Method for manufacturing a floor board

1. A method of manufacturing a floor board, comprising the steps of:

supplying a panel, printing a curable substance onto the panel in a predefined pattern for creating an elevation on the panel at the predefined pattern;

curing the curable substance, hence forming the floor board;

wherein the curable substance is printed onto the panel by first printing a liquid onto the panel in said predefined pattern, and then providing an intermediate substance to the liquid, wherein the intermediate substance forms the curable substances or surface;

wherein the intermediate substance comprises a powder, wherein the maximal thickness of the curable substance lies between 5 and 1000 μm.

2. The method according to claim 1 , wherein the step of printing the curable substance is digitally controlled.

3. The method according to claim 1 , wherein the curable substance comprises wear resistant particles.

4. The method according to claim 1 , wherein the predefined pattern substantially corresponds to a decorative basic pattern being present on the panel.

5. The method according to claim 4 , wherein the liquid is printed onto the panel at a printing station, a camera recognizes the predefined pattern printed on the panel before arriving at the printing station.

6. The method according to claim 4 , wherein the predefined pattern is a wood grain pattern where the wood grains are depressed portions and surrounding portions are elevated portions.

7. The method according to claim 6 , wherein the depressed portions are made by printing the curable substance beside of the intended depressed portions.

8. The method according to claim 6 , wherein the intermediate substance contains wear resistant particles.

9. The method according to claim 1 , wherein curing is performed via heating.

10. The method according to claim 9 , wherein an entirety of the panel including the curable substance is arranged to be placed in a heated environment so as to cure the substance.

11. The method according to claim 1 , wherein the maximal thickness of the curable substance lies between 20 and 250 μm.

12. The method according to claim 1 , wherein the curable substance is cured by means of UV radiation.

13. The method according to claim 1 , wherein the curable substance contains a varnish.

14. The method according to claim 1 , wherein the panel is a flexible sheet which is laminated to a substrate after printing the curable substance or surface removing substance thereon so as to form the floor board.

15. The method according to claim 1 , wherein the panel comprises a substrate of HDF, WPC (Wood Plastic Composite), polymeric composite (engineered polymer), PVC, LVT (Luxury Vinyl Tile).

16. The method according to claim 1 , wherein said powder sticks to the liquid whereas excess powder is removed.

17. The method according to claim 16 , wherein the excess powder is removed by suction.