Low profile interconnect for light emitter
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
1. A method for making a display device, comprising:
providing a light emitter over a substrate comprising a substrate bond pad, the light emitter comprising a light emitter bond pad;
providing an electrical interconnect over the light emitter, the electrical interconnect following contours of the light emitter and in contact with the light emitter bond pad at one end of the electrical interconnect and the substrate bond pad at an other end of the electrical interconnect, and wherein a cross-sectional shape of the electrical interconnect, as viewed in a plane transverse to an elongate axis of the electrical interconnect, has a width larger than a height of the cross-sectional shape by a factor of 50 or more; and
coupling a light-guiding optical structure to the light emitter, wherein the light-guiding optical structure is disposed over an exposed surface of the electrical interconnect, wherein the light-guiding optical structure is separated by an air gap from the exposed surface of the electrical interconnect.
2. The method of claim 1 , wherein providing the electrical interconnect comprises 3D printing the electrical interconnect.
3. The method of claim 1 , further comprising providing a dielectric material over the light emitter before depositing the electrical interconnect.
4. The method of claim 1 , wherein providing the dielectric material comprises 3D printing the dielectric material.
5. The method of claim 1 , wherein providing the electrical interconnect comprises depositing a metal.
6. The method of claim 1 , wherein the light emitter is a LED chip.
7. The method of claim 1 , wherein a maximum height of the electrical interconnect above the light emitter is 50 um or less.
8. The method of claim 1 , wherein the light-guiding optical structure is a light pipe.
9. The method of claim 1 , further comprising:
providing a light modulating device configured to receive light from the light pipe; and
providing a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
10. The method of claim 9 , further comprising: providing a plurality of the light pipes, each light pipe configured to transmit light to the light modulating device.
11. The method of claim 1 , wherein the light-guiding optical structure is a reflector.
12. The method of claim 11 , further comprising:
providing a light modulating device configured to receive light from the reflector; and
providing a stack of waveguides, each waveguide comprising a light incoupling optical element configured to receive light from the light modulating device.
13. The method of claim 12 , further comprising: providing a plurality of the reflectors, each reflector configured to direct light to the light modulating device.
14. The method of claim 1 , wherein providing the light emitter comprises attaching the light emitter on an electrical contact on a surface of the substrate.
15. The method of claim 1 , wherein the electrical interconnect conformally follows contours of the light emitter.
16. The method of claim 15 , wherein the light emitter defines a step over the substrate, wherein the electrical interconnect follows contours of the step after depositing.
17. The method of claim 1 , wherein the cross-sectional shape is rectangular.
18. The method of claim 1 , wherein the light emitter further comprises another light emitter bond pad.
19. The method of claim 18 , further comprising providing another electrical interconnect over the light emitter and in contact with the other light emitter bond pad and another substrate bond pad.