Light emitting diode chip and display apparatus including the same
A display apparatus is provided. The display apparatus includes a printed circuit board (PCB), a light emitting diode (LED) chip provided on the PCB and configured to output light, an optical dome provided on the LED chip and the LED chip, a void formed by air inside the optical dome and between the LED chip and the PCB, and an air barrier provided between the LED chip and the PCB such that the void is spaced apart from the LED chip.
1 . A display apparatus comprising:
a printed circuit board (PCB);
a light emitting diode (LED) chip provided on the PCB and configured to output light;
a gap between the LED chip and the PCB, the gap being under the LED chip and over the PCB;
an optical dome provided on the PCB and covering the LED chip;
at least one air barrier provided in the gap between the LED chip and the PCB; and
at least one void formed by air entering from inside the gap, wherein the at least one void is formed in the optical dome and is spaced apart from the LED chip.
2 . The display apparatus of claim 1 , further comprising a solder paste provided between the LED chip and the PCB to mount the LED chip on the PCB,
wherein the at least one air barrier is formed by reflowing the solder paste.
3 . The display apparatus of claim 1 , wherein the at least one air barrier is configured to prevent or delay air between the LED chip and the PCB from being discharged into the optical dome.
4 . The display apparatus of claim 1 , further comprising a solder paste provided on the PCB,
wherein the solder paste comprises solder powder and a flux.
5 . The display apparatus of claim 4 , wherein the at least one air barrier comprises the flux.
6 . The display apparatus of claim 1 , wherein the LED chip comprises a first electrode pad and a second electrode pad arranged in parallel with each other in a first direction, and the at least one air barrier extends in the first direction.
7 . The display apparatus of claim 6 , wherein the at least one air barrier comprises a first air barrier and a second air barrier spaced apart from each other in a second direction perpendicular to the first direction.
8 . The display apparatus of claim 7 , wherein the at least one void is spaced apart from the LED chip in the second direction.
9 . The display apparatus of claim 7 , wherein the at least one void is formed on the first air barrier or the second air barrier.
10 . The display apparatus of claim 7 , wherein the at least one void comprises a plurality of voids, and each of the plurality of voids is formed on the first air barrier or the second air barrier.
11 . The display apparatus of claim 7 , wherein the at least one void comprises a plurality of voids, and the plurality of voids are formed on the first air barrier or the second air barrier.
12 . The display apparatus of claim 1 , wherein the LED chip is mounted on a mounting surface of the PCB by a chip on board (COB) method.
13 . The display apparatus of claim 1 , wherein the LED chip comprises a lateral side and a longitudinal side, wherein a length of the longitudinal side is less than or equal to 500 μm.
14 . The display apparatus of claim 1 , wherein the LED chip comprises:
an n-type semiconductor layer,
a p-type semiconductor layer,
a light emission layer provided between the n-type semiconductor layer and the p-type semiconductor layer, the light emission layer configured to emit light, and
a growth substrate covering an upper surface of the n-type semiconductor layer or the p-type semiconductor layer.
15 . The display apparatus of claim 14 , wherein the LED chip further comprises a distributed Bragg reflector (DBR) layer provided on an upper surface of the growth substrate.
16 . A display apparatus comprising:
a printed circuit board (PCB);
a light emitting diode (LED) chip provided on the PCB and configured to output light;
an optical dome provided on the PCB and covering the LED chip;
at least one void formed by air entering from inside the optical dome and between the LED chip and the PCB;
at least one air barrier provided between the LED chip and the PCB such that the at least one void is spaced apart from the LED chip,
a solder paste provided on the PCB and comprising a solder powder and a flux,
wherein the at least one void is formed in the optical dome, and
wherein the at least one air barrier comprises the flux.