Vented liquid-resistant microphone assembly
Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.
1. A microphone module, comprising:
a substrate having a first side and an opposing second side;
a cover mounted to the first side of the substrate and at least partially defining a back volume of the microphone module;
a front volume that is separated from the back volume by a sound-responsive element and that is fluidly coupled to a first opening in the substrate;
a non-porous membrane that defines a sealed volume fluidly coupled to the front volume via the first opening, and that provides a liquid-resistant seal between the front volume and a first environment external to the microphone module on an opposing second side of the substrate; and
a second opening in the substrate that extends from the sealed volume defined by the non-porous membrane, through the substrate, to a second environment external to the microphone module on the first side of the substrate.
2. The microphone module of claim 1 , further comprising a resistive vent over the second opening on the first side of the substrate.
3. The microphone module of claim 1 , further comprising a resistive vent over the second opening on the opposing second side of the substrate.
4. The microphone module of claim 1 , further comprising an inductive vent over the second opening on the first side of the substrate.
5. The microphone module of claim 1 , further comprising an inductive vent over the second opening on the opposing second side of the substrate, wherein the non-porous membrane is mounted to the opposing second side of the substrate.
6. The microphone module of claim 1 , further comprising an inductive vent over the second opening on the opposing second side of the substrate, wherein the non-porous membrane is mounted to the inductive vent.
7. The microphone module of claim 6 , further comprising a circuitry block on the first side of the substrate.
8. The microphone module of claim 7 , further comprising a resistive vent mounted over the second opening on the first side of the substrate.
9. The microphone module of claim 8 , wherein the resistive vent is disposed in the circuitry block.
10. The microphone module of claim 1 , further comprising:
a circuitry block on the first side of the substrate; and
a resistive vent disposed in the circuitry block.
11. The microphone module of claim 10 , further comprising an additional circuitry block mounted on the first side of the substrate.
12. The microphone module of claim 1 , further comprising:
a resistive vent over the second opening on the first side of the substrate; and
an inductive vent over the second opening on the opposing second side of the substrate.
13. The microphone module of claim 1 , further comprising:
an inductive vent over the second opening on the first side of the substrate; and
a resistive vent over the second opening on the opposing second side of the substrate.
14. The microphone module of claim 1 , further comprising:
a circuitry block including a resistive vent mounted over the second opening on the first side of the substrate; and
an inductive vent over the second opening on the opposing second side of the substrate.
15. The microphone module of claim 1 , further comprising:
an inductive vent mounted over the second opening on the first side of the substrate; and
a resistive vent mounted on the inductive vent.
16. The microphone module of claim 1 , further comprising:
a circuitry block mounted over the second opening on the first side of the substrate;
a resistive vent spanning an opening on the circuitry block; and
an inductive vent mounted over the second opening on the first side of the substrate and within the opening in the circuitry block.
17. The microphone module of claim 1 , further comprising:
an inductive vent mounted over the second opening on the opposing second side of the substrate;
a third opening in the substrate; and
an opening in the inductive vent, the opening in the inductive vent aligned with the third opening in the substrate to fluidly couple the front volume and the back volume.
18. The microphone module of claim 17 , further comprising a resistive vent over the second opening on the first side of the substrate.
19. The microphone module of claim 18 , wherein the resistive vent is disposed within a circuitry block attached to the first side of the substrate.
20. The microphone module of claim 1 , further comprising an inductive filter disposed in the substrate and extending from the first opening to the second opening.
21. The microphone module of claim 20 , wherein the non-porous membrane is mounted to the opposing second side of the substrate or to a cover for the inductive filter.
22. The microphone module of claim 21 , further comprising a third opening in the substrate fluidly coupling the front volume and the back volume.
23. The microphone module of claim 20 , further comprising a resistive vent over the second opening on the first side of the substrate.
24. The microphone module of claim 23 , wherein the non-porous membrane is mounted to the opposing second side of the substrate or to a cover for the inductive filter.
25. The microphone module of claim 24 , further comprising a third opening in the substrate fluidly coupling the front volume and the back volume.
26. The microphone module of claim 23 , wherein the resistive vent is disposed in a circuitry block mounted to the first side of the substrate.
27. The microphone module of claim 26 , wherein the non-porous membrane is mounted to the opposing second side of the substrate or to a cover for the inductive filter.
28. The microphone module of claim 27 , further comprising a third opening in the substrate fluidly coupling the front volume and the back volume.
29. An electronic device, comprising:
a housing defining an internal volume;
a microphone module disposed within the internal volume, the microphone module comprising:
a substrate;
a cover mounted to the substrate, wherein the cover separates a back volume of the microphone module from the internal volume,
a front volume that is separated from the back volume by a sound-responsive element and that is fluidly coupled to a first opening in the substrate;
a non-porous membrane that defines a sealed volume that is fluidly coupled to the front volume via the first opening, and that provides a liquid-resistant seal between the front volume and an environment external to the housing; and
a second opening in the substrate that extends from the sealed volume defined by the non-porous membrane, through the substrate, to the internal volume of the housing external to the cover.
30. The electronic device of claim 29 , further comprising at least one of a resistive filter or an inductive filter mounted over the second opening in the substrate.
31. A method of operating a liquid-resistant microphone of an electronic device, the method comprising:
receiving sound from an environment external to the electronic device at a sound-responsive element of the liquid-resistant microphone through a non-porous membrane of the liquid-resistant microphone and through first opening in a substrate of the liquid-resistant microphone; and
generating an electronic signal based on a motion of the sound-responsive element due to the received sound,
wherein the motion of the sound-responsive element due to the received sound causes airflow through a second opening in the substrate between a front volume of the liquid-resistant microphone that is at least partially defined by the non-porous membrane and an interior cavity of the electronic device that is separated from a back volume of the liquid-resistant microphone by a cover mounted to the substrate.
32. The method of claim 31 , wherein the airflow passes through at least one of a resistive filter or an inductive filter mounted over the second opening in the substrate.