Multi-die integrated circuit with data processing engine array

1. A multi-die integrated circuit, comprising:

an interposer;

a first die coupled to the interposer, wherein the first die includes a first data processing engine (DPE) array;

wherein the first DPE array includes a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs therein;

a second die coupled to the interposer, wherein the second die includes a second DPE array;

wherein the second DPE array includes a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs therein; and

a third die coupled to the interposer and having a plurality of die interfaces;

wherein the first DPE interface of the first die is configured to communicate with a first die interface of the plurality of die interfaces via the interposer; and

wherein the second DPE interface of the second die is configured to communicate with a second die interface of the plurality of die interfaces via the interposer.

2. The multi-die integrated circuit of claim 1 , wherein:

the first DPE interface includes a first logical interface and a first physical interface; and

the second DPE interface includes a second logical interface and a second physical interface.

3. The multi-die integrated circuit of claim 2 , wherein:

wherein the first logical interface of the first DPE interface includes a plurality of tiles, wherein each tile includes a stream switch configured to communicate with a subset of the first plurality of DPEs and stream switches of adjacent tiles of the first DPE interface.

4. The multi-die integrated circuit of claim 3 , wherein:

the first physical interface of the first DPE interface includes a plurality of circuit blocks coupled to the plurality of tiles of the first logical interface and each circuit block of the plurality of circuit blocks of the first physical interface couples to the first die interface of the plurality of die interfaces via the interposer.

5. The multi-die integrated circuit of claim 4 , wherein the plurality of circuit blocks of the first physical interface include at least a first circuit block implementing one or more parallel, multi-bit channels and a second circuit block implementing a transceiver configured for serial operation.

6. The multi-die integrated circuit of claim 4 , wherein at least one of the plurality of circuit blocks of the first physical interface implements a parallel, multi-bit channel.

7. The multi-die integrated circuit of claim 4 , wherein at least one of the plurality of circuit blocks of the first physical interface implements a high bandwidth memory interface.

8. The multi-die integrated circuit of claim 4 , wherein at least one of the plurality of circuit blocks of the first physical interface includes a transceiver configured for serial operation.

9. The multi-die integrated circuit of claim 4 , wherein:

wherein the second logical interface of the second DPE interface includes a plurality of tiles, wherein each tile of the second logical interface includes a stream switch configured to communicate with a subset of the second plurality of DPEs and stream switches of adjacent tiles of the second DPE interface.

10. The multi-die integrated circuit of claim 9 , wherein:

the second physical interface of the second DPE interface includes a plurality of circuit blocks coupled to the plurality of tiles of the second logical interface and each circuit block of the plurality of circuit blocks of the second physical interface couples to the second die interface of the plurality of die interfaces via the interposer.

11. The multi-die integrated circuit of claim 1 , wherein:

two or more of the first die, the second die, or the third die are in different clock domains; or

two or more of the first die, the second die, or the third die are in different power domains; or

two or more of the first die, the second die, or the third die are implemented using different process technologies.

12. A multi-die integrated circuit, comprising:

a package substrate;

one or more interconnect bridge dies coupled to the package substrate;

a first die coupled to the package substrate and the one or more interconnect bridge dies, wherein the first die includes a first data processing engine (DPE) array;

wherein the first DPE array includes a first plurality of DPEs and a first DPE interface coupled to the first plurality of DPEs therein;

a second die coupled to the package substrate and the one or more interconnect bridge dies, wherein the second die includes a second DPE array;

wherein the second DPE array includes a second plurality of DPEs and a second DPE interface coupled to the second plurality of DPEs therein; and

a third die coupled to the substrate and the one or more interconnect bridge dies, wherein the third die includes a plurality of die interfaces;

wherein the first DPE interface of the first die is configured to communicate with a first die interface of the plurality of die interfaces via the one or more interconnect bridge dies; and

wherein the second DPE interface of the second die is configured to communicate with a second die interface of the plurality of die interfaces via the one or more interconnect bridge dies.

13. The multi-die integrated circuit of claim 12 , wherein:

the first DPE interface includes a first logical interface and a first physical interface; and

the second DPE interface includes a second logical interface and a second physical interface.

14. The multi-die integrated circuit of claim 13 , wherein:

wherein the first logical interface of the first DPE interface includes a plurality of tiles, wherein each tile includes a stream switch configured to communicate with a subset of the first plurality of DPEs and stream switches of adjacent tiles of the first DPE interface.

15. The multi-die integrated circuit of claim 14 , wherein:

the first physical interface of the first DPE interface includes a plurality of circuit blocks coupled to the plurality of tiles of the first logical interface and each circuit block of the plurality of circuit blocks of the first physical interface couples to the first die interface of the plurality of die interfaces via the one or more interconnect bridge dies.

16. The multi-die integrated circuit of claim 15 , wherein the plurality of circuit blocks of the first physical interface include at least a first circuit block implementing one or more parallel, multi-bit channels and a second circuit block implementing a transceiver configured for serial operation.

17. The multi-die integrated circuit of claim 15 , wherein at least one of the plurality of circuit blocks of the first physical interface implements a parallel, multi-bit channel.

18. The multi-die integrated circuit of claim 15 , wherein at least one of the plurality of circuit blocks of the first physical interface implements a high bandwidth memory interface.

19. The multi-die integrated circuit of claim 15 , wherein at least one of the plurality of circuit blocks of the first physical interface includes a transceiver configured for serial operation.

20. The multi-die integrated circuit of claim 12 , wherein:

two or more of the first die, the second die, or the third die are in different clock domains; or

two or more of the first die, the second die, or the third die are in different power domains; or

two or more of the first die, the second die, or the third die are implemented using different process technologies.