US 2655693A
· Adams
· 1953
[cited by applicant]
US 3300557A
· Luciano
· 1967
[cited by applicant]
US 3417175A
· Brown et al.
· 1968
[cited by applicant]
US 3439083A
· Ugolini
· 1969
[cited by applicant]
US 3791906A
· Farkas
· 1974
[cited by applicant]
US 4415623A
· Schlaepfer
· 1983
[cited by applicant]
US 4655868A
· Hefele
· 1987
[cited by applicant]
US 4880588A
· Brault et al.
· 1989
[cited by applicant]
US 4944979A
· Gagliano
· 1990
[cited by examiner]
US 5498307A
· Stevenson
· 1996
[cited by applicant]
US 5773080A
· Simmons
· 1998
[cited by examiner]
US 5937272A
· Tang
· 1999
[cited by applicant]
US 6194119B1
· Wolk et al.
· 2001
[cited by applicant]
US 6296732B1
· Enlow et al.
· 2001
[cited by applicant]
US 6733870B2
· Enlow et al.
· 2004
[cited by applicant]
US 6767807B2
· Shibata et al.
· 2004
[cited by applicant]
US 6773537B2
· Erickson et al.
· 2004
[cited by applicant]
US 6809045B1
· Alam et al.
· 2004
[cited by applicant]
US 8039373B2
· Fujinawa et al.
· 2011
[cited by applicant]
US 8574668B2
· Brown et al.
· 2013
[cited by applicant]
US 8956685B2
· Bogue
· 2015
[cited by examiner]
US 9732454B2
· Davis et al.
· 2017
[cited by applicant]
US 20040209057A1
· Enlow
· 2004
[cited by examiner]
US 20050252602A1
· Tateishi
· 2005
[cited by applicant]
US 20060154546A1
· Murphy
· 2006
[cited by examiner]
US 20060260024A1
· Lee
· 2006
[cited by applicant]
US 20070016999A1
· Harber et al.
· 2007
[cited by applicant]
US 20070026265A1
· Sakurai et al.
· 2007
[cited by applicant]
US 20070042660A1
· Waxler
· 2007
[cited by applicant]
US 20070161305A1
· Wangbunyen
· 2007
[cited by applicant]
US 20070270067A1
· Yasui et al.
· 2007
[cited by applicant]
US 20080057809A1
· Rock
· 2008
[cited by applicant]
US 20080104738A1
· Conley et al.
· 2008
[cited by applicant]
US 20080254263A1
· Yasui et al.
· 2008
[cited by applicant]
US 20090276936A1
· Makida et al.
· 2009
[cited by applicant]
US 20120282403A1
· Ray et al.
· 2012
[cited by applicant]
US 20160338415A1
· Aihara
· 2016
[cited by applicant]
US 20160338435A1
· Aihara
· 2016
[cited by applicant]
US 20160340826A1
· Tibbits et al.
· 2016
[cited by applicant]
US 20180192720A1
· Blackford et al.
· 2018
[cited by applicant]
US 20180195216A1
· Lin
· 2018
[cited by applicant]
US 20180319134A1
· Abbondanzio
· 2018
[cited by examiner]
US 20200164610A1
· Davis
· 2020
[cited by examiner]
US 20200215786A1
· Dorton et al.
· 2020
[cited by applicant]
CN 2521924Y
· 2002
[cited by applicant]
CN 102613730
· 2012
[cited by applicant]
CN 102613730A
· 2012
[cited by applicant]
CN 103519427
· 2014
[cited by applicant]
CN 103519427A
· 2014
[cited by applicant]
CN 104859270A
· 2015
[cited by applicant]
CN 106029234A
· 2016
[cited by applicant]
CN 107750130A
· 2018
[cited by applicant]
CN 108471823
· 2018
[cited by applicant]
CN 108471823A
· 2018
[cited by applicant]
CN 109121386A
· 2019
[cited by applicant]
EP 0360929A1
· 1990
[cited by applicant]
EP 0789543B1
· 2002
[cited by applicant]
EP 2411210B1
· 2016
[cited by applicant]
EP 3449743A1
· 2019
[cited by applicant]
FR 2856708A1
· 2004
[cited by applicant]
GB 2184399B
· 1990
[cited by applicant]
JP 60072800A
· 1985
[cited by applicant]
JP 2000195665A
· 2000
[cited by applicant]
JP 2002338908A
· 2002
[cited by applicant]
JP 2002338908
· 2002
[cited by applicant]
JP 2003322715A
· 2003
[cited by applicant]
KR 1020090102426A
· 2009
[cited by applicant]
TW 201225160A
· 2012
[cited by applicant]
WO 2009041916A1
· 2009
[cited by applicant]
WO 2019155348A1
· 2019
[cited by applicant]
WO 2019169079A1
· 2019
[cited by applicant]
WO 2021027837A1
· 2021
[cited by applicant]
WO 2021096724A1
· 2021
[cited by applicant]
Material Properties—“Polyamide—Nylon—Density—Strength—Melting Point—Thermal Conductivity” Webpage found at <https://material-properties.org/polyamide-nylon-density-strength-melting-point-thermal-conductivity/> Not Prior…
[cited by examiner]
Lee Products Company, “New Sortkwik Fingertip Moistener”, YouTube Vide dated Mar. 6, 2025. Accessed at <https://www.youtube.com/watch?v=rb6ynWoovS0> (Year: 2015).
[cited by examiner]
Seo Ho Lee, Ryong You, Young Il Yoon, and Won Ho Park. “Preparation and characterization of acrylic pressure-sensitive adhesives based on UV and heat curing systems”. International Journal of Adhesion and Adhesives 75 (…
[cited by examiner]
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2020/045753, dated Feb. 24, 2022, 9 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 17/505,198, mailed on Aug. 14, 2024. 9 pages.
[cited by applicant]
Office Action received for European Application No. 20852126.0, mailed on Jul. 22, 2024, 5 pages.
[cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 16/988,110, mailed on Jun. 7, 2023, 19 pages.
[cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 18/100,362, mailed on May 24, 2023, 12 pages.
[cited by applicant]
Final Office Action received for U.S. Appl. No. 16/988,110, mailed on Feb. 17, 2023, 17 pages.
[cited by applicant]
Final Office Action received for U.S. Appl. No. 16/988,116, mailed on Jan. 19, 2023, 9 pages.
[cited by applicant]
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/CN2020/108643, mailed on Feb. 24, 2022, 5 pages.
[cited by applicant]
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2020/045753, mailed on Feb. 24, 2022, 9 pages.
[cited by applicant]
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2020/045755, mailed on Feb. 24, 2022, 8 pages.
[cited by applicant]
International Preliminary Report on Patentability received for PCT Patent Application No. PCT/US2020/045756, mailed on Feb. 24, 2022, 9 pages.
[cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 16/988,093, mailed on Mar. 22, 2022, 8 pages.
[cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 17/505,198, mailed on Apr. 22, 2024, 18 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 18/100,362, mailed on Apr. 4, 2024, 8 pages.
[cited by applicant]
International Search Report and Written Opinion received for PCT Patent Application No. PCT/US2022/046742, mailed on Jan. 26, 2023, 13 pages.
[cited by applicant]
Final office action received for U.S. Appl. No. 18/100,362, mailed on Dec. 13, 2023, 7 pages.
[cited by applicant]
Intention to Grant received for European Application No. 20761444.7, mailed on Dec. 15, 2023, 6 pages.
[cited by applicant]
Office Action received for European Application No. 20761445.4, mailed on Dec. 14, 2023, 6 pages.
[cited by applicant]
Office Action received for European Application No. 20761936.2, mailed on Dec. 13, 2023, 4 pages.
[cited by applicant]
Extended European Search Report received for European Patent Application No. 20852126.0, mailed on Sep. 8, 2023, 9 pages.
[cited by applicant]
Final Office Action received for U.S. Appl. No. 16/988,110, mailed on Sep. 21, 2023, 16 pages.
[cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 16/988,116, mailed on Sep. 27, 2023, 9 pages.
[cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 16/988,116, mailed on Sep. 14, 2022, 9 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 16/988,093, mailed on Sep. 21, 2022, 8 pages.
[cited by applicant]
International Search Report issued in PCT/CN2020/108643, issued Nov. 18, 2020, 3 pages.
[cited by applicant]
Non- Final Office Action received for U.S. Appl. No. 16/988,110, mailed on Apr. 11, 2022, 10 pages.
[cited by applicant]
Production Processes, 8 pages.
[cited by applicant]
Hardy, Norm, “What is Patterned Thin Film Deposition for Lift Off?”, Semicore, Available online at: <http://www.semicore.com/news/73-thin-film-deposition-lift-off>, Sep. 16, 2013, 2 pages.
[cited by applicant]
Yang, Lei, “Patterning Technique”, ScienceDirect, Available online at: <https://www.sciencedirect.com/topics/engineering/patterning-method>, 2015, 22 pages.
[cited by applicant]
Final Office Action received for U.S. Appl. No. 16/988,116, mailed on Jun. 24, 2024, 9 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 18/100,362, mailed on Jun. 20, 2024, 2 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 16/988,116, mailed on Mar. 3, 2025, 9 pages.
[cited by applicant]
Extended European Search Report received for European Application No. 24177068.4, mailed on Oct. 18, 2024, 8 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 17/505,198, mailed on Nov. 20, 2024, 4 pages.
[cited by applicant]
Notice of Allowance received for U.S. Appl. No. 16/988,110, mailed on Oct. 23, 2025, 8 pages.
[cited by applicant]
Extended European Search Report received for European Patent Application No. 25192185.4, mailed on Oct. 16, 2025, 8 pages.
[cited by applicant]
Notice of Allowance received for Canadian Patent Application No. 3,229,371, mailed on Dec. 1, 2025, 1 page.
[cited by applicant]