Gate-all-around device with protective dielectric layer and method of forming the same
Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a substrate; semiconductor layers over the substrate, wherein the semiconductor layers are separate from each other and are stacked up along a direction generally perpendicular to a top surface of the substrate; a dielectric feature over and separate from the semiconductor layers; and a gate structure wrapping around each of the semiconductor layers, the gate structure having a gate dielectric layer and a gate electrode layer, wherein the gate dielectric layer interposes between the gate electrode layer and the dielectric feature and the dielectric feature is disposed over at least a part of the gate electrode layer.
1. A method comprising:
forming a stack of semiconductor layers over a substrate, the stack of semiconductor layers including a first semiconductor layer and a second semiconductor layer;
forming a protective dielectric layer directly on the second semiconductor layer, wherein the forming of the protective dielectric layer directly on the second semiconductor layer includes:
forming a hard mask on the protective dielectric layer;
patterning the protective dielectric layer and the stack of semiconductor layers while using the hard mask as a mask; and
removing the hard mask;
forming a first gate dielectric layer directly on the protective dielectric layer;
removing the first gate dielectric layer to expose the protective dielectric layer;
removing a first portion of the second semiconductor layer;
forming a second gate dielectric layer directly on the protective dielectric layer and the first semiconductor layer; and
forming a gate electrode around the second gate dielectric layer.
2. The method of claim 1 , further comprising:
removing a second portion of the second semiconductor layer such that the first portion of the second semiconductor layer remains after the removing of the second portion of the second semiconductor layer; and
forming a first spacer feature directly on the first portion of the second semiconductor layer.
3. The method of claim 2 , further comprising forming a source/drain feature on the substrate, the source/drain feature interfacing with the first spacer feature and the first semiconductor layer.
4. The method of claim 2 , wherein the first spacer feature extends from the protective dielectric layer to the first semiconductor layer after the forming of the first spacer feature directly on the first portion of the second semiconductor layer.
5. The method of claim 2 , wherein the first spacer feature remains after the removing of the first portion of the second semiconductor layer, and
wherein the forming of the second gate dielectric layer directly on the protective dielectric layer and the first semiconductor layer includes forming the second gate dielectric layer directly on the first spacer feature.
6. The method of claim 1 , wherein the forming of the second gate dielectric layer directly on the protective dielectric layer and the first semiconductor layer includes forming an interfacial layer directly on the protective dielectric layer and the first semiconductor layer and forming a high-k dielectric layer on the interfacial layer.
7. The method of claim 1 , wherein the forming of the first gate dielectric layer directly on the protective dielectric layer includes forming the first gate dielectric layer directly on a top surface of the protective dielectric layer, the top surface of the protective dielectric layer facing away from the substrate, and
wherein the removing of the first gate dielectric layer to expose the protective dielectric layer includes the top surface of the protective dielectric layer being exposed by the removal of the first gate dielectric layer.
8. The method of claim 1 , further comprising removing a portion of the second gate dielectric layer and a portion of the gate electrode to expose a portion of the protective dielectric layer.
9. The method of claim 1 , further comprising forming an etch stop layer directly on a sidewall of the protective dielectric layer after the forming of the first gate dielectric layer directly on the protective dielectric layer.
10. A method comprising:
forming a fin structure on a substrate, the fin structure including a first semiconductor layer, a second semiconductor disposed over the first semiconductor layer and a protective dielectric layer disposed over the second semiconductor layer;
removing a first portion of the second semiconductor layer such that a second portion of the second semiconductor layer remains disposed over the first semiconductor layer after the removing of the first portion of the second semiconductor layer;
forming a first spacer feature along a sidewall of the second portion of the second semiconductor layer;
removing the second portion of the second semiconductor layer to form an air gap between the protective dielectric layer and the first semiconductor layer;
forming a gate structure within the air gap, the gate structure including a first gate dielectric and a first gate electrode, the first gate dielectric interfacing with at least one of the protective dielectric layer and the first semiconductor layer; and
forming a second gate dielectric directly on the protective dielectric layer prior to the removing of the first portion of the second semiconductor layer.
11. The method of claim 10 , wherein the forming of the gate structure within the air gap includes forming the gate structure over the protective dielectric layer such that a top surface of the protective dielectric layer is covered by the gate structure.
12. The method of claim 11 , further comprising removing a portion of the gate structure to expose the top surface of the protective dielectric layer.
13. The method of claim 12 , further comprising:
forming an etch stop layer directly on the exposed top surface of the protective dielectric layer; and
forming a contact through the etch stop layer to the first gate electrode of the gate structure.
14. A method of forming a semiconductor device, comprising:
receiving a structure including a substrate and a stack of first semiconductor layers and second semiconductor layers alternately disposed over the substrate, wherein a topmost layer of the stack is one of the first semiconductor layers and includes a different material than the second semiconductor layers and the substrate;
forming a protective dielectric layer over the stack, wherein a bottom surface of the protective dielectric layer directly contacts a top surface of the topmost layer of the stack, wherein forming the protective dielectric layer includes:
depositing the protective dielectric layer over the topmost layer of the stack;
depositing a hard mask over the protective dielectric layer;
patterning the hard mask;
etching the protective dielectric layer and the stack using the hard mask as etch mask; and
removing the hard mask;
selectively removing the first semiconductor layers such that the second semiconductor layers and the protective dielectric layer are suspended over the substrate; and
after the selectively removing, forming a metal gate stack wrapping around the second semiconductor layers and the protective dielectric layer.
15. The method of claim 14 , further comprising:
planarizing the metal gate stack to expose the protective dielectric layer.
16. The method of claim 15 , further comprising:
recessing a top portion of the metal gate stack;
depositing a conductive material over the recessed metal gate stack and the protective dielectric layer; and
planarizing the conductive material to expose the protective dielectric layer.
17. The method of claim 15 , further comprising:
depositing an interlayer dielectric layer over the metal gate stack and the protective dielectric layer.
18. The method of claim 14 , before the selectively removing, further comprising:
forming a dummy gate structure over the protective dielectric layer and the stack;
forming a gate spacer along a sidewall of the dummy gate structure;
forming an epitaxial source/drain feature connecting to the second semiconductor layers; and
removing the dummy gate structure to expose the protective dielectric layer and the stack.
19. The method of claim 18 , further comprising:
removing a portion of the protective dielectric layer and the stack to form a trench exposing the substrate;
from the trench, selectively removing portions of the first semiconductor layers to form gaps; and
forming an inner spacer in the gaps.
20. The method of claim 14 , wherein forming the metal gate stack includes:
depositing a gate dielectric layer to wrap around the second semiconductor layers and the protective dielectric layer; and
depositing a gate electrode layer over the gate dielectric layer.