Magnetic tunneling junction device and memory device including the same

1. A magnetic tunneling junction device comprising:

a free layer having a first surface and a second surface opposite the first surface;

a pinned layer facing the first surface of the free layer;

a first oxide layer between the pinned layer and the free layer; and

a second oxide layer on the second surface of the free layer,

wherein the free layer comprises a magnetic material doped with a non-magnetic metal,

the second oxide layer comprises a metal oxide, and

a first oxygen affinity of a metal in the metal oxide of the second oxide layer is greater than a second oxygen affinity of the non-magnetic metal of the free layer.

2. The magnetic tunneling junction device of claim 1 ,

wherein the magnetic material of the free layer comprises at least one of Fe, Co, Ni, Mn, a Fe-containing alloy, a Co-containing alloy, a Ni-containing alloy, a Mn-containing alloy and a Heusler alloy.

3. The magnetic tunneling junction device of claim 2 ,

wherein the non-magnetic metal of the free layer comprises at least one of Mg, Ru, Ir, Ti, Zn, Ga, Ta, Al, Mo, Zr, Sn, W, Sb, V, Nb, Cr, Ge, Si, Hf, Tb, Sc, Y, Rh, In, Ca, Sr, Ba, Be, V, Mn, Li, Cd, Pb, Ga, and Mo.

4. The magnetic tunneling junction device of claim 3 ,

wherein the metal in the metal oxide of the second oxide layer comprises at least one metal element having an oxygen affinity greater than that of the non-magnetic metal of the free layer, the at least one metal element being at least one of Mg, B, Fe, Co, Ni, Ru, Ir, Ti, Zn, Ga, Ta, Al, Mo, Zr, Sn, W, Sb, V, Nb, Cr, Ge, Si, Hf, Tb, Sc, Y, Ru, Rh, and In.

5. The magnetic tunneling junction device of claim 4 ,

wherein at least one of

the non-magnetic metal of the free layer is aluminum (Al), and the metal in the metal oxide of the second oxide layer comprises at least one metal element selected from Ti, Zr, Hf, Tb, Sc, and Y,

the non-magnetic metal of the free layer is molybdenum (Mo), and the metal in the metal oxide of the second oxide layer comprises at least one metal element selected from Mg, B, Ti, Ga, Ta, Al, Zr, Sn, W, V, Nb, Cr, Si, Hf, Tb, Sc, and Y, and

the non-magnetic metal of the free layer is tantalum (Ta), the metal in the metal oxide of the second oxide layer comprises at least one metal element selected from Ti, Al, Zr, Hf, Tb, Sc, and Y.

6. The magnetic tunneling junction device of claim 4 ,

wherein the non-magnetic metal of the free layer comprises at least one metal element selected from Mg, Ru, Ir, Zn, Ga, Mo, Sn, W, Sb, V, Nb, Cr, Ge, Rh, and In, and

the metal in the metal oxide of the second oxide layer comprises at least one metal element selected from Ti, Ta, Al, Zr, Si, Hf, Tb, Sc, and Y.

7. The magnetic tunneling junction device of claim 1 ,

wherein the metal oxide of the second oxide layer has a first oxide formation energy greater than a second oxide formation energy of the oxide of the non-magnetic metal in the free layer.

8. The magnetic tunneling junction device of claim 1 ,

wherein a doping concentration of the non-magnetic metal in the free layer is in a range of about 5 at % to about 50 at %.

9. The magnetic tunneling junction device of claim 1 ,

wherein the free layer further comprises boron (B).

10. The magnetic tunneling junction device of claim 9 ,

wherein a boron concentration of the free layer is in a range of about 5 at % to about 50 at %.

11. The magnetic tunneling junction device of claim 9 ,

wherein the second oxide layer further comprises boron absorbed from the free layer.

12. The magnetic tunneling junction device of claim 1 ,

wherein the first oxide layer comprises a metal oxide having a stoichiometrically oxygen-deficient composition.

13. The magnetic tunneling junction device of claim 12 ,

wherein the first oxide layer comprises a first region adjacent to the pinned layer, and a second region adjacent to the free layer, and

a first proportion of oxygen or nitrogen in the second region is greater than a second proportion of a respective one of oxygen or nitrogen in the first region.

14. The magnetic tunneling junction device of claim 13 ,

wherein the first oxide layer further comprises a metal layer between the first region and the second region.

15. The magnetic tunneling junction device of claim 1 ,

wherein the second oxide layer comprises a metal oxide having a stoichiometrically oxygen-deficient composition.

16. A magnetic tunneling junction device comprising:

a free layer having a first surface and a second surface opposite the first surface;

a pinned layer facing the first surface of the free layer;

a first oxide layer between the pinned layer and the free layer; and

a second oxide layer on the second surface of the free layer,

wherein the free layer comprises a magnetic material doped with a non-magnetic metal,

the second oxide layer comprises a metal oxide,

the non-magnetic metal of the free layer comprises at least one of Mg, Ru, Ir, Ti, Zn, Ga, Ta, Al, Mo, Zr, Sn, W, Sb, V, Nb, Cr, Ge, Si, Hf, Tb, Sc, Y, Rh, In, Ca, Sr, Ba, Be, V, Mn, Li, Cd, Pb, Ga, and Mo, and

the metal in the metal oxide of the second oxide layer comprises at least one metal element having an oxygen affinity higher than that of the non-magnetic metal of the free layer, the at least one metal element selected from Mg, B, Fe, Co, Ni, Ru, Ir, Ti, Zn, Ga, Ta, Al, Mo, Zr, Sn, W, Sb, V, Nb, Cr, Ge, Si, Hf, Tb, Sc, Y, Ru, Rh, and In.

17. A magnetic tunneling junction device comprising:

a free layer having a first surface and a second surface opposite the first surface;

a pinned layer facing the first surface of the free layer;

a first oxide layer between the pinned layer and the free layer;

a second oxide layer on the second surface of the free layer; and

a capping metal layer in contact with the second oxide layer,

wherein the free layer comprises a magnetic material doped with a non-magnetic metal, and

the capping metal layer comprises a metal having a first oxygen affinity greater than a second oxygen affinity of the non-magnetic metal of the free layer.

18. The magnetic tunneling junction device of claim 17 ,

wherein the magnetic material of the free layer comprises at least one of Fe, Co, Ni, Mn, a Fe-containing alloy, a Co-containing alloy, a Ni-containing alloy, a Mn-containing alloy and a Heusler alloy.

19. The magnetic tunneling junction device of claim 18 ,

wherein the non-magnetic metal of the free layer comprises at least one of Mg, Ru, Ir, Ti, Zn, Ga, Ta, Al, Mo, Zr, Sn, W, Sb, V, Nb, Cr, Ge, Si, Hf, Tb, Sc, Y, Rh, In, Ca, Sr, Ba, Be, V, Mn, Li, Cd, Pb, Ga, and Mo.

20. The magnetic tunneling junction device of claim 19 ,

wherein the metal of the capping metal layer comprises at least one metal element having a first oxygen affinity greater than a second oxygen affinity of the non-magnetic metal of the free layer, the at least one metal element selected from Mg, B, Fe, Co, Ni, Ru, Ir, Ti, Zn, Ga, Ta, Al, Mo, Zr, Sn, W, Sb, V, Nb, Cr, Ge, Si, Hf, Tb, Sc, Y, Ru, Rh, and In.

21. The magnetic tunneling junction device of claim 20 ,

wherein at least one of the non-magnetic metal of the free layer is aluminum (Al), and the metal of the capping metal layer comprises at least one metal element selected from Ti, Zr, Hf, Tb, Sc, and Y,

the non-magnetic metal of the free layer is molybdenum (Mo), and the metal of the capping metal layer comprises at least one metal element selected from Mg, B, Ti, Ga, Ta, Al, Zr, Sn, W, V, Nb, Cr, Si, Hf, Tb, Sc, and Y, and

the non-magnetic metal of the free layer is tantalum (Ta), and the metal of the capping metal layer comprises at least one metal element selected from Ti, Al, Zr, Hf, Tb, Sc, and Y.

22. The magnetic tunneling junction device of claim 20 ,

wherein the non-magnetic metal of the free layer comprises at least one metal element selected from Mg, Ru, Ir, Zn, Ga, Mo, Sn, W, Sb, V, Nb, Cr, Ge, Rh, and In, and

the metal of the capping metal layer comprises at least one metal element selected from Ti, Ta, Al, Zr, Si, Hf, Tb, Sc, and Y.

23. The magnetic tunneling junction device of claim 17 ,

wherein a doping concentration of the non-magnetic metal in the free layer is in a range of about 5 at % to about 50 at %.

24. The magnetic tunneling junction device of claim 17 ,

wherein the free layer further comprises boron (B).

25. The magnetic tunneling junction device of claim 24 ,

wherein the second oxide layer further comprises boron absorbed from the free layer.

26. A memory device comprising:

a plurality of memory cells each comprising a switching device connected to a magnetic tunneling junction device,

wherein the magnetic tunneling junction device comprises,

a free layer having a first surface and a second surface opposite the first surface,

a pinned layer facing the first surface of the free layer,

a first oxide layer between the pinned layer and the free layer, and

a second oxide layer on the second surface of the free layer,

wherein the free layer comprises a magnetic material doped with a non-magnetic metal,

the second oxide layer comprises a metal oxide, and

a first oxygen affinity of a metal in the metal oxide of the second oxide layer is greater than a second oxygen affinity of the non-magnetic metal of the free layer.

27. A memory device comprising:

a plurality of memory cells each comprising a switching device connected to a magnetic tunneling junction device,

wherein the magnetic tunneling junction device comprises,

a free layer having a first surface and a second surface opposite the first surface,

a pinned layer facing the first surface of the free layer,

a first oxide layer between the pinned layer and the free layer,

a second oxide layer disposed on the second surface of the free layer, and

a capping metal layer disposed in contact with the second oxide layer,

wherein the free layer comprises a magnetic material doped with a non-magnetic metal, and

the capping metal layer comprises a metal having a first oxygen affinity greater than a second oxygen affinity of the non-magnetic metal of the free layer.