Continuous interconnects between heterogeneous materials
A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
1. A deformable electronic device, comprising:
a first substrate portion comprising a metal clad layer;
at least one surface mount component mounted to the first substrate portion and electrically coupled with the metal clad layer;
a second substrate portion, attached to the first substrate portion, including at least one trace formed thereon with conductive gel; and
a via, comprised of conductive gel, extending between and electrically coupling the metal clad layer with the trace.
2. The deformable electronic device of claim 1 , wherein the first substrate comprises a thermoset epoxy-based film.
3. The deformable electronic device of claim 1 , wherein the metal clad layer is comprised of copper.
4. The deformable electronic device of claim 1 , wherein the first substrate comprises a thermoplastic polyurethane (TPU).
5. The deformable electronic device of claim 1 , wherein the first substrate comprises a silicone.
6. The deformable electronic device of claim 1 , wherein the first substrate portion is bonded to the second substrate portion.
7. The deformable electronic device of claim 1 , wherein the second substrate forms a stencil to at least in part form the trace.
8. The deformable electronic device of claim 1 , further comprising an encapsulant configured to enclose the conductive gel with the second substrate.
9. The deformable electronic device of claim 1 , wherein at least one of the trace or the metal clad layer is configured to electrically couple with an external apparatus.
10. The deformable electronic device of claim 9 , wherein the surface mount component is one of a passive or an active component.
11. A method of making a deformable electronic device, comprising:
forming a first substrate portion comprising a metal clad layer;
mounting at least one surface mount component to the first substrate portion and electrically coupling the at least one surface mount component a with the metal clad layer;
attaching a second substrate portion to the first substrate portion, the second substrate portion including at least one trace formed thereon with conductive gel; and
forming a via, comprised of conductive gel, extending between and electrically coupling the metal clad layer with the trace.
12. The method of claim 11 , wherein forming the first substrate comprises forming the first substrate portion with a thermoset epoxy-based film.
13. The method of claim 11 , wherein forming the first substrate comprises forming the metal clad layer of copper.
14. The method of claim 11 , wherein forming the first substrate comprises forming the first substrate portion with a thermoplastic polyurethane (TPU).
15. The method of claim 11 , wherein forming the first substrate comprises forming the first substrate portion with a silicone.
16. The method of claim 11 , wherein attaching the second substrate portion to the first substrate portion is with bonding bonded.
17. The method of claim 11 , further comprising forming a stencil in the second substrate portion to at least in part form the trace.
18. The method of claim 11 , further comprising enclosing the conductive gel with an encapsulant and the second substrate.
19. The method of claim 11 , wherein forming the trance includes configuring the trace to electrically couple with an external apparatus.
20. The method of claim 19 , wherein the surface mount component is one of a passive or an active component.