ADHESION BETWEEN BASE MATERIAL AND RESILIENT MATERIAL LAYER
Embodiments relate to improving the adhesion between a base substrate and a resilient material layer. Plasma-enhanced chemical vapor deposition (PECVD) is performed to deposit a silicon compound layer on a base substrate. A resilient material layer is formed on the surface of the silicon compound layer. An object formed by the method may include the base substrate, a silicon compound layer on the base substrate, and the resilient material layer on a surface of the silicon compound layer. By having a silicon compound layer with a surface roughness and thickness, adhesion between the base substrate and the resilient material layer can be significantly improved.
1 . An article of manufacture, comprising:
a base substrate;
a silicon compound layer on the base substrate, the silicon compound layer having an outer surface with a surface roughness between 50 nm and 600 nm in units of Ra; and
a resilient material layer on the outer surface of the silicon compound layer.
2 . The article of manufacture of claim 1 , wherein a thickness of the silicon compound layer is less than 1000 nm but more than 50 nm.
3 . The article of manufacture of claim 2 , wherein the silicon compound layer comprises 28-30 wt % of silicon, 60-65 wt % of oxygen, 0-1 wt % of carbon and 6-9 wt % of hydrogen.
4 . (canceled)
5 . The article of manufacture of claim 1 , wherein the base substrate comprises at least one of thermo-plastic polymer, thermo-setting polymer, silicone rubber, metals, and glass.
6 . The article of manufacture of claim 5 , wherein the thermo-plastic polymer is at least one of polypropylene, polyester sulfone, polyphenyl sulfone, polyamide, polycarbonate, and nylon.
7 . The article of manufacture of claim 1 , wherein the resilient material layer is a material selected from a group consisting of liquid silicone rubber, heat cured rubber silicone, and a combination thereof.
8 . The article of manufacture of claim 3 , wherein the base substrate is polyphenyl sulfone, and the resilient material layer is silicone rubber.
9 . The article of manufacture of claim 1 , wherein the silicon compound layer is deposited on the base substrate using plasma-enhanced chemical vapor deposition.
10 . The article of manufacture of claim 9 , wherein the plasma-enhanced chemical vapor deposition is performed by reacting a precursor hexamethyldisiloxane with a reactivity gas oxygen under plasma.
11 - 21 . (canceled)