Semiconductor device and method of monitoring a temperature thereof
A semiconductor device includes a temperature-independent current generator that generates a reference current substantially independent of temperature and a mirror current that is a substantial duplicate of the reference current, a pulse signal generator that samples the mirror current so as to generate a pulse signal, and a counter that obtains a number of pulse signals generated by the pulse signal generator, that permits the pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and that inhibits the pulse signal generator from generating a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is equal to the predetermined threshold value. A method for monitoring a temperature of the semiconductor device is also disclosed.
1. A semiconductor device comprising:
a temperature-independent current generator configured to generate a reference current substantially independent of temperature and a first mirror current, a second mirror current, and a third mirror current that are substantial duplicates of the reference current;
a first pulse signal generator coupled to the temperature-independent current generator and configured to sample the first mirror current so as to generate a pulse signal;
a first counter coupled to the first pulse signal generator and configured to obtain a number of pulse signals generated by the first pulse signal generator, to permit the first pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and to inhibit the first pulse signal generator from generating a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is equal to the predetermined threshold value; and
a temperature-dependent current generator configured to receive the second mirror current and the third mirror current generated by the temperature-independent current generator and to generate a temperature-dependent current based on the second mirror current and the third mirror current received thereby.
2. The semiconductor device of claim 1 , wherein the first pulse signal generator includes:
a first switch coupled between the temperature-independent current generator and a node;
a second switch coupled to the node;
a capacitor coupled in parallel with the second switch; and
a comparator having a first comparator input coupled to the node, a second comparator input configured to receive a reference voltage, and a comparator output coupled to the first counter.
3. The semiconductor device of claim 1 , wherein the temperature-independent current generator is further configured:
to generate a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current; and
to combine the PTAT current and the CTAT so as to generate the reference current.
4. The semiconductor device of claim 1 , further comprising:
a second pulse signal generator coupled to the temperature-dependent current generator and configured to sample the temperature-dependent current so as to generate a pulse signal; and
a second counter coupled to the second pulse signal generator and configured to count a number of pulse signals generated by the second pulse signal generator.
5. The semiconductor device of claim 4 , wherein the second pulse signal generator includes:
a first switch coupled between the temperature-dependent current generator and a node;
a second switch coupled to the node;
a capacitor coupled in parallel with the second switch; and
a comparator having a first comparator input coupled to the node, a second comparator input configured to receive a reference voltage, and a comparator output coupled to the second counter.
6. The semiconductor device of claim 1 , wherein the temperature-dependent current generator is further configured:
to generate one of a PTAT voltage and a CTAT voltage based on the second mirror current;
to convert the one of the PTAT voltage and the CTAT voltage into the one of a PTAT current and a CTAT current; and
to subtract the one of the PTAT current and the CTAT current from the third mirror current so as to extract the temperature-dependent current.
7. The semiconductor device of claim 1 , wherein the temperature-dependent current generator further includes a current mismatch correction circuit configured to reduce a current mismatch and the first counter is further configured to generate a chop signal for reception by and for periodically reversing a polarity of the current mismatch correction circuit.
8. The semiconductor device of claim 1 , wherein the temperature-dependent current generator further includes a voltage offset correction circuit configured to reduce a voltage offset and the first counter is further configured to generate a chop signal for reception by and for periodically reversing a polarity of the voltage offset correction circuit.
9. The semiconductor device of claim 1 , wherein the temperature-dependent current generator includes:
an operational amplifier coupled between first and second nodes;
a first element coupled to the first node; and
a second element coupled to the second node, wherein the first element has a negative temperature coefficient.
10. The semiconductor device of claim 1 , wherein the temperature-dependent current generator includes:
an operational amplifier coupled between first and second nodes;
a first element coupled to the first node; and
a second element coupled to the second node, wherein the first element has a positive temperature coefficient.
11. The semiconductor device of claim 1 , wherein the temperature-dependent current generator includes:
an operational amplifier having a first input configured to receive the second mirror current;
a first resistor coupled between the first input of the operational amplifier and an electrical ground;
a second resistor coupled between a second input of the operational amplifier and the electrical ground; and
a transistor configured to receive the third mirror current and coupled between the second input and an output of the operational amplifier.
12. The semiconductor device of claim 1 , wherein the temperature-dependent current generator includes:
an operational amplifier having a first input configured to receive the second mirror current;
a first transistor or a diode coupled between the first input of the operational amplifier and an electrical ground;
a resistor coupled between a second input of the operational amplifier and the electrical ground; and
a second transistor configured to receive the third mirror current and coupled between the second input and an output of the operational amplifier.
13. A semiconductor device comprising:
a temperature-independent current generator configured to generate a first current and a second current that are substantially independent of temperature;
a temperature-dependent current generator configured to receive the first current and the second current generated by the temperature-independent current generator and to generate a temperature-dependent current dependent of temperature based on the first current and the second current received thereby;
a second pulse signal generator coupled to the temperature-dependent current generator and configured to sample the temperature-dependent current so as to generate a pulse signal; and
a second counter coupled to the second pulse signal generator and configured to obtain a number of pulse signals generated by the second pulse signal generator, to permit the second pulse signal generator to generate a pulse signal when it is determined thereby that the number of pulse signals obtained thereby is less than a predetermined threshold value, and to inhibit the second pulse signal generator from generating a pulse signal when it is determined thereby that the number of the pulse signals obtained thereby is equal to the predetermined threshold value.
14. The semiconductor device of claim 13 , wherein the second pulse signal generator includes:
a first switch coupled between the temperature-dependent current generator and a node;
a second switch coupled to the node;
a capacitor coupled in parallel with the second switch; and
a comparator having a first comparator input coupled to the node, a second comparator input configured to receive a reference voltage, and a comparator output coupled to the second counter.
15. The semiconductor device of claim 13 , wherein the temperature-dependent current generator further includes a current mismatch correction circuit configured to reduce a current mismatch and the second counter is further configured to generate a chop signal for reception by and for periodically reversing a polarity of the current mismatch correction circuit.
16. The semiconductor device of claim 13 , wherein the temperature-dependent current generator further includes a voltage offset correction circuit configured to reduce a voltage offset and the second counter is further configured to generate a chop signal for reception by and for periodically reversing a polarity of the voltage offset correction circuit.
17. A method of monitoring a temperature of a semiconductor device, comprising:
generating, by a temperature-independent current generator, a reference current substantially independent of temperature;
duplicating, by the temperature-independent current generator, the reference current to generate first, second, and third mirror currents;
sampling the first mirror current to generate first pulse signals;
counting a number of the first pulse signals to generate a first digital code;
receiving, by a temperature-dependent current generator, the second and third mirror currents;
generating, by the temperature-dependent current generator, a temperature-dependent current dependent of temperature based on the second and third mirror currents received thereby;
sampling the temperature-dependent current to generate second pulse signals; and
counting a number of the second pulse signals to generate a second digital code, whereby a temperature of the semiconductor device is monitored using the first and second digital codes.
18. The method of claim 17 , further comprising:
generating a PTAT current and a CTAT current; and
combining the PTAT current and the CTAT current to generate the reference current.
19. The method of claim 17 , further comprising:
generating a CTAT voltage based on the second mirror current;
converting the CTAT voltage to a CTAT current; and
subtracting the CTAT current from the third mirror current to extract the temperature-dependent current.
20. The method of claim 17 , further comprising:
generating a PTAT voltage based on the second mirror current;
converting the PTAT voltage to a PTAT current; and
subtracting the PTAT current from the third mirror current to extract the temperature-dependent current.