Semiconductor device
A semiconductor device according to an aspect of the present disclosure includes: a plurality of line layers; a first line; and a second line that is not connected to the first line and is redundantly provided to transfer a signal having a level same as a level of a signal transferred through the first line. The first line and the second line are included in different layers out of the plurality of line layers, and a distance between the first line and the second line is longer than an interlayer distance between line layers next to each other out of the plurality of line layers.
1. A semiconductor device comprising:
a plurality of line layers;
a first line; and
a second line that is not connected to the first line and is provided to transfer a signal having a level same as a level of a signal transferred through the first line,
wherein the first line and the second line are included in different layers out of the plurality of line layers, and
a distance between the first line and the second line is longer than an interlayer distance between line layers next to each other out of the plurality of line layers and
the first line and the second line are included in a dual interlocked storage cell (DICE) latch circuit.
2. The semiconductor device according to claim 1 ,
wherein in a plan view of the semiconductor device, the semiconductor device includes an overlapping portion in which the first line and the second line overlap each other, and
a distance between the first line and the second line in the overlapping portion is at least twice the interlayer distance.
3. The semiconductor device according to claim 2 ,
wherein in the plan view of the semiconductor device, the first line and the second line cross each other in the overlapping portion,
the second line includes:
a first partial line in which the overlapping portion is included;
a second partial line connected to a first end of the first partial line; and
a third partial line connected to a second end of the first partial line,
the first partial line is included in a first line layer,
the second partial line and the third partial line are included in a second line layer different from the first line layer, and are each connected to the first partial line through a via contact, and
the first line is included in a third line layer farther from the first line layer than from the second line layer.
4. The semiconductor device according to claim 1 ,
wherein in a plan view of the semiconductor device, the second line bypasses an end portion of the first line to prevent the first line and the second line from overlapping each other.
5. The semiconductor device according to claim 1 , further comprising:
a third line opposed to at least one of the first line or the second line, the third line and the at least one of the first line or the second line being included in one of or different ones of the plurality of line layers,
wherein the third line includes an extending portion that extends from a via contact.
6. The semiconductor device according to claim 5 ,
wherein a length of the extending portion is greater than a smallest dimension specified by a design rule of the semiconductor device.
7. A semiconductor device comprising:
a plurality of line layers;
a first line; and
a second line that is not connected to the first line and is provided to transfer a signal having a level same as a level of a signal transferred through the first line, wherein:
the first line and the second line are included in different layers out of the plurality of line layers, and a distance between the first line and the second line is longer than an interlayer distance between line layers next to each other out of the plurality of line layers, and
wherein the first line and the second line are included in a built-in soft error resiliency (BISER) flip-flop circuit.
8. The semiconductor device according to claim 7 ,
wherein in a plan view of the semiconductor device, the semiconductor device includes an overlapping portion in which the first line and the second line overlap each other, and
a distance between the first line and the second line in the overlapping portion is at least twice the interlayer distance.
9. The semiconductor device according to claim 8 ,
wherein in the plan view of the semiconductor device, the first line and the second line cross each other in the overlapping portion,
the second line includes:
a first partial line in which the overlapping portion is included;
a second partial line connected to a first end of the first partial line; and
a third partial line connected to a second end of the first partial line,
the first partial line is included in a first line layer,
the second partial line and the third partial line are included in a second line layer different from the first line layer, and are each connected to the first partial line through a via contact, and
the first line is included in a third line layer farther from the first line layer than from the second line layer.
10. The semiconductor device according to claim 7 ,
wherein in a plan view of the semiconductor device, the second line bypasses an end portion of the first line to prevent the first line and the second line from overlapping each other.
11. The semiconductor device according to claim 7 , further comprising:
a third line opposed to at least one of the first line or the second line, the third line and the at least one of the first line or the second line being included in one of or different ones of the plurality of line layers,
wherein the third line includes an extending portion that extends from a via contact.
12. The semiconductor device according to claim 11 ,
wherein a length of the extending portion is greater than a smallest dimension specified by a design rule of the semiconductor device.