Integrate rinse module in hybrid bonding platform
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
1. An apparatus configured to pre-bond a package component, the apparatus comprising:
a pre-bonding system comprising:
a plasma treatment chamber configured to perform a plasma cleaning process on the package component;
an integrated cleaning station comprising:
a chamber;
a plurality of storages outside of the chamber;
a nozzle in the chamber and connected to the plurality of storages; and
a retractable wafer support configured to hold the package component thereon; and
a first transferring tool configured to transfer the package component from the plasma treatment chamber to the integrated cleaning station.
2. The apparatus of claim 1 further comprising:
an alignment and pre-bonding station connected to the integrated cleaning station, wherein the alignment and the pre-bonding station is configured to align and bond the package component with an additional package component.
3. The apparatus of claim 2 further comprising a second transferring tool configured to transfer the package component from the integrated cleaning station to the alignment and the pre-bonding station.
4. The apparatus of claim 1 further comprising:
a loading station configured to load the package component into the pre-bonding system; and
an unloading station configured to unload the package component out of the pre-bonding system.
5. The apparatus of claim 1 , wherein the retractable wafer support is configured to support the package component at different heights, and rotate the package component at the different heights.
6. The apparatus of claim 5 , wherein the integrated cleaning station further comprises:
a first container; and
a second container in the first container, wherein the retractable wafer support is in the second container, and is configured to rotate the package component at a first level lower than a first top end of the first container and higher than a second top end of the second container.
7. The apparatus of claim 6 , wherein the retractable wafer support is further configured to rotate the package component at a second level lower than the second top end of the second container.
8. The apparatus of claim 6 , wherein the retractable wafer support is further configured to rotate the package component at a second level higher than the first top end of the first container.
9. The apparatus of claim 6 further comprising a first outlet and a second outlet connecting bottoms of the first container and the second container, respectively, out of the chamber.
10. The apparatus of claim 1 further comprising an air outlet in the retractable wafer support, wherein the integrated cleaning station is configured to blow air out of the air outlet toward a back surface of the package component.
11. An apparatus configured for cleaning a wafer, the apparatus comprising:
an integrated cleaning station comprising:
a chamber;
a first container; and
a second container in the first container, wherein a first top edge of the first container is higher than a second top edge of the second container; and
a retractable wafer support in the chamber, wherein the retractable wafer support comprises a portion inside the second container, and wherein the retractable wafer support is configured to:
rotate the wafer with the wafer being at a first level lower than the second top edge; and
rotate the wafer with the wafer being at a second level higher than the second top edge and lower than the first top edge.
12. The apparatus of claim 11 , wherein the retractable wafer support is further configured to rotate the wafer with the wafer being at a third level higher than the first top edge.
13. The apparatus of claim 11 further comprising a nozzle in the chamber, wherein the integrated cleaning station is configured to dispense a chemical on the wafer through the nozzle at a time the wafer is rotated by the retractable wafer support.
14. The apparatus of claim 11 further comprising:
a first outlet connecting a first bottom of the first container out of the chamber; and
a second outlet connecting a second bottom of the second container out of the chamber.
15. The apparatus of claim 14 further comprising:
a third container, with the first container and the second container in the third container; and
a third outlet connecting a third bottom end of the third container out of the chamber.
16. An apparatus configured for cleaning a wafer, the apparatus comprising:
a chamber;
a first container comprising a first sidewall having a first height;
a second container in the first container, wherein the second container comprises a second sidewall having a second height lower than the first height;
a third container in the second container, wherein the third container comprises a third sidewall having a third height lower than the second height; and
a retractable wafer support in the chamber and having a top end, wherein the retractable wafer support is configured to have the top end adjusted to a plurality of levels, and is configured rotate when its top end is at each of the plurality of levels.
17. The apparatus of claim 16 , wherein the retractable wafer support comprises air outlets at a position lower than the top end of the retractable wafer support.
18. The apparatus of claim 16 , wherein the first container, the second container, and the third container comprise outlets leading out of the chamber.
19. The apparatus of claim 18 , wherein each of the first container, the second container, and the third container comprises an outlet leading out of the chamber.
20. The apparatus of claim 16 , wherein the chamber is sealable.