Multichip package with protocol-configurable data paths
Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.
1. A single package multi-die electronic device, comprising:
an integrated circuit die having first input/output circuitry configured to operate in:
a first mode in which a read clock signal or a write clock signal has a first frequency; and
a second mode in which the read clock signal or the write clock signal has a second frequency that is different than the first frequency; and
a second die communicatively coupled to the integrated circuit die within the single package multi-die electronic device.
2. The single package multi-die electronic device of claim 1 , wherein the second die comprises second input/output circuitry and is communicatively coupled to the integrated circuit die via the second input/output circuitry.
3. The single package multi-die electronic device of claim 2 , comprising:
a third die having third input/output circuitry configured to operate in the first mode and the second mode; and
a fourth die having fourth input/output circuitry configured to operate in the first mode and the second mode.
4. The single package multi-die electronic device of claim 2 , wherein the second input/output circuitry is configured to operate in the first mode and the second mode.
5. The single package multi-die electronic device of claim 4 , wherein the first and second input/output circuitry are configured to simultaneous operate in the first mode.
6. The single package multi-die electronic device of claim 4 , wherein the first input/output circuitry is configured to operate in the first mode while the second input/output circuitry is operating in the second mode.
7. The single package multi-die electronic device of claim 1 , wherein the integrated circuit die is configured to switch between operating in the first and second modes.
8. The single package multi-die electronic device of claim 1 , wherein:
the integrated circuit die is a first processor die; and
the second die is a second processor die.
9. The single package multi-die electronic device of claim 1 , wherein:
the integrated circuit die is a programmable logic device; and
the second die is a transceiver die.
10. The single package multi-die electronic device of claim 1 , wherein the read clock signal and the write clock signal are generated based on a same clock source.
11. The single package multi-die electronic device of claim 1 , wherein the second frequency is double the first frequency.
12. A system, comprising:
a first die of a first single package multi-die device having first input/output circuitry; and
an integrated circuit die of the first single package multi-die device communicatively coupled to the first die and having second input/output circuitry, wherein the second input/output circuitry is configured to operate in:
a first mode in which a read clock frequency or a write clock frequency has a first frequency; and
a second mode in which the read clock frequency or the write clock frequency is a second frequency that is double the first frequency.
13. The system of claim 12 , comprising a third die of a second single package multi-die device, wherein the third die comprises third input/output circuitry and is communicatively coupled to the integrated circuit die.
14. The system of claim 13 , wherein the third input/output circuitry is configured to operate in the first mode and the second mode.
15. The system of claim 12 , wherein:
in the first mode, the read clock frequency is the first frequency; and
in the second mode, the read clock frequency is the second frequency.
16. The system of claim 12 , wherein:
in the first mode, the write clock frequency is the first frequency; and
in the second mode, the write clock frequency is the second frequency.
17. The system of claim 12 , wherein:
the first die is a first processor die or a transceiver die; and
the second die is a second processor die or a programmable logic device.
18. A method, comprising:
during a first mode of operation, providing a write clock signal and a read clock signal having a first frequency to input/output circuitry of a first die of a single package multi-die electronic device;
during a second mode of operation, providing a write clock signal and a read clock signal having different frequencies to the input/output circuitry of the first die; and
transmitting data to or receiving data from a second die of the single package multi-die electronic device.
19. The method of claim 18 , wherein:
the input/output circuitry comprises a transmit buffer and a receive buffer; and
the method comprises:
compressing, via the transmit buffer, data to be transmitted during the second mode operation;
decompressing, via the receive buffer, received data during the second mode of operation; or
both.
20. The method of claim 18 , wherein:
the first die is a first processor die or a transceiver die; and
the second die is a second processor die or a programmable logic device.