Copper-clad laminate and method of forming the same
The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.
1. A copper-clad laminate comprising:
a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material,
wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.
2. The copper-clad laminate of claim 1 , wherein the fluoropolymer based adhesive layer has an average thickness of at least about 0.2 microns and not greater than about 7 microns.
3. The copper-clad laminate of claim 1 , wherein the fluoropolymer based adhesive layer is a perfluoroalkoxy polymer resin layer.
4. The copper-clad laminate of claim 1 , wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the first filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.
5. The copper-clad laminate of claim 1 , wherein the first filler material comprises a silica based compound.
6. The copper-clad laminate of claim 1 , wherein the first filler material comprises silica.
7. The copper-clad laminate of claim 1 , wherein the resin matrix comprises a perfluoropolymer.
8. The copper-clad laminate of claim 1 , wherein the content of the resin matrix component is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating.
9. The copper-clad laminate of claim 7 , wherein the content of the perfluoropolymer is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating.
10. The copper-clad laminate of claim 1 , wherein the content of the ceramic filler component is at least about 30 vol. % and not greater than about 57 vol. % for a total volume of the dielectric coating.
11. The copper-clad laminate of claim 1 , wherein the content of the first filler material is at least about 80 vol. % and not greater than about 100 vol. % for a total volume of the ceramic filler component.
12. The copper-clad laminate of claim 1 , wherein the dielectric coating comprises a dissipation factor (5 GHZ, 20% RH) of not greater than about 0.005.
13. A printed circuit board comprising a copper-clad laminate, wherein the copper-clad laminate comprises:
a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer, wherein the dielectric coating comprises:
a resin matrix component; and
a ceramic filler component,
wherein the ceramic filler component comprises a first filler material,
wherein the dielectric coating has an average thickness of not greater than 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.
14. The printed circuit board of claim 13 , wherein the fluoropolymer based adhesive layer is a perfluoroalkoxy polymer resin layer.
15. The printed circuit board of claim 13 , wherein the first filler material comprises a particle size distribution span (PSDS) of not greater than about 5, where PSDS is equal to (D 90 −D 10 )/D 50 , where D 90 is equal to a D 90 particle size distribution measurement of the first filler material, D 10 is equal to a D 10 particle size distribution measurement of the first filler material, and D 50 is equal to a D 50 particle size distribution measurement of the first filler material.
16. The printed circuit board of claim 13 , wherein the first filler material comprises a silica based compound.
17. The printed circuit board of claim 13 , wherein the first filler material comprises silica.
18. The printed circuit board of claim 13 , wherein the resin matrix comprises a perfluoropolymer.
19. The printed circuit board of claim 13 , wherein the content of the resin matrix component is at least about 50 vol. % and not greater than about 63 vol. % for a total volume of the dielectric coating.
20. A method of forming a copper-clad laminate, wherein the method comprises:
providing a copper foil layer,
applying a fluoropolymer based adhesive layer overlying the copper foil layer,
combining a resin matrix precursor component and a ceramic filler precursor component to form a forming mixture,
forming the forming mixture into a dielectric coating overlying the fluoropolymer based adhesive layer,
wherein the dielectric coating has an average thickness of not greater than about 20 microns, and
wherein the copper-clad laminate comprises a peel strength between the copper foil layer and the dielectric coating of at least about 6 lb/in.