Semiconductor structure
Embodiments of the present disclosure provide a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a base; bit lines, located on the base, and a material of the bit line including a metal semiconductor compound; semiconductor channels, each including a first doped region, a channel region and a second doped region arranged in sequence, and the first doped region being in contact with the bit line; a first dielectric layer, covering sidewall surfaces of the first doped regions, and a first interval being provided between parts of the first dielectric layer covering sidewalls of adjacent first doped regions on a same bit line; an insulating layer, covering sidewall surfaces of the channel regions; word lines, covering a sidewall surface of the insulating layer away from the channel regions, and a second interval being provided between adjacent word lines.
1. A semiconductor structure, comprising:
a base;
bit lines, located on the base, and a material of the bit line comprising a metal semiconductor compound;
semiconductor channels, located on surfaces of the bit lines, along a direction that the base points to the bit line, the semiconductor channel comprising a first doped region, a channel region and a second doped region arranged in sequence, and the first doped region being in contact with the bit line;
a first dielectric layer, covering sidewall surfaces of the first doped regions, and a first interval being provided between parts of the first dielectric layer covering sidewalls of adjacent first doped regions on a same bit line;
an insulating layer, covering sidewall surfaces of the channel regions;
word lines, covering a sidewall surface of the insulating layer away from the channel regions, and a second interval being provided between adjacent word lines;
a second dielectric layer, covering sidewall surfaces of the second doped regions, and a third interval being provided between parts of the second dielectric layer located on sidewalls of adjacent second doped regions; and
a third dielectric layer, located in the first intervals, the second intervals and the third intervals.
2. The semiconductor structure according to claim 1 , further comprising: a metal contact layer, located on top surfaces of the second doped regions away from the base, and the metal semiconductor compound and the metal contact layer comprising a same metal element.
3. The semiconductor structure according to claim 2 , wherein an orthographic projection of a part of the metal contact layer on the base covers an orthographic projection of the second doped region on the base.
4. The semiconductor structure according to claim 2 , further comprising: a transition layer, located between the second doped regions and the metal contact layer, and the metal contact layer wrapping the transition layer, the transition layer and the second doped region being doped with a same type of a doped ion, a doping concentration of the doped ion in the transition layer being greater than a doping concentration of the doped ion in the second doped region, and the doped ion being one of N-type ion or P-type ion.
5. The semiconductor structure according to claim 1 , wherein the base, the bit line and the semiconductor channel comprise a same semiconductor element.
6. The semiconductor structure according to claim 1 , wherein the first doped region, the channel region and the second doped region are doped with a same type of a doped ion, a doping concentration of the doped ion in the first doped region is the same as a doping concentration of the doped ion in the channel region and a doping concentration of the doped ion in the second doped region, and the doped ion is one of N-type ion or P-type ion.
7. The semiconductor structure according to claim 1 , wherein an orthographic projection of the channel region on the base is smaller than an orthographic projection of the second doped region on the base, and is smaller than an orthographic projection of the first doped region on the base.
8. The semiconductor structure according to claim 1 , wherein the insulating layer and the second dielectric layer are a same film structure.
9. The semiconductor structure according to claim 1 , wherein an orthographic projection of a periphery of the insulating layer on the base is smaller than an orthographic projection of a periphery of the second dielectric layer on the base.
10. The semiconductor structure according to claim 1 , wherein the first dielectric layer comprises a fourth dielectric layer and a fifth dielectric layer; the fourth dielectric layer is located in intervals between adjacent bit lines, and is located in intervals between adjacent first doped regions on adjacent bit lines; and the fifth dielectric layer is located on the sidewalls of the adjacent first doped regions on the same bit line and a sidewall of the fourth dielectric layer.
11. The semiconductor structure according to claim 1 , wherein a part of the third dielectric layer located in the second intervals comprises voids.