IP Library › Granted Patent US 12,568,694
Granted Patent B2
US 12,568,694 · App. 17/698,563 · Granted Mar 3, 2026

Photovoltaic module with a laminated potted printed circuit board

Inventors: Dawei Kuo (Fremont, CA); Lewis Abra (San Francisco, CA); Richard Perkins (San Jose, CA)
Assignee: GAF Energy LLC
H10F19/80H02S40/34H05K3/0058H10F77/935H02S40/30H10F77/95
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Quick Facts
Patent No.
US 12,568,694
App. No.
17/698,563
Granted
Mar 3, 2026
Kind
B2
Abstract

Some embodiments of the present disclosure relate to a system. In some embodiments, the system includes a photovoltaic module and a module-level power electronics device electrically connected to the photovoltaic module. In some embodiments, the module-level power electronics device comprises a laminated potted printed circuit board. In some embodiments, the laminated potted printed circuit board comprises a potted printed circuit board and an encapsulant covering the potted printed circuit board. In some embodiments, the potted printed circuit board comprises: a printed circuit board having a top surface, and a pottant covering the top surface of the printed circuit board. In some embodiments, the laminated potted printed circuit board is substantially void-free.

Claims (42)

1 . A system, comprising:

a photovoltaic module; and

a module-level power electronics (MLPE) device comprising a laminated potted printed circuit board,

wherein the laminated potted printed circuit board comprises:

a potted printed circuit board,

wherein the potted printed circuit board comprises:

 a printed circuit board having a top surface and a bottom surface, and

 a pottant layer covering the top surface of the printed circuit board, and

an encapsulant layer,

wherein the encapsulant layer comprises a polymer,

wherein the encapsulant layer encapsulates the bottom surface of the printed circuit board and the pottant layer,

wherein the laminated potted printed circuit board is substantially void-free;

wherein the MLPE device is electrically connected to the photovoltaic module.

2 . The system of claim 1 , wherein the laminated potted printed circuit board is substantially void-free so as to result in the MLPE device having an ingress protection rating of IP67.

3 . The system of claim 1 , wherein the pottant layer comprises a trapezoidal shape.

4 . The system of claim 1 , wherein the pottant layer comprises a top surface and a bottom surface, and wherein the top surface of the pottant layer comprises a round shape.

5 . The system of claim 1 , wherein the pottant layer comprises a round, trapezoidal shape.

6 . The system of claim 1 , wherein the pottant layer comprises a top surface and a bottom surface, and wherein the top surface of the pottant layer comprises a flat region and a plurality of round regions.

7 . The system of claim 6 , wherein each of the plurality of round regions extends from the flat region to the bottom surface of the pottant layer.

8 . The system of claim 1 , wherein the pottant layer does not contact the bottom surface of the printed circuit board.

9 . The system of claim 1 , wherein pottant layer comprises silicone.

10 . The system of claim 1 , wherein the encapsulant layer comprises a thickness from 200 μm to 1000 μm.

11 . The system of claim 1 , wherein the encapsulant layer comprises polyolefin.

12 . The system of claim 1 , wherein the encapsulant layer comprises silicone.

13 . The system of claim 1 , wherein the encapsulant layer comprises ethylene-vinyl acetate (EVA).

14 . The system of claim 1 , wherein the encapsulant layer comprises a first encapsulant layer, a second encapsulant layer, a third encapsulant layer, and a fourth encapsulant layer, wherein the first encapsulant layer is laminated on an upper surface of the potted printed circuit board, wherein the second encapsulant layer is laminated on the first encapsulant layer, wherein the third encapsulant layer is laminated on a lower surface of the potted printed circuit board, and wherein the fourth encapsulant layer is laminated on the third encapsulant layer.

15 . The system of claim 1 , wherein the encapsulant layer fully encapsulates the potted printed circuit board without any intervening layer therebetween.

16 . A system, comprising:

a photovoltaic module; and

a module-level power electronics (MLPE) device comprising a laminated potted printed circuit board,

wherein the laminated potted printed circuit board comprises:

a potted printed circuit board,

wherein the potted printed circuit board comprises:

 a printed circuit board having a top surface and a bottom surface, and

 a pottant layer covering at least a portion of the top surface of the printed circuit board, and

an encapsulant layer encapsulating the pottant layer,

wherein the encapsulant layer encapsulates the bottom surface of the printed circuit board,

wherein the laminated potted printed circuit board is substantially void-free so as to result in the MLPE device having an ingress protection rating of IP67;

wherein the MLPE device is electrically connected to the photovoltaic module,

wherein the encapsulant layer comprises silicone, ethylene-vinyl acetate (EVA), or a combination thereof.

17 . The system of claim 16 , wherein the pottant layer does not contact the bottom surface of the printed circuit board.

18 . The system of claim 16 , wherein the pottant layer comprises a round, trapezoidal shape.

Continuity (2)
Provisional Application 63163542 · Mar 19, 2021
Related Publication 20220302329A1 · Sep 22, 2022
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