Structure production wet etch method and structure production apparatus
A process of preparing a wafer having a diameter of two inches or more, at least a surface of the wafer being formed from a group III nitride crystal, including preparing an alkaline or acidic etching liquid containing a peroxodisulfate ion as an oxidizing agent that accepts an electron, accommodating the wafer such that the surface of the wafer is immersed in the etching liquid such that the surface of the wafer is parallel with a surface of the etching liquid; and radiating light from the surface side of the etching liquid onto the surface of the wafer without agitating the etching liquid. First and second etching areas disposed at an interval from each other are defined on the surface of the wafer. In the process of radiating the light onto the surface of the wafer, the light is radiated perpendicularly onto surfaces of the first and second etching areas.
1. A structure production method, comprising:
preparing a wafer at least whose surface is composed of group III nitride crystals and having a non-conductive mask formed on the surface;
preparing an alkaline or acidic etching liquid containing a peroxodisulfate ion as an oxidizing agent that accepts an electron; and
irradiating the surface of the wafer with light, in a state where the surface of the wafer is immersed in the etching liquid heated so as to generate sulfate ion radicals, wherein in the irradiation of the light, the surface of the wafer is intermittently irradiated with the light.
2. A structure production method, comprising:
preparing a wafer at least whose surface is composed of group III nitride crystals and having no mask formed on the surface;
preparing an alkaline or acidic etching liquid containing a peroxodisulfate ion as an oxidizing agent that accepts an electron; and
selectively irradiating an etching area on the surface of the wafer with light, in a state where the surface of the wafer is immersed in the etching liquid heated so as to generate sulfate ion radicals.
3. The structure production method according to claim 2 , wherein in the irradiation of the light, an irradiation cross section of the light on the surface of the wafer is scanned.
4. A structure production apparatus, comprising:
a container that holds a wafer at least whose surface is composed of group III nitride crystals and an alkaline or acidic etching liquid containing a peroxodisulfate ion as an oxidizing agent that accepts an electron;
a temperature controller that can heat the etching liquid; and
a light irradiation device that irradiates the surface of the wafer with light, the wafer being held in the container,
wherein the container holds the wafer in a state where the surface of the wafer is immersed in the etching liquid heated so as to generate sulfate ion radicals, and
the light irradiation device selectively irradiates an etching area on the surface of the wafer with the light.
5. The structure production apparatus according to claim 4 , wherein the light irradiation device scans an irradiation cross section of the light on the surface of the wafer.