Semiconductor devices including crack sensor
A semiconductor device includes a target layer disposed on a substrate, and a crack sensor for detecting a crack generated in the target layer. The crack sensor includes a first conductive pattern positioned at a bottom surface of the target layer, a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer, a plurality of resistors, and nodes. The plurality of resistors are connected in parallel to each other through the first conductive pattern and the second conductive pattern. Each of the plurality of resistors is disposed to substantially penetrate the target layer.
1. A semiconductor device comprising:
a substrate including chip regions and a scribe lane region;
a target layer disposed on the substrate; and
a crack sensor for detecting a crack generated in the target layer,
wherein the crack sensor includes:
a first conductive pattern positioned at a bottom surface of the target layer;
a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer;
a plurality of resistors substantially penetrating the target layer, the plurality of resistors connected in parallel to each other through the first conductive pattern and the second conductive pattern, wherein each of the plurality of resistors is disposed sequentially away from the chip region; and
a first node and a second node connected to the first conductive pattern and the second conductive patterns, respectively.
2. The semiconductor device of claim 1 , wherein each of the plurality of resistors is configured to provide substantially the same resistance values.
3. The semiconductor device of claim 2 , wherein each of the plurality of resistors corresponds to the same number of conductive vias, respectively, substantially penetrating the target layer.
4. The semiconductor device of claim 1 , wherein the plurality of resistors are configured to provide different resistance values from each other.
5. The semiconductor device of claim 4 , wherein the plurality of resistors correspond to a different number of conductive vias that substantially penetrate the target layer.
6. The semiconductor device of claim 1 , wherein each of the plurality of resistors corresponds to a conductive via or a conductive wiring that substantially penetrates the target layer.
7. The semiconductor device of claim 1 , wherein the target layer includes a plurality of target sub-layers, and
wherein the resistors include conductive lands that are disposed at interfaces of the target sub-layers and conductive vias that substantially penetrate the target sub-layers.
8. The semiconductor device of claim 7 , wherein some of the conductive lands extend to connect neighboring resistors.
9. The semiconductor device of claim 1 , further comprising an additional resistor penetrating the target layer to connect the first conductive pattern to the first node.
10. The semiconductor device of claim 9 , wherein the additional resistor includes conductive vias disposed along a boundary between the chip region and the scribe lane region and the resistors.
11. The semiconductor device of claim 9 , wherein the additional resistor includes conductive vias disposed parallel to and spaced apart from one of the plurality of resistors along the boundary between the chip region and the scribe lane region.
12. The semiconductor device of claim 1 , wherein the first and second nodes are disposed over the chip region of the substrate or disposed over the scribe lane region of the substrate.
13. The semiconductor device of claim 1 , further comprising a guard wall substantially penetrating some portions of the target layer over the chip region,
wherein the plurality of resistors are disposed on a portion of the scribe lane region of the substrate, adjacent to the guard wall.
14. The semiconductor device of claim 1 ,
wherein the chip region of the substrate includes a rectangular-shaped region, and
wherein the plurality of resistors are disposed over a portion of the scribe lane region of the substrate, adjacent to a side of the rectangular shape.
15. The semiconductor device of claim 1 ,
wherein the chip region of the substrate includes a rectangular-shaped region, and
wherein the plurality of resistors are disposed over a portion of the scribe lane region of the substrate, adjacent to a corner of the rectangular shape.
16. The semiconductor device of claim 1 ,
wherein the target layer and the substrate have a diced side surface facing the boundary between the chip region and the scribe lane region, and
wherein the resistors are sequentially spaced apart from each other between the diced side surface and the boundary between the chip region and the scribe lane region.
17. A semiconductor device comprising:
a target layer disposed on a substrate; and
a crack sensor for detecting a crack generated in the target layer,
wherein the crack sensor includes:
a first conductive pattern positioned at a bottom surface of the target layer;
a second conductive pattern positioned on a top surface of the target layer, the top surface being opposite to the bottom surface of the target layer;
a plurality of resistors substantially penetrating the target layer, the plurality of resistors connected in parallel to each other through the first conductive pattern and the second conductive pattern; and
a first node and a second node connected to the first conductive pattern and the second conductive pattern, respectively.
18. The semiconductor device of claim 17 , wherein each of the plurality of resistors is configured to provide substantially the same resistance values.
19. The semiconductor device of claim 17 , wherein the plurality of resistors are configured to provide different resistance values from each other.
20. The semiconductor device of claim 19 , wherein the plurality of resistors corresponds to a different number of conductive vias that substantially penetrate the target layer.