Integrated circuit package with integrated waveguide launcher

1. An integrated circuit package comprising:

an encapsulant;

a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;

an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals; and

a land grid array provided on a bottom surface of the package, the land grid array comprising:

a plurality of package terminals, each package terminal configured to be soldered to a connection;

a metal pad substantially surrounded by the plurality of package terminals; and

an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher.

2. The integrated circuit package of claim 1 , comprising a shield arranged to reflect radiation from the waveguide launcher towards the waveguide opening.

3. The integrated circuit package of claim 2 , wherein the shield comprises a layer of silicon, or epoxy, or PCB laminate.

4. The integrated circuit package of claim 2 , wherein the shield is a periodically structured shield, or wherein the shield comprises a back-short.

5. The integrated circuit package of claim 1 , comprising a redistribution layer between the semiconductor die and the land grid array, wherein the waveguide launcher is provided in the redistribution layer.

6. The integrated circuit package of claim 5 , wherein the redistribution layer comprises a single metal layer.

7. The integrated circuit package of claim 2 , comprising a multi-layer laminate between the semiconductor die and the land grid array, wherein the shield is attached by a non-conductive adhesive to the multi-layer laminate.

8. A semiconductor device, comprising:

an integrated circuit comprising:

an encapsulant;

a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;

an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals; and

a land grid array provided on a bottom surface of the package, the land grid array comprising:

a plurality of package terminals, each package terminal configured to be soldered to a connection;

a metal pad substantially surrounded by the plurality of package terminals; and

an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher; and

a printed circuit board, PCB, comprising a waveguide, wherein:

each package terminal is soldered to the PCB; and

the waveguide is aligned with the opening provided in the land grid array.

9. The semiconductor device of claim 8 , wherein the waveguide is a dielectric filled waveguide.

10. The semiconductor device of claim 8 , wherein the shape of the opening is configured to match the waveguide in the PCB.

11. The semiconductor device of any of claim 8 , wherein the PCB comprises a resonant patch antenna configured to match the land grid array to the waveguide.

12. The semiconductor device of claim 8 , further comprising a heat sink, wherein the heat sink is in contact with a top surface of the integrated circuit package.

13. The semiconductor device of claim 8 , further comprising:

an antenna feed network coupled to the PCB; and

an antenna array coupled to the antenna feed network.

14. An integrated circuit package comprising:

an encapsulant;

a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;

an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals; and

a land grid array provided on a bottom surface of the package, the land grid array comprising:

a plurality of package terminals, each package terminal configured to be soldered to a connection;

a metal pad substantially surrounded by the plurality of package terminals; and

an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher.

15. The integrated circuit package of claim 14 , comprising a shield arranged to reflect radiation from the waveguide launcher towards the waveguide opening.

16. The integrated circuit package of claim 15 , wherein the shield comprises a layer of silicon, or epoxy, or PCB laminate.

17. The integrated circuit package of claim 14 , comprising a redistribution layer between the semiconductor die and the land grid array, wherein the waveguide launcher is provided in the redistribution layer.