Multi-array parallel optical links
An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.
1. An optical interconnect, comprising:
a first IC chip having a first plurality of sub-arrays of optoelectronic elements;
a second IC chip having a second plurality of sub-arrays of optoelectronic elements; and
a fiber bundle including a plurality of fiber sub-bundles, each of the fiber sub-bundles comprised of a plurality of fibers, each of the plurality of fibers including a core concentrically surrounded by cladding, with optoelectronic elements of different ones of the first plurality of sub-arrays of optoelectronic elements optically coupled to optoelectronic elements of different ones of the second plurality of sub-arrays of optoelectronic elements by the plurality of fibers of different ones of the fiber sub-bundles;
with the plurality of fibers of each fiber sub-bundle arranged on a grid;
wherein the optical interconnect further comprises a first substrate with a plurality of apertures and a second substrate with a plurality of apertures, each of the plurality of apertures of the first substrate holding first ends of corresponding ones of the fiber sub-bundles and each of the plurality of apertures of the second substrate holding second ends of the corresponding one of the fiber sub-bundles.
2. The optical interconnect of claim 1 , wherein each fiber sub-bundle comprises an inner region containing the plurality of fibers and an outer region, the outer region having dimensions that are independent of variations in size and position of the plurality of fibers of the fiber sub-bundle.
3. The optical interconnect of claim 1 , wherein the apertures are rotationally asymmetric.
4. The optical interconnect of claim 1 , further comprising filler material between the plurality of fibers of each fiber sub-bundle.
5. The optical interconnect of claim 1 , wherein the grid is a hexagonal close packed grid.
6. The optical interconnect of claim 1 , wherein the grid is a square grid.
7. The optical interconnect of claim 1 , wherein the optoelectronic elements comprise microLEDs and/or photodetectors.
8. The optical interconnect of claim 1 , wherein each of the plurality of fiber sub-bundles are accurately positioned relative to each other only near the first ends and the second ends.
9. The optical interconnect of claim 1 , wherein the fiber bundle includes at least one fiducial feature.