Giant nonreciprocity of surface acoustic waves enabled by the magnetoelastic interaction
View Patent ↗A nonreciprocal microwave transmission device includes a substrate, a transducer on a surface of the substrate and configured to reciprocally convert between electrical signals to acoustic waves, a first piezoelectric material configured to generates and transports acoustic waves from a signal applied to the transducer, and a thin film magnetic material configured to couple to acoustic waves through magnetoelastic coupling so as to have non-reciprocal magnetoelastic coupled acoustic wave transport. Transmission of acoustic waves through the thin film magnetic material is in a direction toward the transducer has a first magnitude and transmission of acoustic waves through the thin film magnetic material in a direction away from the transducer has a second magnitude, the first and second magnitude being significantly different.
1. A nonreciprocal microwave transmission device comprising:
a substrate;
a transducer on a surface of the substrate and configured to reciprocally convert between electrical signals to acoustic waves;
a first piezoelectric material configured to generates and transports acoustic waves from a signal applied to the transducer; and
a thin film magnetic material configured to couple to acoustic waves through magnetoelastic coupling so as to have non-reciprocal magnetoelastic coupled acoustic wave transport,
wherein transmission of acoustic waves through the thin film magnetic material in a direction toward the transducer has a first magnitude and transmission of acoustic waves through the thin film magnetic material in a direction away from the transducer has a second magnitude, the first and second magnitude being significantly different.
2. The device of claim 1 , wherein the transducer comprises a first pair of split-finger interdigital transducers.
3. The device of claim 2 , wherein the thin film magnetic material on the surface of the substrate is positioned proximate to the first pair of split-finger interdigital transducers such that acoustic waves emitted from the first pair of split-finger interdigital transducers are received by the thin film magnetic material.
4. The device of claim 3 , further comprising:
a second pair of split-finger interdigital transducers positioned proximate to the thin film magnetic material and opposite to the first pair of split-finger interdigital transducers such that the thin film magnetic material is positioned between the first and second pairs of split-finger interdigital transducers.
5. The device of claim 4 , further comprising:
a third pair of split-finger interdigital transducers positioned proximate to the thin film magnetic material and opposite to the first and second pairs of split-finger interdigital transducers such that the thin film magnetic material is positioned between the first, second, and third pairs of split-finger interdigital transducers.
6. The device of claim 5 comprising a microwave circulator.
7. The device of claim 1 , wherein the thin film magnetic material is locally patterned onto the surface of the substrate and the first piezoelectric material is conformally coated over the surface of the substrate and the thin film magnetic material.
8. The device of claim 1 , wherein the substrate comprises diamond.
9. The device of claim 1 , wherein the first piezoelectric material comprises a thin film coating on the surface of the substrate and the thin film magnetic material is coated on the thin film of the first piezoelectric material.
10. The device of claim 9 , wherein the substrate comprises diamond.
11. The device of claim 1 , wherein the substrate comprises a second piezoelectric material.
12. The device of claim 1 , wherein the second piezoelectric material is selected from the group consisting of LiNbO 3 , y-cut LiNbO 3 , ZnO, AlN, quartz, and GaAs.
13. The device of claim 1 , wherein the thin film magnetic material comprises a single magnetic material and a symmetry breaking heavy metal.
14. The device of claim 13 , wherein the thin film magnetic material is platinum with a nonreciprocal acoustic wave transport.
15. The device of claim 1 , the thin film magnetic material comprises a single magnetic material and a semiconductor having interfacial symmetry breaking for nonreciprocal acoustic wave transport.
16. The device of claim 1 , wherein the thin film magnetic material comprises a single ferrimagnetic material with nonreciprocal magnetoelastic transport.
17. The device of claim 16 , wherein the single ferromagnetic material is a ferrite or a yttrium iron garnet.
18. The device of claim 1 , wherein the thin film magnetic material comprises is composed of a single anti-ferromagnetic material with nonreciprocal magnetoelastic transport.
19. The device of claim 1 , wherein the single anti-ferromagnetic material is a nickel oxide.
20. The device of claim 1 , wherein the thin film magnetic material comprises a composite.
21. The device of claim 20 , wherein the composite comprises a stack of alternating layers of a first material and a second material.
22. The device of claim 21 , wherein the first material is magnetic and the second material is dielectric.
23. The device of claim 22 , where the layers of the first material are antiferromagnetically coupled across layers of the second material.
24. The device of claim 21 , wherein the first material is FeGaB and the second material is Al 2 O 3 .
25. The device of claim 24 , wherein a thickness of the Al 2 O 3 is about 70 nm.
26. The device of claim 20 , wherein the composite has a thickness ranging from about 1 μm to about 10 mm.
27. The device of claim 20 , wherein the composite has a width ranging from about 1 μm to about 1 mm.
28. The device of claim 2 , wherein the first pair of split-finger interdigital transducers comprises an input transducer electrode and an output transducer electrode, the input transducer electrode having a width that is different from a width of the output transducer electrode, wherein differing widths of the input and output transducer electrodes provides a chirped spacing configured to control a frequency bandwidth of the device.
29. The device of claim 4 , wherein spacings of the first and second pairs of split-finger interdigital transducers differ and electrodes of the first and second pairs of split-finger interdigital transducer are slanted, wherein differing spacings between the slanted electrodes is configured to control a frequency bandwidth of the device.
30. The device of claim 4 , wherein spacings of the first and second pairs of split-finger interdigital transducers designed such that the acoustic waves are focused and a power density of the thin film magnetic material is high to enable non-linear behavior.
31. The device of claim 1 , wherein a residual stress is applied to induce strain bias in the thin film magnetic material configured to offset a frequency of the magnetoelastic coupling.
32. The device of claim 1 , further comprising:
a permanent magnet or an electromagnet configured to alter a frequency of the magnetoelastic coupling.
33. The device of claim 32 , where the permanent magnet or the electromagnet is positioned at an arbitrary angle with respect to the device and is configured to alter the non-reciprocal transmission and isolation.
34. The device of claim 1 , further comprising:
a pair of uniform electrodes configured to supply a low frequency electric field that alters a frequency of the magnetoelastic coupling.
35. The device of claim 34 , wherein the device is switchable.
36. A split finger interdigital transducer comprising:
a y-cut LiNbO 3 substrate;
a first interdigital transducer on a surface of the substrate;
a second interdigital transducer on the surface of the substrate and spaced away from the first interdigital transducer; and
a multilayer thin stack on the surface of the substrate and positioned between the first and second interdigital transducers.
37. The split finger interdigital transducer of claim 36 , wherein each of the first and second interdigital transducers includes 60 finger electrode pairs with an electrode separation space of λ/8.
38. The split finger interdigital transducer of claim 37 , wherein the line spacing between the finger electrode pairs of the first and second interdigital transducers is 3 mm.
39. The split finger interdigital transducer of claim 36 , wherein the multilayer thin stack comprises a first layer of FeGaB, a layer of Al 2 O 3 on the first layer, and a second layer of FeGaB on the Al 2 O 3 layer.
40. The split finger interdigital transducer of claim 39 , wherein a thickness of the Al 2 O 3 layer is 70 nm.
41. The split finger interdigital transducer of claim 36 , wherein the multilayer thin stack has a length of 2200 μm and a width of 500 μm.