Top plane connections for electro-optic devices including a through-hole in rear substrate
Methods of making a top-plane connection in an electro-optic device and devices including such connections. A through hole is created through a rear substrate to provide a connection between a conductor coupled to the rear substrate and a light-transmissive conductive layer coupled to a top transparent substrate. The hole is subsequently filled with a top-plane connection material that provides an electrical connection between the conductor and the light-transmissive conductive layer, but does not provide an electrical connection between a separate rear conductive layer and the light-transmissive conductor.
1. A method of making a top-plane connection in an electro-optic device, the method comprising:
providing a front transparent substrate having a light-transmissive conductive layer coupled thereto;
providing a rear substrate having a plurality of conductors and a separate rear conductive layer coupled thereto, wherein at least some of the plurality of conductors are electrically isolated from the rear conductive layer, wherein an insulating layer is disposed between the front transparent substrate and the rear substrate;
cutting a hole through the rear substrate and traversing the insulating layer to provide access between at least one of the plurality of conductors of the rear substrate and the light-transmissive conductive layer of the front transparent substrate; and
filling the hole with a top-plane connection material to make an electrical connection between the at least one of the plurality of conductors and the light-transmissive conductive layer,
wherein the insulating layer surrounds the top-plane connection material and forms a boundary electrically isolating the top-plane connection material from the rear conductive layer such that an electrical connection between the rear conductive layer and the light-transmissive conductive layer is not made.
2. The method of claim 1 , wherein the electro-optic device comprises an electrophoretic medium.
3. The method of claim 1 , wherein the electro-optic device is an electro-wetting device.
4. The method of claim 1 , wherein the hole is cut with a laser, a drill, or a diamond saw.
5. The method of claim 1 , wherein cutting comprises making a slot cut at an edge of the rear substrate.
6. The method of claim 1 , wherein the top-plane connection material comprises silver or carbon filled epoxy.