Method and device for manufacturing structure
A method for manufacturing a structure, including photoelectrochemically etching an etching object, the photoelectrochemical etching of the etching object including: injecting an alkaline or acidic etching solution containing an oxidizing agent that receives electrons, into a rotatably held container in which an etching object at least whose surface is composed of group III nitride is held, and immersing the surface in the etching solution; irradiating the surface of the etching object held in the container with light in a stationary state of the etching object and the etching solution; and rotating the container to scatter the etching solution toward an outer peripheral side, thereby discharging the etching solution from the container, after the surface is irradiated with the light.
1. A method for manufacturing a structure, including photoelectrochemically etching an etching object,
the photoelectrochemical etching of the etching object comprising:
injecting an alkaline or acidic etching solution containing an oxidizing agent that receives electrons, into a rotatably held container in which an etching object at least whose surface is composed of group III nitride is held, and immersing the surface in the etching solution;
irradiating the surface of the etching object held in the container with light in a stationary state of the etching object and the etching solution; and
rotating the container to scatter the etching solution toward an outer peripheral side, thereby discharging the etching solution from the container, after the surface is irradiated with the light.
2. The method for manufacturing a structure according to claim 1 , wherein the photoelectrochemical etching of the etching object is performed a plurality of times.
3. The method for manufacturing a structure according to claim 2 , including post-processing the etching object,
the post-processing of the etching object comprising:
injecting a post-processing solution into the container in which the etching object is held, the etching object being photoelectrochemically etched by the photoelectrochemical etching of the etching object, and maintaining a state where the etching object is immersed in the post-processing solution for a predetermined period of time; and
rotating the container to scatter the post-processing solution toward the outer peripheral side, thereby discharging the post-processing solution from the container.
4. The method for manufacturing a structure according to claim 2 , including post-processing the etching object,
the post-processing of the etching object comprising injecting a post-processing solution into the container in which the etching object is held, the etching object being photoelectrochemically etched by the photoelectrochemical etching of the etching object, and rotating the container to scatter the post-processing solution toward the outer peripheral side, thereby discharging the post-processing solution from the container.
5. The method for manufacturing a structure according to claim 1 , including post-processing the etching object,
the post-processing of the etching object comprising:
injecting a post-processing solution into the container in which the etching object is held, the etching object being photoelectrochemically etched by the photoelectrochemical etching of the etching object, and maintaining a state where the etching object is immersed in the post-processing solution for a predetermined period of time; and
rotating the container to scatter the post-processing solution toward the outer peripheral side, thereby discharging the post-processing solution from the container.
6. The method for manufacturing a structure according to claim 5 , wherein the photoelectrochemical etching of the etching object and the post-processing of the etching object are alternately repeated.
7. The method for manufacturing a structure according to one claim 5 , wherein in the post-processing of the etching object, the etching object is washed.
8. The method for manufacturing a structure according to claim 5 ,
wherein in the photoelectrochemical etching of the etching object, a flat portion and a protruding portion are formed on the surface, the flat portion being newly appeared by etching, and the protruding portion being raised with respect to the flat portion and generated by being less likely to be etched than the flat portion, and
in the post-processing of the etching object, the protruding portion is lowered by etching the protruding portion.
9. The method for manufacturing a structure according to claim 5 ,
wherein in the injection of the post-processing solution into the container and maintenance of a state where the etching object is immersed in the post-processing solution for a predetermined period of time, the container is rotated, thereby generating flow of the post-processing solution.
10. The method for manufacturing a structure according to claim 1 , including post-processing the etching object,
the post-processing of the etching object comprising injecting a post-processing solution into the container in which the etching object is held, the etching object being photoelectrochemically etched by the photoelectrochemical etching of the etching object, and rotating the container to scatter the post-processing solution toward the outer peripheral side, thereby discharging the post-processing solution from the container.
11. The method for manufacturing a structure according to claim 10 , wherein the photoelectrochemical etching of the etching object and the post-processing of the etching object are alternately repeated.
12. A manufacturing device for a structure, comprising:
a rotatably held container in which an etching object at least whose surface is composed of group III nitride is held;
an injection device that injects an alkaline or acidic etching solution into the container, the alkaline or acidic etching solution containing an oxidizing agent that receives electrons;
a light irradiation device that irradiates the surface of the etching object held in the container with light;
a rotation device that rotatably holds the container;
a control device that controls the injection device, the light irradiation device, and the rotation device to perform a photoelectrochemical etching process to the etching object,
the photoelectrochemical etching process to the etching object comprising
a process for injecting the etching solution into the container in which the etching object is held, and immersing the surface in the etching solution,
a process for irradiating the surface of the etching object held in the container with light in a stationary state of the etching object and the etching solution, and
a process for rotating the container to scatter the etching solution toward an outer peripheral side, thereby discharging the etching solution from the container, after the surface is irradiated with the light.
13. The manufacturing device for a structure according to claim 12 , wherein the control device controls the injection device, the light irradiation device, and the rotation device so that the photoelectrochemical etching process to the etching object is performed a plurality of times.
14. The manufacturing device for a structure according to claim 12 , wherein the container is configured so that a distance from the surface of the etching object to a surface of the etching solution is 1 mm or more and 10 mm or less when the container is filled with the etching solution up to a height of a brim of the container.
15. The manufacturing device for a structure according to claim 2 , wherein an inner surface of the container is composed of a surface whose upper side is inclined toward the outer peripheral side.
16. The manufacturing device for a structure according to claim 12 , wherein the container is configured to change a shape of a side surface part of the container so that the etching solution is more likely to be scattered toward the outer peripheral side in a case where the process for discharging the etching solution from the container is performed, compared to a case where the process for irradiating the surface with light is performed.
17. The manufacturing device for a structure according to claim 12 , wherein the control device controls the injection device and the rotation device to perform a post-processing process to the etching object,
the post-processing process to the etching object comprising:
a process for injecting a post-processing solution into the container in which the etching object is held, the etching object being photoelectrochemically etched by the photoelectrochemical etching process of the etching object, and maintaining a state where the etching object is immersed in the post-processing solution for a predetermined period of time, and
a process for rotating the container to scatter the post-processing solution toward the outer peripheral side, thereby discharging the post-processing solution from the container.
18. The manufacturing device for a structure according to claim 17 , wherein the control device controls the injection device, the light irradiation device, and the rotation device so that the photoelectrochemical etching process to the etching object and the post-processing process to the etching object are alternately repeated.
19. The manufacturing device for a structure according to claim 18 , wherein in the process for injecting the post-processing solution into the container and maintaining a state where the etching object is immersed in the post-processing solution for a predetermined period of time, the control device controls the rotation device so that the container is rotated, thereby generating flow of the post-processing solution.
20. The manufacturing device for a structure according to claim 12 , wherein the control device controls the injection device and the rotation device to perform a post-processing process to the etching object, the post-processing process to the etching object comprising injecting a post-processing solution into the container in which the etching object is held, the etching object being photoelectrochemically etched by the photoelectrochemical etching process of the etching object, and rotating the container to scatter the post-processing solution toward the outer peripheral side, thereby discharging the post-processing solution from the container.