IP Library Granted Patent US 12,299,243
Granted Patent B2
US 12,299,243 · App. 17/651,882 · Granted May 13, 2025

Method and device for improved accuracy of proximity and touch detection in mobile devices

Inventors: Chaouki Rouaissia (Neuchatel, CH); Jerald G. Ott, III (Escondido, CA)
Assignee: Semtech Corporation
G06F3/0443G06F3/04182H03K17/955H04M1/0266G06F2203/04101G06F2203/04103G06F2203/04107G06F2203/04108H03K2217/94015H03K2217/94031H03K2217/960705
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Quick Facts
Patent No.
US 12,299,243
App. No.
17/651,882
Granted
May 13, 2025
Kind
B2
Abstract

A mobile device has a proximity sensor. A compensation value of the proximity sensor is determined. The compensation value is compared to a reference compensation value to determine validity of the compensation value. A capacitance of the proximity sensor is measured. A value of the capacitance of the proximity sensor is adjusted based on the compensation value. A coefficient defining a relationship between a capacitance of the proximity sensor and a temperature of the mobile device is calculated. A temperature sensor is coupled to the proximity sensor. The temperature of the mobile device is measured. A value of the capacitance of the proximity sensor is adjusted based on the coefficient and the temperature of the mobile device. The adjusted capacitance value is compared to a threshold capacitance value to determine proximity of an object to the mobile device. A radio frequency signal is adjusted by detecting proximity.

Claims (43)

1. A method of making a semiconductor device, comprising:

providing a sensor controller including,

a capacitive sensor input,

a reference sensor input, and

a digital processor configured to communicate with the capacitive sensor input and reference sensor input;

determining a temperature compensation parameter setting for the semiconductor device based on observed readings from the reference sensor input at a plurality of environmental temperatures, wherein the temperature compensation parameter setting defines a relationship between readings of the capacitive sensor input and readings of the reference sensor input;

using the temperature compensation parameter setting and a reading of the reference sensor input to produce an adjusted reference sensor reading by multiplying the reading of the reference sensor input and the temperature compensation parameter setting; and

adjusting a reading of the capacitive sensor input by subtracting the adjusted reference sensor reading from the reading of the capacitive sensor input.

2. The method of claim 1 , further including storing the parameter setting in a non-volatile memory of the sensor controller.

3. The method of claim 1 , wherein the parameter setting controls a gain of the reference sensor input.

4. The method of claim 1 , further including determining the parameter setting for the semiconductor device during manufacturing.

5. A method of making a semiconductor device, comprising:

providing a sensor controller including a capacitive sensor input and a reference sensor input;

determining a parameter setting for the semiconductor device from observed readings of the reference sensor input at a plurality of environmental temperatures based on a relationship between the reference sensor input and the capacitive sensor input;

using the parameter setting and a reading of the reference sensor input to produce an adjusted reference sensor reading; and

adjusting a reading of the capacitive sensor input using the adjusted reference sensor reading.

6. The method of claim 5 , further including storing the parameter setting in a memory element of the sensor controller.

7. The method of claim 5 , wherein the adjusted reference sensor reading is determined by multiplying the reading of the reference sensor input and the parameter setting.

8. The method of claim 7 , wherein adjusting the reading of the capacitor sensor input includes subtracting the adjusted reference sensor reading from the reading of the capacitor sensor input.

9. The method of claim 5 , wherein the parameter setting controls a gain of the reference sensor input.

10. The method of claim 5 , further including determining the parameter setting for the semiconductor device during manufacturing.

11. The method of claim 5 , further including configuring the sensor controller to adjust the reference sensor input based on the parameter setting.

12. A method of making a semiconductor device, comprising:

providing a main sensor input;

providing a reference sensor input;

determining a parameter setting for the semiconductor device from observed readings of the reference sensor input at a plurality of environmental temperatures based on a relationship between the reference sensor input and the main sensor input;

using the parameter setting to produce an adjusted reference sensor reading; and

adjusting a reading of the main sensor input using the adjusted reference sensor reading.

13. The method of claim 12 , wherein the adjusted reference sensor reading is determined by multiplying the reading of the reference sensor input and the parameter setting.

14. The method of claim 13 , wherein adjusting the reading of the main sensor input includes subtracting the adjusted reference sensor reading from the reading of the main sensor input.

15. The method of claim 13 , wherein the sensor controller is programmed to adjust the reading of the main sensor input by subtracting the adjusted reference sensor reading from the reading of the main sensor input.

16. The method of claim 12 , wherein the parameter setting controls a gain of the reference sensor input.

17. The method of claim 12 , further including determining the parameter setting for the semiconductor device during manufacturing.

18. The method of claim 12 , further including configuring the sensor controller to adjust the reference sensor input based on the parameter setting.

19. A semiconductor device, comprising:

a main sensor input;

a reference sensor input; and

a parameter setting from observed readings of the reference sensor input at a plurality of environmental temperatures defining a relationship between the reference sensor input and the main sensor input; and

a sensor controller programmed to produce an adjusted reference sensor reading using the parameter setting and further to adjust a reading of the main sensor input using the adjusted reference sensor reading.

20. The semiconductor device of claim 19 , wherein the sensor controller is programmed to produce the adjusted reference sensor reading by multiplying the reading of the reference sensor input and the parameter setting.

21. The semiconductor device of claim 20 , wherein the sensor controller is configured to adjust the reference sensor input based on the parameter setting.

22. The semiconductor device of claim 19 , wherein the parameter setting controls a gain of the reference sensor input.

23. The semiconductor device of claim 19 , wherein the parameter setting is stored in non-volatile memory of the semiconductor device.

Assignments (2)
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Jan 12, 2023
From: SEMTECH CORPORATION; TRIUNE SYSTEMS, L.L.C.; TRIUNE IP, LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 062389/0057 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2022
From: ROUAISSIA, CHAOUKI; OTT, JERALD G, III
To: SEMTECH CORPORATION
Reel/Frame 059065/0281 →
Continuity (6)
Continuation 17091946 · Nov 6, 2020
Continuation 16523149 · Jul 26, 2019
Continuation 16388668 · Apr 18, 2019
Continuation 15402642 · Jan 10, 2017
Continuation 14530112 · Oct 31, 2014
Related Publication 20220179517A1 · Jun 9, 2022
References Cited (35)
US 4799042A · Confalonieri et al. · 1989 [cited by applicant]
US 6560471B1 · Heller et al. · 2003 [cited by applicant]
US 8775103B1 · Jayaraj et al. · 2014 [cited by applicant]
US 20070032967A1 · Feen et al. · 2007 [cited by applicant]
US 20070229294A1 · Vossmeyer et al. · 2007 [cited by applicant]
US 20080047764A1 · Lee et al. · 2008 [cited by applicant]
US 20080158184A1 · Land · 2008 [cited by examiner]
US 20080300810A1 · Seesink · 2008 [cited by examiner]
US 20090015268A1 · Gardner et al. · 2009 [cited by applicant]
US 20090260898A1 · Jin et al. · 2009 [cited by applicant]
US 20100060590A1 · Wilson et al. · 2010 [cited by applicant]
US 20100214253A1 · Wu · 2010 [cited by examiner]
US 20100225332A1 · Niwa et al. · 2010 [cited by applicant]
US 20100259284A1 · Winkens · 2010 [cited by applicant]
US 20100317302A1 · Greenwood et al. · 2010 [cited by applicant]
US 20110073384A1 · Osoinach et al. · 2011 [cited by applicant]
US 20110267296A1 · Noguchi et al. · 2011 [cited by applicant]
US 20120026123A1 · Grunthaner et al. · 2012 [cited by applicant]
US 20120037485A1 · Sitarski · 2012 [cited by applicant]
US 20130207677A1 · Togura · 2013 [cited by applicant]
US 20130328822A1 · Luo et al. · 2013 [cited by applicant]
US 20140021331A1 · Chang · 2014 [cited by applicant]
US 20140066124A1 · Novet · 2014 [cited by applicant]
US 20140278185A1 · Landmann · 2014 [cited by examiner]
US 20140320447A1 · Kung · 2014 [cited by examiner]
US 20140354592A1 · Kang et al. · 2014 [cited by applicant]
US 20150149121A1 · Ahmed · 2015 [cited by applicant]
US 20160092029A1 · Kim et al. · 2016 [cited by applicant]
EP 2241868A2 · 2010 [cited by applicant]
EP 2429078A1 · 2012 [cited by applicant]
Wikipedia, “Processor Register”, Sep. 29, 2014, pp. 1-6, XP055887603, Retrieved from the Internet URL: https://en.wikipedia.org/w/index.php?title=Processor_register&oldid=627601597, [retrieved on Feb. 4, 2022]. [cited by applicant]
Analog Devices, Inc., “24-Bit Capacitance-to-Digital Converter with Temperature Sensor”, pp. 1-28, Jan. 2007. [cited by applicant]
Cypress Semiconductor, “PSoC 4 Capsense Design Guide”, pp. 1-101, Apr. 19, 2013. [cited by applicant]
Semtech Corporation, “Wireless & Sensing, SX9300, Ultra Low Power, Dual Channel Smart Proximity SAR Compliant Solution”, Rev. 4, pp. 1-39, Feb. 5, 2014. [cited by applicant]
ARM Limited, ARM968E-S, Technical Reference Manual, published Nov. 8, 2006. [cited by applicant]