FLEXIBLE THERMAL SYSTEM
A thermal system configured to mechanically bend and provide a thermal conduit to transfer heat through an electronic device, and an electronic device having a bent or curved profile or a mechanical articulation or coupler between a first location and a second location, and equipped with a thermal system configured to extend through or along the bent or curved profile or mechanical articulation or coupler of the electronic device and transfer heat from the first location of the electronic device to the second location of the electronic device
1 . An electronic device comprising:
a first elongated portion;
a second elongated portion;
a coupler interposed between the first elongated portion and the second elongated portion, the coupler attached to the first elongated portion and the second elongated portion and configured to provide mechanical articulation of the second elongated portion relative to the first elongated portion; and
a thermal system extending from the first elongated portion to the second elongated portion and configured to extend across the coupler, the thermal system comprising a flexible portion having a fiber wick extending through at least a portion of a hollow internal space of the flexible portion.
2 . The electronic device of claim 1 , the thermal system further comprising a first thermal management component comprising a first heat pipe, a first vapor chamber, or both.
3 . The electronic device of claim 2 , further comprising a bellows as an integral part of the first thermal management component.
4 . The electronic device of claim 2 , the thermal system further comprising a second thermal management component comprising a second heat pipe, second vapor chamber, or both.
5 . The electronic device of claim 4 , wherein the flexible portion is connected to one end of the first thermal management component and one end of the second thermal management component.
6 . The electronic device of claim 5 , the flexible portion comprising a connecting bellows comprising nickel.
7 . The electronic device of claim 5 , the flexible portion comprising a hollow connector.
8 . The electronic device of claim 7 , the hollow connector comprising a polypropylene, a polyethylene terephthalate, or a polyimide.
9 . The electronic device of claim 8 , wherein the polyimide comprises a metal laminated poly-oxydiphenylene-pyromellitimide.
10 . The electronic device of claim 8 , the polyethylene terephthalate comprises a molecular weight of at least about 5,000,000 gr/mol.
11 . The electronic device of claim 4 , the thermal system further comprising at least one of a mesh wick extending from the first thermal management component to the second thermal management component and through the flexible portion.
12 . The electronic device of claim 1 , the fiber wick comprises a metal coating.
13 . The electronic device of claim 1 , wherein the first elongated portion comprises a portion of a frame of a head-mounted device and the second elongated portion comprises a strap or temple arm of the head mounted device.
14 . A bendable thermal system comprising:
a first longitudinal end;
a second longitudinal end;
a flexible portion disposed between the first longitudinal end and the second longitudinal end; and
a fiber wick provided inside the flexible portion.
15 . The bendable thermal system of claim 14 , the flexible portion comprising polyethylene terephthalate having a thermal conductivity of 25 W/mK or higher.
16 . The bendable thermal system of claim 14 , wherein the flexible portion comprises a metal laminated polyimide.
17 . The bendable thermal system of claim 14 , wherein the flexible portion comprises nickel.
18 . The bendable thermal system of claim 14 , further comprising a thermal management component selected from a single heat pipe or a single vapor chamber, wherein the thermal management component comprises the first longitudinal end and the second longitudinal end.
19 . A bendable thermal system comprising:
a first thermal management component comprising a first sealed, rigid structure;
a second thermal management component comprising a second sealed rigid structure; and
a solid connector connected to one end of the first thermal management component and to one end of the second thermal management component, the solid connector configured to transfer heat from the first thermal management component to the second thermal management component.
20 . The bendable thermal system of claim 19 , wherein the solid connector comprises graphite, titanium, or a combination thereof.