherein the annealing time is chosen such that the annealing temperature in the different areas of the silicon ingot is comprised between 400° C. and 500° C.

7. The method according to claim 1 , wherein the interstitial oxygen concentration is determined by measuring a variation of electrical resistivity in the different areas of the silicon ingot after formation of thermal donors by a preliminary annealing, a concentration of thermal donors formed by the preliminary annealing being subtracted from the concentration of thermal donors to be created for determination of the annealing temperature in each area of the plurality of different areas.

8. The method according to claim 1 , wherein the interstitial oxygen concentration is determined by Fourier transform infrared spectroscopy.

9. The method according to claim 1 , wherein the annealing time is chosen such that the annealing temperature in the different areas of the silicon ingot is comprised between 400° C. and 500° C., and wherein the annealing time is determined according to the following relation:

t

=

-

1

B

·

D

i

·

C

o

×

ln

(

1

-

N

DDT

·

n

2

A

·

C

o

3

)

,

where:

N DDT is the calculated thermal donor concentration;

C o is the interstitial oxygen concentration;

n is the electron content at the annealing temperature;

A and B are constants, wherein A is about 5.6×10 −6 and B is about 5.1×10 −5 ;

D i is the interstitial oxygen diffusion coefficient.

10. The method according to claim 9 , wherein A is equal to 5.6×10 −6 and B is equal to 5.1×10 −5 .

11. A method for forming a silicon ingot comprising the following steps:

providing a silicon ingot of variable electrical resistivity and containing interstitial oxygen;

determining the interstitial oxygen concentration in a plurality of different areas of the silicon ingot;

calculating a concentration of thermal donors to be created in each area of the plurality of different areas of the silicon ingot to reach a target electrical resistivity value, the target electrical resistivity value being identical for the plurality of different areas of the silicon ingot;

determining an annealing temperature for each area of the plurality of different areas of the silicon ingot, the annealing temperature being determined from the interstitial oxygen concentration of each area and from the concentration of thermal donors to be created in each area; and

subjecting each area of the plurality of different areas of the silicon ingot to annealing so as to form the thermal donors for each area of the plurality of different areas, the annealing being defined by the annealing temperature and an annealing time.

12. A method for forming a silicon ingot comprising the following steps:

providing a silicon ingot of variable electrical resistivity and containing interstitial oxygen;

determining the interstitial oxygen concentration in a plurality of different areas of the silicon ingot;

calculating a concentration of thermal donors to be created in each area of the plurality of different areas of the silicon ingot to reach a target electrical resistivity value;

determining an annealing temperature for each area of the plurality of different areas of the silicon ingot, the annealing temperature being determined from the interstitial oxygen concentration of each area and from the concentration of thermal donors to be created in each area; and

subjecting each area of the plurality of different areas of the silicon ingot to annealing so as to form the thermal donors for each area of the plurality of different areas, the annealing being defined by the annealing temperature and an annealing time,

wherein the interstitial oxygen concentration is determined by measuring a variation of electrical resistivity in the different areas of the silicon ingot after formation of thermal donors by a preliminary annealing, a concentration of thermal donors formed by the preliminary annealing being subtracted from the concentration of thermal donors to be created for determination of the annealing temperature in each area of the plurality of different areas.