Electronics module with raceway and submodules
Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.
1. An electronics module comprising:
an additively manufactured raceway comprising:
a base structure;
one or more conductive traces applied to the base structure by laser direct structuring followed by electroless plating; and
a plurality of connection pads on the base structure, each connection pad of the plurality of connection pads comprising a detent portion; and
one or more submodules mounted onto the raceway, each submodule of the one or more submodules comprising:
a submodule base structure; and
a plurality of connection nodes disposed on a first side of the submodule base structure configured to interface with the plurality of connection pads of the raceway respectively by fitting into the detent portion of each connection pad,
wherein each of the plurality of connection nodes provides a continuous electrical connection between the submodule and the respective connection pad to allow for transferring power and data.
2. The electronics module of claim 1 , further comprising at least one microcontroller communicatively coupled to the raceway and the one or more submodules through the one or more conductive traces.
3. The electronics module of claim 2 , wherein the at least one microcontroller comprises a Universal Serial Bus (USB) connection, and wherein the at least one microcontroller is disposed on an edge of the raceway for allowing access to the USB connection.
4. The electronics module of claim 1 , further comprising a Secure Digital (SD) card port configured to receive an SD card for storing data collected from the one or more submodules.
5. The electronics module of claim 1 , each submodule of the one or more submodules comprises one or more solderable conductive traces for mounting one or more electronic subcomponents to the respective submodule.
6. The electronics module of claim 1 , further comprising:
at least one sensor disposed on the one or more submodules; and
one or more submodule conductive traces disposed on the submodule base structure of the one or more submodules for transferring information from the at least one sensor.
7. The electronics module of claim 1 , wherein the one or more submodules comprises a strain gauge assembly including:
a strain gauge base;
a cantilever beam mounted to the strain gauge base; and
one or more strain gauges disposed on the strain gauge base.
8. The electronics module of claim 1 , wherein the one or more submodules comprises one or more light emitting diode (LED) indicators communicatively connected to the one or more submodule conductive traces.
9. The electronics module of claim 1 , wherein the one or more submodules comprises a thermocouple disposed on a breakout board, the breakout board mounted to the submodule base structure, wherein the thermocouple is communicatively connected to the one or more submodule conductive traces.
10. The electronics module of claim 1 , wherein the one or more submodules comprises an accelerometer assembly mounted on the submodule base structure, the accelerometer assembly comprising:
an accelerometer housing;
an accelerometer weight; and
a piezo-resistive siloxane sensor for sensing an acceleration of the electronics module.
11. A method for manufacturing an electronics module, the method comprising: 3D printing a base structure; applying a powder coating on an outer surface of the base structure; after application of the powder coating, applying a laser direct structuring process to the outer surface of the base structure, to define a course on the outer surface of the base structure; applying a conductive plating to the outer surface of the base structure, the conductive plating providing a conductive trace disposed on the base structure over the course defined by the laser direct structuring process; and securing one or more submodules to the base structure, wherein each submodule of the one or more submodules comprises: a plurality of connection nodes disposed on a first side of a submodule base structure configured to interface with the conductive trace, wherein securing each submodule to the base structure provides a continuous electrical connection between the submodule and the conductive trace to allow for transferring power and data.
12. The method of claim 11 , further comprising:
reworking a portion of the base structure to provide a surface finish.
13. The method of claim 11 , wherein the base structure comprises both a polymer material and a metal material, further comprising:
combining the polymer material and the metal material before applying the powder coating.
14. A modular electronics system comprising:
a housing;
a plurality of electronics modules within the housing, each electronics module of the plurality of electronics modules comprising:
a raceway including:
a base structure;
one or more conductive traces on the base structure, said one or more conductive traces formed by laser direct structuring followed by electroless plating; and
a plurality of connection pads disposed on the base structure, each connection pad of the plurality of connection pads comprising a detent portion;
one or more submodules mounted onto the raceway, each submodule of the one or more submodules comprising:
a submodule base structure; and
a plurality of connection nodes disposed on a first side of the submodule base structure configured to interface with the plurality of connection pads of the raceway respectively by fitting into the detent portion of each connection pad,
wherein each of the plurality of connection nodes provides a continuous electrical connection between the submodule and the respective connection pad; and
at least one microcontroller communicatively coupled to the plurality of electronics modules.
15. The modular electronics system of claim 14 , further comprising at least one power source for providing power to the plurality of electronics modules.
16. The modular electronics system of claim 14 , wherein a submodule of the one or more submodules comprises an accelerometer assembly mounted on the submodule base structure, the accelerometer assembly comprises:
an accelerometer housing;
an accelerometer weight; and
a piezo-resistive sensor for sensing an acceleration of the electronics module.
17. The modular electronics system of claim 16 , wherein the piezo-resistive sensor comprises a 3D printed siloxane pad, wherein a displacement of the siloxane pad is proportional to the sensed acceleration.
18. The modular electronics system of claim 14 , further comprising an electrical connector disposed on the housing and electrically coupled to each of the plurality of electronics modules for providing communications and power to the plurality of electronics modules.
19. The modular electronics system of claim 14 , wherein at least one submodule of the one or more submodules comprises one or more light emitting diode (LED) indicators, and wherein the housing is at least partially transparent such that the one or more LED indicators are visible through the housing.