Apparatus for an inductor disposed in a band for method of heat dispersion
Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.
1. An apparatus comprising:
a band comprising a high thermally conductive material disposed at least partially around an inductor, wherein the high thermal conductive material has a thermal conductive value greater than the thermal conductivity of the inductor, wherein a minimum width of the band is the minimum width to allow a thermal connection with one or more terminals of an integrated circuit die.
2. The apparatus of claim 1 , wherein the high thermally conductive material is a formable metal comprising copper, silver, gold, aluminum, steel, stainless steel, tungsten, or zinc.
3. The apparatus of claim 1 , wherein the high thermally conductive material comprises a non-metal including aluminum nitride, or graphite.
4. The apparatus of claim 1 , further comprising one or more additional band disposed around a corresponding one of one or more additional inductors.
5. The apparatus of claim 1 , wherein a width of the band varies around the inductor.
6. The apparatus of claim 1 , wherein the integrated circuit die comprises an integrated circuit in a package or multiple circuits in a package.
7. The apparatus of claim 1 , wherein a maximum width of the band is an overhang of a width of the inductor.
8. The apparatus of claim 1 , wherein the band completely surrounds the inductor.
9. The apparatus of claim 1 , wherein the band makes direct contact with the inductor.
10. The apparatus of claim 1 , wherein the band improves thermal performance, magnetic shielding performance, electrostatic shielding performance, or improves placement of the inductor as part of an assembly.
11. The apparatus of claim 1 , wherein the high thermally conductive material has a thermal conductivity that is greater than 200 watts per meter per kelvin (W/mK).
12. The apparatus of claim 1 , wherein the high thermally conductive material has a thermal conductivity that is greater than 100 watts per meter per kelvin (W/mK).
13. The apparatus of claim 1 , wherein the band is electrically decoupled from the integrated circuit die.