Integrated high voltage capacitor
A semiconductor device comprises a semiconductor die and an integrated capacitor formed over the semiconductor die. The integrated capacitor is configured to receive a high voltage signal. A transimpedance amplifier is formed in the semiconductor die. An avalanche photodiode is disposed over or adjacent to the semiconductor die. The integrated capacitor is coupled between the avalanche photodiode and a ground node. A resistor is coupled between a high voltage input and the avalanche photodiode. The resistor is an integrated passive device (IPD) formed over the semiconductor die. A first terminal of the integrated capacitor is coupled to a ground voltage node. A second terminal of the integrated capacitor is coupled to a voltage greater than 20 volts. The integrated capacitor comprises a plurality of interdigitated fingers in one embodiment. In another embodiment, the integrated capacitor comprises a plurality of vertically aligned plates.
1. A method of making a transimpedance amplifier device, comprising:
providing a semiconductor;
forming a high voltage integrated capacitor over the semiconductor, wherein the high voltage integrated capacitor includes a plurality of interdigitated fingers with a finger spacing of 0.3 μm or greater between individual fingers of the plurality of interdigitated fingers; and
forming an integrated resistor over the semiconductor, wherein the integrated resistor and the high voltage integrated capacitor form a radio frequency (RF) filter on the semiconductor along with a transimpedance amplifier.
2. The method of claim 1 , further including coupling the high voltage integrated capacitor to receive a high voltage signal through the integrated resistor.
3. The method of claim 2 , wherein the high voltage signal is between 60 and 90 volts.
4. The method of claim 1 , wherein the plurality of interdigitated fingers are vertically aligned with each other by common polarity.
5. The method of claim 1 , further including disposing an avalanche photodiode (APD) over the transimpedance amplifier device.
6. The method of claim 5 , further including:
coupling a cathode of the APD to a circuit node between the high voltage integrated capacitor and the integrated resistor; and
coupling an anode of the APD to the transimpedance amplifier.
7. A method of making a transimpedance amplifier device, comprising:
providing a semiconductor substrate;
forming an integrated capacitor over the semiconductor substrate; and
forming an integrated resistor over the semiconductor substrate, wherein the integrated resistor and the integrated capacitor form a radio frequency (RF) filter on the semiconductor substrate along with a transimpedance amplifier.
8. The method of claim 7 , further including coupling the integrated capacitor to receive a high voltage signal through the integrated resistor.
9. The method of claim 8 , wherein the high voltage signal is 35 volts or greater.
10. The method of claim 7 , further including disposing an avalanche photodiode (APD) over the transimpedance amplifier device.
11. The method of claim 10 , further including:
coupling a cathode of the APD to a circuit node between the integrated capacitor and the integrated resistor; and
coupling an anode of the APD to the transimpedance amplifier.
12. The method of claim 10 , further including:
disposing the transimpedance amplifier device into a can-shaped package; and
disposing a lens in an opening of the can-shaped package, wherein the can-shaped package is adapted to guide a fiber-optic signal through the lens and onto the APD.
13. The method of claim 7 , wherein the integrated capacitor includes a first terminal that is electrically isolated from all components formed in the semiconductor substrate.
14. A transimpedance amplifier device, comprising:
a semiconductor substrate;
an integrated capacitor formed over the semiconductor substrate; and
an integrated resistor formed over the semiconductor substrate, wherein the integrated resistor and the integrated capacitor form a radio frequency (RF) filter on the semiconductor substrate along with a transimpedance amplifier.
15. The transimpedance amplifier device of claim 14 , wherein the integrated capacitor is coupled to a high voltage power input circuit node through the integrated resistor.
16. The transimpedance amplifier device of claim 15 , wherein the high voltage power input circuit node is configured to receive a voltage greater than or equal to 35 volts.
17. The transimpedance amplifier device of claim 14 , further including an avalanche photodiode (APD) disposed over the semiconductor substrate.
18. The transimpedance amplifier device of claim 17 , wherein a cathode of the APD is coupled to a circuit node between the integrated capacitor and the integrated resistor and an anode of the APD is coupled to the transimpedance amplifier.
19. The transimpedance amplifier device of claim 17 , further including a conductive epoxy or solder disposed between the semiconductor substrate and avalanche photodiode.
20. The transimpedance amplifier device of claim 17 , further including:
a can-shaped package with the semiconductor substrate disposed in the can-shaped package; and
a lens disposed in an opening of the can-shaped package, wherein the can-shaped package is adapted to guide a fiber-optic signal through the lens and onto the APD.
21. A transimpedance amplifier semiconductor die, comprising:
a transimpedance amplifier;
an integrated capacitor; and
an integrated resistor, wherein the integrated resistor and the integrated capacitor form a radio frequency (RF) filter on the transimpedance amplifier semiconductor die.
22. The transimpedance amplifier die of claim 21 , wherein the integrated capacitor is coupled to a high voltage power input circuit node through the integrated resistor.
23. The transimpedance amplifier die of claim 22 , wherein the high voltage power input circuit node is configured to receive a voltage greater than or equal to 35 volts.
24. The transimpedance amplifier die of claim 21 , further including an avalanche photodiode (APD) disposed over the transimpedance amplifier semiconductor die.
25. The transimpedance amplifier die of claim 24 , wherein a cathode of the APD is coupled to a circuit node between the integrated capacitor and the integrated resistor and an anode of the APD is coupled to the transimpedance amplifier.
26. The transimpedance amplifier die of claim 24 , further including a conductive epoxy or solder disposed between the transimpedance amplifier semiconductor die and avalanche photodiode.
27. The transimpedance amplifier die of claim 24 , further including:
a can-shaped package with the transimpedance amplifier semiconductor die disposed in the can-shaped package; and
a lens disposed in an opening of the can-shaped package, wherein the can-shaped package is adapted to guide a fiber-optic signal through the lens and onto the APD.