Bond wave optimization method and device
A semiconductor device and method of manufacturing the device that includes a growth die and a dummy die. The method includes patterning, on an integrated circuit wafer, at one least growth die, and patterning at least one dummy die that is positioned on at least a portion of a circumference of the integrated circuit wafer. The patterned growth and dummy dies are etched on the wafer. A bond wave is initiated at a starting point on the integrated circuit wafer. The starting point is positioned on an edge of the integrated circuit wafer opposite the portion on which the at least one dummy die is patterned. Upon application of pressure at the starting point, a uniform bond wave propagates across the wafers, bonding the two wafers together.
1. A method of manufacturing a semiconductor device, comprising:
forming, in a growth die area on a surface of an integrated circuit wafer, at least one growth die including performing patterned etching to define at least one cavity in each growth die;
forming, outside the growth die area on the surface of the integrated circuit wafer, at least one dummy die including performing patterned etching to define at least one cavity in each dummy die;
fusion bonding a carrier wafer to the surface of the integrated circuit wafer wherein the fusion bonding initiates at a starting point on the surface of the integrated circuit wafer and propagates as a bond wave across the surface of the integrated circuit wafer.
2. The method of claim 1 , wherein a total area of the cavities in the growth and dummy dies is in the range of 35% to 45% of the area of the surface of the integrated circuit wafer.
3. The method of claim 1 , wherein the bonded surface area between the integrated circuit wafer and the carrier wafer is in the range of 55% to 65% of the area of the surface of the integrated circuit wafer.
4. The method of claim 1 , wherein each growth die comprises an array of capacitive micromachined ultrasonic transducer units.
5. The method of claim 1 , wherein a size of the at least one dummy die is less than a size of the growth die.
6. The method of claim 1 , wherein the at least one growth die comprises an array of capacitive micromachined ultrasonic transducer units.
7. The method of claim 1 , wherein the at least one dummy die comprises an array of nonfunctional capacitive micromachined ultrasonic transducer units.
8. The method of claim 1 , wherein:
the forming of the at least one growth die further includes forming bottom sensing electrodes of an array of capacitive micromachined ultrasonic transducer units; and
the forming of the at least one dummy die does not include forming bottom sensing electrodes of an array of capacitive micromachined ultrasonic transducer units.
9. A semiconductor device, comprising:
a carrier wafer;
an integrated circuit wafer bonded to the carrier wafer, the integrated circuit wafer comprising:
at least one growth die patterned and etched therein in a growth die area of the integrated circuit wafer, and
at least one dummy die patterned and etched therein and located between the growth die area and an edge of the circumference of the integrated circuit wafer.
10. The semiconductor device of claim 9 , wherein at least one of the at least one growth die pattern or the at least one dummy die pattern comprises an array of capacitive micromachined ultrasonic transducers.
11. The semiconductor device of claim 9 , wherein a size of the at least one dummy die is less than a size of the growth die.
12. The semiconductor device of claim 11 , wherein the bonded surface area between the integrated circuit wafer and the carrier wafer is in the range of 55% to 65% of the area of the surface of the integrated circuit wafer.
13. The semiconductor device of claim 9 , wherein the at least one growth die and the at least one dummy die each include at least one cavity.
14. The semiconductor device of claim 13 , wherein a total area of the cavities in the at least one growth die and the at least one dummy die is in the range of 35% to 45% of the area of the surface of the integrated circuit wafer.
15. A method of manufacturing a semiconductor device, comprising:
forming, in a growth die area on a surface of an integrated circuit wafer, a plurality of growth dies each including an array of capacitive micromachined ultrasonic transducer (CMUT) units wherein each CMUT unit includes a bottom sensing electrode and an etched cavity;
forming, on the surface of an integrated circuit wafer and in an area between the growth die area and a circumference of the integrated circuit wafer, a plurality of dummy dies each including an array of etched cavities; and
fusion bonding a carrier wafer to the surface of the integrated circuit wafer wherein the fusion bonding initiates at a starting point on the surface of the integrated circuit wafer and propagates as a bond wave across the surface of the integrated circuit wafer, and wherein the fusion bonding does not occur at the etched cavities of the CMUT units and does not occur at the etched cavities of the dummy dies.
16. The method of claim 15 , wherein a total area of the cavities in the growth and dummy dies is in the range of 35% to 45% of the area of the surface of the integrated circuit wafer.
17. The method of claim 15 , wherein the bonded surface area between the integrated circuit wafer and the carrier wafer is in the range of 55% to 65% of the area of the surface of the integrated circuit wafer.
18. The method of claim 15 , wherein a size of at least one of the plurality of dummy dies is less than a size of a growth die.
19. The method of claim 15 , wherein the starting point is located on the surface of the integrated circuit wafer that does not include the plurality of dummy dies.
20. The method of claim 15 , wherein the at least one dummy die comprises an array of nonfunctional capacitive micromachined ultrasonic transducer units.