Electronic device and circuit board module thereof
A circuit board module includes a circuit board, a metal core printed circuit board, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembling region. The metal core printed circuit board is on the assembling region and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other. The second circuit layer is electrically connected to the circuit board. The thermal conductivity of the metal core printed circuit board is greater than the thermal conductivity of the substrate. The heating element is on the metal core printed circuit board and is electrically connected to the first circuit layer. An electronic device having the circuit board module is also provided.
1. A circuit board module comprising:
a circuit board comprising a substrate, wherein a surface of the substrate has an assembling region;
a metal core printed circuit board disposed on the assembling region and comprising a first circuit layer and a second circuit layer, wherein the first circuit layer and the second circuit layer are electrically connected to each other, the second circuit layer is electrically connected to the circuit board, and a thermal conductivity of the metal core printed circuit board is greater than a thermal conductivity of the substrate; and
a heating element disposed on the metal core printed circuit board and electrically connected to the first circuit layer;
wherein the number of the assembling region of the substrate, the number of the metal core printed circuit board, and the number of the heating element are plural; the assembling regions are arranged around on a periphery of an image capturing module, the metal core printed circuit boards are arranged on the assembling regions respectively, and the heating elements are disposed on the metal core printed circuit boards respectively.
2. The circuit board module according to claim 1 , wherein the metal core printed circuit board further comprises a first spacing layer, a metal thermal conduction layer, and a second spacing layer; the metal thermal conduction layer is between the first spacing layer and the second spacing layer, the first spacing layer is sandwiched between the first circuit layer and the metal thermal conduction layer, and the second spacing layer is sandwiched between the metal thermal conduction layer and the second circuit layer.
3. The circuit board module according to claim 2 , wherein the first spacing layer and the second spacing layer each are a thermal conductive insulation layer.
4. The circuit board module according to claim 1 , wherein the substrate is a resin substrate.
5. The circuit board module according to claim 1 , wherein the circuit board comprises an electronic component; the surface of the substrate has a circuit region, the circuit region and the assembling region are arranged at different portions of the surface of the substrate, and the electronic component is disposed on the circuit region.
6. The circuit board module according to claim 5 , wherein a maximum allowable temperature of the electronic component is less than a maximum allowable temperature of the heating element.
7. The circuit board module according to claim 5 , wherein the electronic component is a microphone component.
8. The circuit board module according to claim 1 , wherein the heating element and the first circuit layer are electrically connected to each other through an electrical conductive adhesive layer.
9. An electronic device comprising:
a housing; and
the circuit board module according to claim 1 , wherein the circuit board module is disposed in the housing.
10. The electronic device according to claim 9 , wherein the housing comprises a light-permissible portion, and the heating element of the circuit board module is a light emitting element and corresponds to the light-permissible portion.
11. The electronic device according to claim 9 , wherein the substrate of the circuit board of the circuit board module surrounds the image capturing module.
12. The electronic device according to claim 9 , wherein the housing comprises at least one thermal conductive cover, and the metal core printed circuit board of the circuit board module contacts the at least one thermal conductive cover.
13. The electronic device according to claim 12 , wherein the at least one thermal conductive cover comprises an inner metal cover and an outer metal cover, one of two sides of the metal core printed circuit board contacts the inner metal cover, and the other side of the metal core printed circuit board contacts the outer metal cover.