Semiconductor memory device and error detection and correction method

1. An error detection and correction method for a semiconductor memory device, the error detection and correction method comprising:

a setting step, setting selection information for selecting a first error detection and correction function to perform m-bit error detection and correction or a second error detection and correction function to perform n-bit error detection and correction, wherein m and n are natural numbers, and m is less than n; and

an executing step, performing the first error detection and correction function or the second error detection and correction function based on the selection information during a read operation or a write operation,

wherein in the setting step, the selection information is changed externally according to an instruction.

2. The error detection and correction method of claim 1 , wherein

the selection information specifies a first address space of a memory cell array for selecting the first error detection and correction function and a second address space of the memory cell array for selecting the second error detection and correction function, and

the executing step perfoiiiis the first error detection and correction function or the second error detection and correction function based on the first address space or the second address space corresponding to an address of the read operation or the write operation.

3. The error detection and correction method of claim 1 , further comprising

a converting step, converting first data that is related to the first error detection and correction function and is written to the memory cell array into second data related to the second error detection and correction function when an operation is switched from the first error detection and correction function to the second error detection and correction function.

4. The error detection and correction method of claim 3 , wherein

in the converting step, the first data in the memory cell array is read to a page buffer/sensing circuit, the first data is thereby converted into the second data through the second error detection and correction function, and the second data is then written to an original position of the memory cell array.

5. The error detection and correction method of claim 1 , wherein

the Hamming code is adopted for the first error detection and correction function to perform 1-bit error detection and correction, and the Bose—Chaudhuri—Hocquenghem codes are adopted for the second error detection and correction function to perform 2-bit, 4-bit, or 8-bit error detection and correction.

6. The error detection and correction method of claim 1 , wherein

the memory cell array is a NAND memory cell array comprising a regular sector and a spare sector, and parity check bits generated through the first error detection and correction function or the second error detection and correction function are stored in the spare sector.

7. A semiconductor memory device, comprising:

a memory cell array;

an error detection and correction circuit, comprising a first error detection and correction function for performing m-bit error detection and correction and a second error detection and correction function for performing n-bit error detection and correction, wherein m and n are natural numbers, and m is less than n;

a setting register, adapted to set selection infoiiiiation for selecting the first error detection and correction function or the second error detection and correction function; and

a controller, adapted to perform the first error detection and correction function or the second error detection and correction function based on the selection infoimation during a read operation or a write operation,

wherein the setting register changes the selection information externally according to an instruction.

8. The semiconductor memory device of claim 7 , wherein

the selection information specifies a first address space of the memory cell array for selecting the first error detection and correction function and a second address space of the memory cell array for selecting the second error detection and correction function, and

the controller performs the first error detection and correction function or the second error detection and correction function based on the first address space or the second address space corresponding to an address of the read operation or the write operation.

9. The semiconductor memory device of claim 7 , wherein

the controller comprises a converting element, and first data that is related to the first error detection and correction function and is written to the memory cell array is converted into second data related to the second error detection and correction function when the converting element switches an operation from the first error detection and correction function to the second error detection and correction function.

10. The semiconductor memory device of claim 9 , wherein

the converting element reads the first data in the memory cell array to a page buffer/sensing circuit, the first data is thereby decoded through the first error detection and correction function and encoded through the second error detection and correction function to generate the second data, and the second data is then written to an original position of the memory cell array.

11. The semiconductor memory device of claim 7 , wherein

the Hamming code is adopted for the first error detection and correction function to perform 1-bit error detection and correction, and the Bose—Chaudhuri—Hocquenghem codes are adopted for the second error detection and correction function to perform 2-bit, 4-bit, or 8-bit error detection and correction.

12. The semiconductor memory device of claim 7 , wherein

the memory cell array is a NAND memory cell array comprising a regular sector and a spare sector, and parity check bits generated through the first error detection and correction function or the second error detection and correction function are stored in the spare sector.