IP Library › Granted Patent US 12,341,475
Granted Patent B2
US 12,341,475 · App. 17/655,061 · Granted Jun 24, 2025

Semiconductor device

Inventor: Taizo Tatsumi (Osaka, JP)
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
H03F1/26H03F1/56H03F3/195H03F3/245H03F2200/294H03F2200/451
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Quick Facts
Patent No.
US 12,341,475
App. No.
17/655,061
Granted
Jun 24, 2025
Kind
B2
Abstract

A semiconductor device includes input and output terminals, first and second power supply terminals, first and second transistors, and a first resistance element. In the first transistor, gate and source terminals are respectively connected to the input terminal and the first power supply terminal, a drain terminal is connected to the second power supply terminal in direct current and to the output terminal, and the gate and drain terminals are connected via the first resistance element. In the second transistor, a source terminal is connected to the first power supply terminal, and gate and drain terminals are short-circuited at a node connected to the gate terminal of the first transistor in direct current. In a lower frequency region, an impedance of the first resistance element is lower than impedances of parasitic capacitances in the first transistor between the gate and drain terminals and between the gate and source terminals.

Claims (22)

1. A semiconductor device comprising:

an input terminal to which a radio-frequency signal is to be input;

an output terminal from which a signal obtained by amplifying the radio-frequency signal is to be output;

a first power supply terminal;

a first transistor having a gate terminal, a source terminal, and a drain terminal;

a second transistor having a gate terminal, a source terminal, and a drain terminal;

a second power supply terminal; and

a first resistance element,

a first coil; and

a second coil, wherein

the gate terminal of the first transistor is connected to the input terminal,

the source terminal of the first transistor is connected to the first power supply terminal,

the drain terminal of the first transistor is connected to the second power supply terminal via the first coil,

the drain terminal of the first transistor is further connected to the output terminal,

the gate terminal of the first transistor and the drain terminal of the first transistor are connected to each other via the first resistance element,

the source terminal of the second transistor is connected to the first power supply terminal,

the gate terminal of the second transistor and the drain terminal of the second transistor are short-circuited at a first node, the first node being connected to the gate terminal of the first transistor via the second coil, and

in a low-frequency region lower than a frequency band of the radio-frequency signal,

an impedance of the first resistance element is lower than an impedance of a parasitic capacitance between the gate terminal of the first transistor and the drain terminal of the first transistor, and is lower than an impedance of a parasitic capacitance between the gate terminal of the first transistor and the source terminal of the first transistor.

2. The semiconductor device according to claim 1 , wherein in the frequency band of the radio-frequency signal, the impedance of the first resistance element is higher than the impedance of the parasitic capacitance between the gate terminal of the first transistor and the drain terminal of the first transistor.

3. The semiconductor device according to claim 1 , further comprising a second resistance element connected between the source terminal of the second transistor and the first power supply terminal.

4. The semiconductor device according to claim 1 , wherein the first transistor and the second transistor are formed on a semiconductor substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2022
From: TATSUMI, TAIZO
To: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 059281/0544 →
Priority Claims (1)
JP 2021-069880 · Apr 16, 2021 · national
Continuity (1)
Related Publication 20220337197A1 · Oct 20, 2022
References Cited (2)
US 10158327B2 · Kim · 2018 [cited by applicant]
US 20160094184A1 · Ripley · 2016 [cited by examiner]