IP Library Granted Patent US 12,342,667
Granted Patent B2
US 12,342,667 · App. 17/696,927 · Granted Jun 24, 2025

LED module

Inventors: Hideaki Abe (Tokyo, JP); Kazuyuki Yamada (Tokyo, JP); Keisuke Asada (Tokyo, JP); Kota Uogishi (Tokyo, JP); Kenichi Takemasa (Tokyo, JP); Daiki Isono (Tokyo, JP)
Assignee: JAPAN DISPLAY INC.
H10H20/856H10H20/857
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Quick Facts
Patent No.
US 12,342,667
App. No.
17/696,927
Granted
Jun 24, 2025
Kind
B2
Abstract

An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.

Claims (37)

1. An LED module comprising:

a first layer including a first plane;

an LED chip arranged on the first plane;

a second layer surrounding the LED chip and including a convex part on the first plane; and

a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of an upper surface of the second layer,

wherein

a height of the convex part of the second layer is lower than a height of an upper surface of the LED chip,

the first layer, the second layer and the third layer include conductive films,

the second layer is divided into a plurality of parts and includes a first convex part and a second convex part separated from each other,

a first wiring and a second wiring are arranged between the first convex part and the second convex part on the first plane and are insulated from the third layer, and

the LED chip is electrically connected to the first wiring and the second wiring.

2. The LED module according to claim 1 , wherein

the first convex part and the second convex part have a tapered shape in a cross-sectional view.

3. The LED module according to claim 1 , wherein

the first convex part and the second convex part are provided so as to face each other.

4. The LED module according to claim 1 , wherein

the first convex part, the second convex part, and a part of the third layer have a polygonal shape or an arc shape in a plan view.

5. The LED module according to claim 1 , wherein

the shapes of the first convex part and the second convex part facing the LED chip include a plurality of triangular notches or a plurality of arc shaped notches in a plan view.

6. The LED module according to claim 1 , wherein

the first convex part and the second convex part include either a conductive film or an insulating film.

7. The LED module according to claim 2 , wherein

the first layer is provided between a first insulating film and a second insulating film,

the second layer is provided between the second insulating film and a third insulating film, and

the third layer is provided on the third insulating film.

8. A display device comprising:

a plurality of pixels;

a driving circuit driving the plurality of pixels,

wherein

each of the plurality of pixels includes a first layer including a first plane, an LED chip arranged on the first plane, a second layer and a third layer,

the second layer surrounds the LED chip, and includes a convex part on the first plane,

the third layer is arranged outside the LED chip, and overlaps an upper surface of the first layer, a side surface of the second layer and a part of an upper surface of the second layer,

a height of the convex part of the second layer is lower than a height of an upper surface of the LED chip,

the first layer, the second layer and the third layer include conductive films,

the second layer is divided into a plurality of parts and includes a first convex part and a second convex part separated from each other,

a first wiring and a second wiring are arranged between the first convex part and the second convex part on the first plane and are insulated from the third layer, and

the LED chip is electrically connected to the first wiring and the second wiring.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 3, 2025
From: JAPAN DISPLAY INC.
To: MAGNOLIA WHITE CORPORATION
Reel/Frame 071599/0406 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2022
From: ABE, HIDEAKI; YAMADA, KAZUYUKI; ASADA, KEISUKE; UOGISHI, KOTA; TAKEMASA, KENICHI; ISONO, DAIKI
To: JAPAN DISPLAY INC.
Reel/Frame 059918/0570 →
Priority Claims (1)
JP 2019-171716 · Sep 20, 2019 · national
Continuity (2)
Continuation PCTJP2020031243 · Aug 19, 2020
Related Publication 20220209081A1 · Jun 30, 2022
References Cited (4)
US 20210358393A1 · Kang · 2021 [cited by examiner]
JP 2004119147A · 2004 [cited by applicant]
JP 2008234928A · 2008 [cited by applicant]
International Search Report and Written Opinion mailed on Nov. 10, 2020, received for PCT Application PCT/JP2020/031243, Filed on Aug. 19, 2020, 8 pages including English Translation. [cited by applicant]