IP Library › Granted Patent US 11,929,330

Granted Patent B2

US 11,929,330 · App. 17/712,944 · Granted Mar 12, 2024

Lithographic cavity formation to enable EMIB bump pitch scaling

Inventors: Kristof Darmawikarta (Chandler, AZ); Hiroki Tanaka (Chandler, AZ); Robert May (Chandler, AZ); Sameer Paital (Chandler, AZ); Bai Nie (Chandler, AZ); Jesse Jones (Chandler, AZ); Chung Kwang Christopher Tan (Chandler, AZ)

Assignee: Intel Corporation

H01L23/538 H01L23/5226 H01L23/5381 H01L24/82 H01L2224/12105

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Quick Facts

Patent No.: US 11,929,330
App. No.: 17/712,944
Granted: Mar 12, 2024
Kind: B2

External Links

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Abstract

Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.

Claims (45)

1. An electronic package, comprising:

a first layer, wherein the first layer comprises an organic material;

a second layer over the first layer, wherein the second layer comprises an organic material;

a conductive pillar in the second layer;

a cavity through the second layer to expose a first surface of the first layer;

a bridge substrate in the cavity, wherein the bridge substrate is supported by and in contact with the first surface of the first layer; and

a third layer, wherein the third layer fills the cavity and is over a top surface of the second layer, wherein the third layer has a planar surface over an entirety of the bridge substrate, and wherein the third layer is a single layer having a same composition continuous throughout the third layer.

2. The electronic package of claim 1 , wherein the cavity includes a first portion and a second portion above the first portion, wherein a width of the first portion is greater than a width of the second portion.

3. The electronic package of claim 2 , wherein a height of the first portion of the cavity is equal to a height of a first conductive layer over the first layer.

4. The electronic package of claim 3 , wherein a height of the second portion of the cavity is equal to a height of the conductive pillar over the first conductive layer.

5. The electronic package of claim 2 , wherein a sidewall surface of the first portion of the cavity and a sidewall surface of the second portion of the cavity are substantially vertical.

6. The electronic package of claim 1 , wherein the third layer conforms to sidewall surfaces of the cavity.

7. The electronic package of claim 1 , further comprising:

a conductive layer over the third layer, wherein the conductive layer is electrically coupled to a contact pad on the bridge substrate with a via through a portion of the third layer.

8. The electronic package of claim 1 , wherein a top surface of the second layer is above a top surface of the bridge substrate.

9. An electronic package, comprising:

a first layer, wherein the first layer comprises an organic material;

a second layer over the first layer, wherein the second layer comprises an organic material;

a conductive pillar in the second layer;

a cavity through the second layer to expose a first surface of the first layer, wherein the cavity includes a first portion and a second portion above the first portion, wherein a width of the first portion is greater than a width of the second portion; and

a bridge substrate in the cavity, wherein the bridge substrate is supported by and in contact with the first surface of the first layer.

10. The electronic package of claim 9 , wherein a height of the first portion of the cavity is equal to a height of a first conductive layer over the first layer.

11. The electronic package of claim 10 , wherein a height of the second portion of the cavity is equal to a height of the conductive pillar over the first conductive layer.

12. The electronic package of claim 9 , wherein a sidewall surface of the first portion of the cavity and a sidewall surface of the second portion of the cavity are substantially vertical.

13. The electronic package of claim 9 , wherein a top surface of the second layer is above a top surface of the bridge substrate.

14. An electronic package, comprising:

a first layer, wherein the first layer comprises an organic material;

a second layer over the first layer, wherein the second layer comprises an organic material;

a conductive pillar in the second layer;

a cavity through the second layer to expose a first surface of the first layer;

a bridge substrate in the cavity, wherein the bridge substrate is supported by and in contact with the first surface of the first layer;

a third layer, wherein the third layer fills the cavity and is over a top surface of the second layer, and wherein the third layer is a single layer having a same composition continuous throughout the third layer; and

a conductive layer over the third layer, wherein the conductive layer is electrically coupled to a contact pad on the bridge substrate with a via through a portion of the third layer.

15. The electronic package of claim 14 , wherein the third layer conforms to sidewall surfaces of the cavity.

16. The electronic package of claim 14 , wherein a top surface of the second layer is above a top surface of the bridge substrate.

17. An electronic package, comprising:

a first layer, wherein the first layer comprises an organic material;

a second layer over the first layer, wherein the second layer comprises an organic material;

a conductive pillar in the second layer;

a bridge substrate in the cavity, wherein the bridge substrate is supported by and in contact with the first surface of the first layer; and

a third layer, wherein the third layer fills the cavity and is over a top surface of the second layer, and wherein the third layer has a planar surface over an entirety of the bridge substrate.

18. The electronic package of claim 17 , wherein a height of the first portion of the cavity is equal to a height of a first conductive layer over the first layer.

19. The electronic package of claim 18 , wherein a height of the second portion of the cavity is equal to a height of the conductive pillar over the first conductive layer.

20. The electronic package of claim 17 , wherein a sidewall surface of the first portion of the cavity and a sidewall surface of the second portion of the cavity are substantially vertical.

Continuity (2)

Continuation 15934343 · Mar 23, 2018

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