Heat dissipation device
A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. The supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber. The cooling fin assembly is disposed on the first external surface.
1. A heat dissipation device, comprising:
a housing;
at least one temperature plate, wherein the at least one temperature plate comprises a plate body and a supporter, the plate body comprises a vacuum chamber and a first external surface, the plate body has at least one bent portion with the first external surface being a compressive side, and the supporter is disposed at the at least one bent portion, wherein the supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the at least one bent portion and also to improve the heat conduction, the plate body comprises a first plate and a second plate, the first plate and the second plate are connected to define the vacuum chamber, the first plate or the second plate has a plurality of protruding portions at the at least one bent portion, the protruding portions construct the supporter, and the protruding portions are aligned or misaligned with each other; and
a cooling fin assembly disposed on the first external surface.
2. The heat dissipation device of claim 1 , wherein the supporter is a structural enhancement member.
3. The heat dissipation device of claim 1 , wherein the plate body comprises a second external surface which is opposite to the first external surface, and the supporter is between the first external surface and the second external surface.
4. The heat dissipation device of claim 1 , wherein the plate body is a single plate workpiece.
5. The heat dissipation device of claim 1 , wherein the at least one bent portion of the plate body clips the cooling fin assembly.
6. The heat dissipation device of claim 1 , further comprising:
a heat conducting plate, wherein the at least one temperature plate and the cooling fin assembly are disposed on the heat conducting plate.
7. A heat dissipation device, comprising:
at least one temperature plate, wherein the at least one temperature plate comprises a plate body and a supporter, the plate body comprises a vacuum chamber and a first external surface, the plate body has at least one bent portion with the first external surface being a compressive side, and the supporter is disposed at the at least one bent portion, wherein the supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber to enhance a structural strength of the at least one bent portion and also to improve the heat conduction, the plate body comprises a first plate and a second plate, the first plate and the second plate are connected to define the vacuum chamber, one of the first plate and the second plate has a plurality of recess portions at the at least one bent portion, and the other of the first plate and the second plate has a plurality of protruding portions at the at least one bent portion, the protruding portions and the recess portions construct the supporter, and the protruding portions are aligned or misaligned with the recess portions; and
a cooling fin assembly disposed on the first external surface.
8. The heat dissipation device of claim 7 , wherein the supporter is a structural enhancement member.
9. The heat dissipation device of claim 7 , wherein the plate body comprises a second external surface which is opposite to the first external surface, and the supporter is between the first external surface and the second external surface.
10. The heat dissipation device of claim 7 , wherein the plate body is a single plate workpiece.
11. The heat dissipation device of claim 7 , wherein the at least one bent portion of the plate body clips the cooling fin assembly.
12. The heat dissipation device of claim 7 , further comprising:
a heat conducting plate,
wherein the at least one temperature plate and the cooling fin assembly are disposed on the heat conducting plate.