IP Library › Granted Patent US 12,389,551
Granted Patent B2
US 12,389,551 · App. 17/693,676 · Granted Aug 12, 2025

Roll-to-roll additive manufacturing method and device

Inventors: Hendrik J Volkerink (Palo Alto, CA); Ajay Khoche (West San Jose, CA)
H05K3/28H05K1/028H05K1/0373
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Quick Facts
Patent No.
US 12,389,551
App. No.
17/693,676
Granted
Aug 12, 2025
Kind
B2
Abstract

A flexible laminate electronic device includes a flexible substrate that includes electrical connections between electronic components attached to the flexible substrate. A first flexible additive layer includes apertures, wherein at least one of the one or more electronic components is aligned in one of the apertures. A subsequent flexible additive layer is disposed over the first flexible additive layer and aligned around respective portions of the electronic components protruding above the first flexible additive layer. A flexible cover layer is placed over the subsequent flexible additive layer.

Claims (35)

1. A flexible laminate electronic device comprising:

a flexible substrate comprising a flexible circuit electrically connecting a plurality of electronic components attached to the flexible substrate;

a first flexible additive layer on the flexible substrate and comprising apertures, wherein each of the plurality of electronic components are aligned in a respective aperture of the apertures and wherein a top surface of the first flexible additive layer is flush with a top surface of each electronic component of a first set of the plurality of electronic components;

a subsequent flexible additive layer on the first flexible additive layer and covering the first set of the plurality of electronic components, the subsequent flexible additive layer comprising apertures aligned around respective portions of a second set of the plurality of electronic components protruding above the first flexible additive layer from the flexible substrate, wherein a thickness of the subsequent flexible additive layer corresponds to a difference between a thickness of a second set of the plurality of electronic components and a thickness of the first flexible additive layer; and

a flexible cover layer on the subsequent flexible additive layer and covering the plurality of electronic components.

2. The flexible laminate electronic device of claim 1 , further comprising one or more other successive flexible additive layers on the subsequent flexible additive layer and under the flexible cover layer, the other successive flexible additive layers comprising one or more apertures aligned around respective portions of ones of the electric components protruding above preceding ones of the flexible additive layers.

3. The flexible laminate electronic device of claim 1 , the plurality of electronic components comprising:

a processor;

a memory or storage device; and

a battery.

4. The flexible laminate electronic device of claim 3 , wherein the battery comprises a flexible battery.

5. The flexible laminate electronic device of claim 1 , wherein a first thickness of the first flexible additive layer corresponds to a height of at least one electronic component of the plurality of electronic components.

6. The flexible laminate electronic device of claim 5 , wherein the subsequent flexible additive layer covers the at least one electronic component and covers an aperture of the first flexible additive layer aligned with the at least one electronic component.

7. The flexible laminate electronic device of the claim 1 , wherein a top surface of the subsequent flexible additive layer is flush with a top surface of each electronic component of the second set of the plurality of electronic components.

8. The flexible laminate electronic device of claim 1 , wherein a first thickness of the first flexible additive layer equals a first height of a first electronic component of the plurality of electronics components.

9. The flexible laminate electronic device of claim 1 , wherein a first thickness of the first flexible additive layer is greater than or equal to the heights of multiple electronic components of the plurality of electronic components.

10. The flexible laminate electronic device of claim 1 , wherein a first width of a first aperture of the first flexible additive layer is greater than a first width of a first electronic component of the plurality of electronic components.

11. The flexible laminate electronic device of claim 1 , further comprising a flexible polymer layer on the subsequent flexible additive layer, the flexible polymer layer adhering the flexible cover layer to the subsequent flexible additive layer.

12. The flexible laminate electronic device of claim 11 , wherein the flexible polymer layer planarizes a section of the flexible laminate electronic device comprising a region where one of the electronic components of the plurality of electronic components is positioned.

13. The flexible laminate electronic device of claim 1 , further comprising at least one of an adhesive layer on a bottom surface of the flexible substrate or on a top surface of the flexible cover layer.

14. The flexible laminate electronic device of claim 1 , wherein the apertures of the subsequent flexible additive layer are aligned to overlap with a subset of the apertures of the first flexible additive layer.

15. A flexible electronic device, comprising:

a flexible substrate comprising a flexible circuit electrically connecting a plurality of electronic components;

a first flexible additive layer on the flexible substrate and comprising apertures, the first flexible additive layer comprising a first thickness, wherein a first electronic component of the plurality of electronic components is aligned with a first aperture of the apertures and wherein a top surface of the first flexible additive layer is flush with a top surface of a second electronic component of the plurality of the electronic components;

a second flexible additive layer on the flexible substrate comprising apertures, the second flexible additive layer having a second thickness, wherein the first electronic component and the first aperture are both aligned with a second aperture of the second flexible additive layer's apertures; and

a flexible cover layer on the second flexible additive layer, wherein

a sum of the first thickness and the second thickness corresponds to a height of the first electronic component of the plurality of electronic components, and

a thickness of the flexible electronic device at a location overlapping the first electronic component equals a thickness of the flexible electronic device at a location overlapping the second electronic component.

16. The flexible electronic device of claim 15 ,

wherein the second electronic component is on the flexible substrate and aligned with a third aperture of the first flexible additive layer, and the second electronic component and the third aperture are not aligned with any of the apertures of the second flexible additive layer.

17. The flexible electronic device of claim 16 , wherein the first thickness corresponds to a height of the second electronic component.

18. The flexible electronic device of claim 16 , wherein a height of the second electronic component is less than a height of the first component.

19. The flexible electronic device of claim 16 , wherein the second flexible additive layer covers the second electronic component and covers the third aperture of the first flexible additive layer.

20. The flexible electronic device of claim 15 , wherein the second thickness is greater than the first thickness.

21. The flexible electronic device of claim 15 , wherein the second thickness is less than the first thickness.

Continuity (3)
Division 17019833 · Sep 14, 2020
Provisional Application 62900333 · Sep 13, 2019
Related Publication 20220272848A1 · Aug 25, 2022
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