IP Library Granted Patent US 12,521,762
Granted Patent B2
US 12,521,762 · App. 17/675,381 · Granted Jan 13, 2026

Ultrasonic transducer for transmitting and/or receiving ultrasonic waves

Inventors: Markus Klemm (Waldkirch, DE); Eric Starke (Waldkirch, DE)
Assignee: ENDRESS+HAUSER SICK GMBH+CO. KG
B06B1/067
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Quick Facts
Patent No.
US 12,521,762
App. No.
17/675,381
Granted
Jan 13, 2026
Kind
B2
Abstract

The invention relates to an ultrasonic transducer ( 1 ) for transmitting and/or for receiving ultrasonic waves, comprising a backing layer ( 2 ), a matching layer (A) for impedance matching to the fluid (F), a piezoelectric element ( 4 ) arranged between the backing layer ( 2 ) and the matching layer (A), a first electrode ( 3 a ) between the support layer ( 2 ) and the piezo element ( 4 ) providing a first electrical contact (K 1 ) of the piezo element ( 4 ), wherein the matching layer (A) is formed by a flexible printed circuit board (Lp) and the flexible printed circuit board (Lp) provides a second electrical contact (K 2 ) of the piezo element ( 4 ).

Claims (19)

1 . Ultrasonic transducer ( 1 ) for transmitting and/or receiving ultrasonic waves in a fluid (F), comprising

a backing layer ( 2 ),

a matching layer (A) for impedance matching to the fluid (F),

a piezoelectric element ( 4 ) arranged between the backing layer ( 2 ) and the matching layer (A),

a first electrode ( 3 a ) between the backing layer ( 2 ) and the piezoelectric element ( 4 ), which provides a first electrical contact (K 1 ) of the piezoelectric element ( 4 ), and

a second electrode, said second electrode providing

a second electrical contact (K 2 ) of the piezoelectric element ( 4 ),

characterised in that the matching layer (A) is formed by a flexible printed circuit board (Lp),

characterised in that the flexible printed circuit board (Lp) comprises at least one electrically conductive layer ( 5 ) and at least one electrically non-conductive base layer ( 6 ),

characterised in that the conductive layer ( 5 ) of the flexible printed circuit board (Lp) is a conductive path of the flexible printed circuit board (Lp) consisting of copper, and

characterised in that the conductive path of the flexible printed circuit board (Lp) acts as the second electrode.

2 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that the flexible printed circuit board (Lp) is adapted to a structure of the piezoelectric element ( 4 ).

3 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that the base layer ( 6 ) consists of polyimide.

4 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that the flexible printed circuit board (Lp) has a protective layer, in particular of copper, steel, gold or aluminium, on the surface facing away from the piezoelectric element ( 4 ).

5 . Ultrasonic transducer ( 1 ) according to claim 1 , characterized in that the piezoelectric element ( 4 ) consists of several individual elements ( 4 a ), each individual element ( 4 a ) having a respective separate contacting with the flexible printed circuit board (Lp).

6 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that the flexible printed circuit board (Lp) has a terminal lug ( 7 ) for an electrical connection.

7 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that an acoustic impedance of the flexible printed circuit board (Lp) is in the range between an acoustic impedance of the piezoelectric element ( 4 ) and an acoustic impedance of the fluid (F).

8 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that a thickness of the flexible printed circuit board (Lp) corresponds to about 1/10 to ¼ of the ultrasonic wavelength, in particular in a range of about 100 μm to 300 μm.

9 . Ultrasonic transducer ( 1 ) according to claim 1 , characterised in that the flexible printed circuit board (Lp) is attached to the piezoelectric element ( 4 ) by soldering, gluing with electrically conductive or non-conductive adhesive, tacking with contact gel or contact grease or welding.

Assignments (2)
CHANGE OF NAME Recorded Mar 18, 2025
From: SICK ENGINEERING GMBH
To: ENDRESS+HAUSER SICK GMBH+CO. KG
Reel/Frame 070552/0191 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2022
From: KLEMM, MARKUS; STARKE, ERIC
To: SICK ENGINEERING GMBH
Reel/Frame 059061/0378 →
Priority Claims (1)
EP 21162099 · Mar 11, 2021 · regional
Continuity (1)
Related Publication 20220288636A1 · Sep 15, 2022
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