Communication module and electronic device
A communication module includes a first wiring board including a plurality of first signal lines and a first ground line, and a second wiring board including a first layer and a second layer. The first layer includes a plurality of second signal lines. The second layer includes a shielding member. The communication module includes a plurality of first connection members via which the plurality of first signal lines are electrically connected to the plurality of second signal lines, and at least one conductive member provided between the first ground line and the shielding member. The at least one conductive member is provided so as to overlap with at least one second signal line among the plurality of second signal lines as viewed in a direction perpendicular to a main surface of the first wiring board.
1. A communication module comprising:
a first wiring board including a plurality of first signal lines and a first ground line;
a second wiring board including a first layer and a second layer, the first layer including a plurality of second signal lines, the second layer including a shielding member;
a plurality of first connection members via which the plurality of first signal lines are electrically connected to the plurality of second signal lines; and
at least one conductive member provided between the first ground line and the shielding member,
wherein the at least one conductive member is provided so as to overlap with at least one second signal line among the plurality of second signal lines as viewed in a direction perpendicular to a main surface of the first wiring board.
2. The communication module according to claim 1 , wherein the at least one conductive member is electrically connected to at least one of the first ground line and the shielding member.
3. The communication module according to claim 1 , wherein the at least one conductive member is electrically connected to the first ground line and the shielding member.
4. The communication module according to claim 1 , wherein an insulator is interposed between the first layer and the second layer.
5. The communication module according to claim 1 , wherein the at least one second signal line includes 20 or more second signal lines.
6. The communication module according to claim 1 ,
wherein the plurality of second signal lines are arranged at intervals in a predetermined direction, and
wherein, as viewed in the direction perpendicular to the main surface of the first wiring board, a ratio of a total length of part of the plurality of second signal lines overlapping with the at least one conductive member to a total length of the plurality of second signal lines is ⅗ or higher and 1 or lower in the predetermined direction.
7. The communication module according to claim 1 ,
wherein the plurality of second signal lines are arranged at intervals in a predetermined direction, and
wherein, as viewed in the direction perpendicular to the main surface of the first wiring board, a ratio of a total number of second signal lines overlapping with the at least one conductive member among the plurality of second signal lines to a total number of the plurality of second signal lines is ⅗ or higher and 1 or lower.
8. The communication module according to claim 1 ,
wherein the first layer of the second wiring board includes a second ground line, and
wherein the communication module further comprises a second connection member configured to electrically interconnect the first ground line of the first wiring board and the second ground line of the second wiring board.
9. The communication module according to claim 8 , wherein the at least one conductive member is provided in contact with the second connection member.
10. The communication module according to claim 1 , wherein the at least one conductive member includes a plurality of conductive members.
11. The communication module according to claim 1 ,
wherein the first wiring board is a rigid wiring board, and
wherein the second wiring board is a flexible wiring board.
12. The communication module according to claim 1 , wherein the second wiring board is detachably connected to the first wiring board via the plurality of first connection members.
13. The communication module according to claim 1 , wherein the plurality of first signal lines are respectively connected to the plurality of second signal lines via the plurality of first connection members.
14. The communication module according to claim 1 , wherein the plurality of first signal lines each include a first conductor pattern in contact with corresponding one of the plurality of first connection members.
15. The communication module according to claim 14 , wherein the plurality of first signal lines each include a second conductor pattern electrically connected to the first conductor pattern via a via conductor.
16. The communication module according to claim 1 , further comprising an electronic part mounted on the first wiring board and electrically connected to the plurality of first signal lines.
17. The communication module according to claim 16 , wherein the electronic part is configured to transmit a signal to each of the plurality of first signal lines.
18. The communication module according to claim 17 , wherein the electronic part is configured to transmit a differential signal as the signal to two first signal lines among the plurality of first signal lines.
19. An electronic device comprising:
a casing;
a wireless communication unit disposed inside the casing and configured to wirelessly communicate with an external device; and
the communication module according to claim 1 disposed inside the casing.
20. An electronic device comprising:
a casing;
a wireless communication unit disposed inside the casing and configured to wirelessly communicate with an external device; and
the communication module according to claim 16 disposed inside the casing,
wherein the electronic part of the communication module is an image sensor.