Curable resin composition, dry film and cured product thereof, and electronic component including cured product
Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.
1. A curable resin composition, comprising:
an amide-imide resin;
a compound having an ethylenic double bond;
a photopolymerization initiator; and
a carboxyl group-containing resin having no amide-imide structures such that the carboxyl group-containing resin has a structure that is different from a structure of the amide-imide resin,
wherein the amide-imide resin is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight in a range of 500 to 1000, and the carboxyl group-containing resin has a content in a range of 50 parts by mass to 100 parts by mass with respect to 100 parts by mass of the amide-imide resin.
2. The curable resin composition according to claim 1 , wherein the tricarboxylic acid anhydride has an aliphatic structure.
3. The curable resin composition according to claim 1 , wherein the amide-imide resin has a number-average molecular weight in a range of 500 to 800.
4. The curable resin composition according to claim 1 , further comprising:
a thermosetting resin.
5. The curable resin composition according to claim 3 , wherein when a cured product of the curable resin composition has a film thickness of 20 um, the cured product has a total light transmittance of 95% or more and a haze value of less than 2.0%.
6. A dry film, comprising:
a resin layer formed of the curable resin composition of claim 1 .
7. A cured product produced by a process comprising curing the curable resin composition of claim 1 .
8. An electronic component, comprising:
the cured product of claim 7 .
9. A cured product produced by a process comprising curing the resin layer of the dry film of claim 6 .
10. The curable resin composition according to claim 2 , further comprising:
a thermosetting resin.
11. The curable resin composition according to claim 4 , wherein when a cured product of the curable resin composition has a film thickness of 20 um, the cured product has a total light transmittance of 95% or more and a haze value of less than 2.0%.
12. A dry film, comprising:
a resin layer formed of the curable resin composition of claim 2 .
13. A cured product produced by a process comprising curing the curable resin composition of claim 2 .
14. An electronic component, comprising:
the cured product of claim 13 .
15. A cured product produced by a process comprising curing the resin layer of the dry film of claim 12 .
16. The curable resin composition according to claim 3 , further comprising:
a thermosetting resin.
17. A dry film, comprising:
a resin layer formed of the curable resin composition of claim 3 .
18. A cured product produced by a process comprising curing the curable resin composition of claim 3 .
19. An electronic component, comprising:
the cured product of claim 18 .
20. A cured product produced by a process comprising curing the resin layer of the dry film of claim 17 .