Display device and method of providing the same
A display device includes a display panel, a circuit board, a first conductive film, first and second lower films, and first and second adhesive layers. The display panel includes a display area and a pad area which includes a first pad part. The circuit board is attached on the display panel and includes a lead part overlapping the first pad part. The first conductive film is between the display panel and the circuit board and electrically connects the first pad part and the lead part to each other. The first and second lower films are attached to the display panel to respectively correspond to the display area and the pad area. A thickness of the second adhesive layer between the display panel and the second lower film is less than a thickness of the first adhesive layer between the display panel and the first lower film.
1. A method of providing a display device, the method comprising:
providing a display module including:
a display panel including a display area and a pad area which includes a first pad part,
a first lower film attached to the display panel at the display area, and a second lower film attached to the display panel at the pad area,
a first adhesive layer which attaches the first lower film to the display panel at the display area, the first adhesive layer having a first thickness, and
a second adhesive layer which attaches the second lower film to the display panel at the pad area, the second adhesive layer having a preliminary thickness which is the same as the first thickness;
providing first pressing of the second adhesive layer which has the preliminary thickness to form a pre-pressed display module including the first pad part;
providing a first conductive film on the first pad part of the pre-pressed display module;
providing a circuit board facing the first pad part of the pre-pressed display module with the first conductive film therebetween; and
providing second pressing of the second adhesive layer to electrically connect the first pad part of the pre-pressed display module to the circuit board,
wherein the first pressing includes pressing only a portion of the second adhesive layer which corresponds to the first pad part of the display panel.
2. The method of claim 1 , wherein the first pressing of the second adhesive layer which has the preliminary thickness provides the second adhesive layer having a second thickness which is less than the first thickness of the first adhesive layer.
3. The method of claim 2 , wherein the second pressing of the second adhesive layer maintains the second adhesive layer having the second thickness.
4. The method of claim 3 , wherein the second pressing of the second adhesive layer provides the second adhesive layer having a uniform thickness.
5. The method of claim 3 , wherein
the display panel of the display module further includes a second pad part spaced apart from the first pad part;
the providing of the first pressing of the second adhesive layer forms the pre-pressed display module further including the second pad part; and
the method further comprises:
providing a second conductive film on the second pad part of the pre-pressed display module;
providing a driving circuit chip facing the second pad part of the pre-pressed display module with the second conductive film therebetween; and
providing a third pressing of the second adhesive layer to electrically connect the second pad part of the pre-pressed display module to the driving circuit chip.
6. The method of claim 5 , wherein the third pressing of the second adhesive layer maintains the second adhesive layer having the second thickness.
7. The method of claim 1 , wherein
the second pressing includes pressing the second adhesive layer with a first pressure, and
the first pressing includes pressing the second adhesive layer with a second pressure equal to or greater than the first pressure.
8. The method of claim 1 , wherein
the second pressing includes pressing the second adhesive layer together with heating the pad area of the display panel to a first temperature, and
the first pressing includes pressing the second adhesive layer together with heating the pad area of the display panel to a second temperature equal to or greater than the first temperature.
9. The method of claim 1 , wherein
the providing of the first pressing of the second adhesive layer forms the pre-pressed display module further including a protrusion of the second adhesive layer which protrudes from the second lower film; and
the method further comprises removing at least a portion of the protrusion of the second adhesive layer.
10. The method of claim 1 , wherein
the pre-pressed display module further includes the display panel which is unbent and
the providing of the circuit board includes disposing the circuit board facing the display panel which is unbent.