Resistor geometry

1. A method for fabricating a thin-film resistor on a supporting structure, the thin-film resistor comprising a first terminal, a second terminal, and a resistor body providing a resistive current path between the first terminal and the second terminal, the method comprising:

depositing a first layer of conductive material onto at least one of the supporting structure and the resistor body, applying a first lithographic process to the first layer, and etching the first layer to form the first terminal; and

depositing a second layer of conductive material onto at least one of the supporting structure and the resistor body, applying a second lithographic process to the second layer, and etching the second layer to form the second terminal,

wherein the first lithographic process is different to the second lithographic process, and a lateral separation of the first terminal and the second terminal is less than an in-plane minimum feature size of the first and second lithographic processes,

wherein the lateral separation of the first terminal and the second terminal is non-zero, and

wherein the second terminal and the resistor body are formed from separate thin-film layers of material.

2. The method of claim 1 , wherein the lithographic processes are optical lithographic processes.

3. The method of claim 1 , wherein at least a portion of the second terminal lies outside of a lateral planar region having a height and position defined by the vertical extent of the first terminal.

4. The method of claim 1 , wherein the resistor body is non-planar.

5. The method of claim 1 , wherein the resistor body includes a first planar region lying in a first lateral plane and a second planar region lying in a second lateral plane, and a third planar region lying in a third plane substantially perpendicular to the first and second lateral planes and connecting the first and second planar regions, and wherein the first and second lateral planes are separated by a distance in a direction parallel to the third plane.

6. The method of claim 5 , wherein the first planar region of the resistor body laterally overlaps at least part of the first terminal.

7. The method of claim 5 , wherein the second planar region of the resistor body laterally overlaps at least part of the second terminal.

8. The method of claim 1 , wherein the resistor comprises a third terminal electrically connected to the first terminal, and wherein the resistor body provides a resistive path between the second terminal and the third terminal which is different to the resistive path between the first terminal and the second terminal, and wherein the method comprises forming the third terminal at a separate time to at least one of the first terminal and the second terminal.

9. The method of claim 8 , wherein the separation of the second terminal and the third terminal is less than an in-plane minimum feature size of the first and second lithographic processes.

10. The method of claim 8 , wherein the third terminal lies at least partially outside of a lateral planar region having a height and position defined by a vertical extent of the first terminal and a lateral planar region having a height and position defined by a vertical extent of the second terminal.

11. The method of claim 1 , wherein applying the first and second lithographic processes each includes depositing an unstated photoresist layer onto a respective layer of conductive material, applying a photo-lithographic mask to the photoresist layer, and developing the photoresist layer to produce a patterned photoresist layer.