Semiconductor structure and method for forming the same
View Patent ↗A semiconductor structure includes a substrate, a first dielectric layer on the substrate, a second dielectric layer on the first dielectric layer, and an interconnection structure on the second dielectric layer. The interconnection structure includes at least two lateral extending portions on the second dielectric layer, and a U-shaped portion through the second dielectric layer and a portion of the first dielectric layer and connected between adjacent ends of the two lateral extending portions.
1 . A semiconductor structure, comprising:
a substrate;
a first dielectric layer on the substrate;
a second dielectric layer on the first dielectric layer;
an interconnection structure on the second dielectric layer, wherein the interconnection structure comprises:
at least two lateral extending portions on the second dielectric layer; and
a U-shaped portion through the second dielectric layer and a portion of the first dielectric layer and connected between adjacent ends of the two lateral extending portions; and
a third dielectric layer on the second dielectric layer and filling a recess of the U-shaped portion of the interconnection structure.
2 . The semiconductor structure according to claim 1 , wherein the two lateral extending portions and the U-shaped portion of the interconnection structure are of a one-piece structure.
3 . The semiconductor structure according to claim 1 , further comprising a liner disposed between the interconnection structure and the first dielectric layer and the second dielectric layer.
4 . The semiconductor structure according to claim 1 , wherein a top surface of the third dielectric layer is flush with top surfaces of the two lateral extending portions.
5 . The semiconductor structure according to claim 1 , wherein a void is sealed in the recess of the U-shaped portion by the third dielectric layer.
6 . The semiconductor structure according to claim 1 , wherein a bottom surface of the third dielectric layer is lower than bottom surfaces of the two lateral extending portions.
7 . The semiconductor structure according to claim 1 , wherein the third dielectric layer is in direct contact with sidewalls of the two lateral extending portions and a top surface of the U-shaped portion.
8 . The semiconductor structure according to claim 1 , wherein adjacent ends of the two lateral extending portions are surrounded by the third dielectric layer in a top plan view.
9 . The semiconductor structure according to claim 1 , wherein a straight line connecting the adjacent ends of the two lateral extending portions and another straight line along a length direction of any one of the two lateral extending portions are not parallel.
10 . A method for forming a semiconductor structure, comprising:
providing a substrate;
forming a first dielectric layer on the substrate;
forming a second dielectric layer on the first dielectric layer;
forming at least a first opening through the second dielectric layer and a portion of the first dielectric layer;
forming a conductive layer on the second dielectric layer and filling the first opening;
performing a recess process to the conductive layer to form an interconnection structure, wherein the interconnection structure comprises:
at least two lateral extending portions on the second dielectric layer; and
a U-shaped portion in the first opening and connected between adjacent ends of the two lateral extending portions; and
forming a third dielectric layer on the second dielectric layer and filling into a recess of the U-shaped portion.
11 . The method for forming a semiconductor structure according to claim 10 , wherein the two lateral extending portions and the U-shaped portion of the interconnection structure are of a one-piece structure.
12 . The method for forming a semiconductor structure according to claim 10 , further comprising:
forming a liner along a surface of the second dielectric layer and a sidewall and a bottom surface of the first opening; and
forming the conductive layer on the liner.
13 . The method for forming a semiconductor structure according to claim 10 , further comprising:
removing a portion of the third dielectric layer until top surfaces of the two lateral extending portions are exposed.
14 . The method for forming a semiconductor structure according to claim 10 , wherein a bottom surface of the third dielectric layer is lower than bottom surfaces of the two lateral extending portions.
15 . The method for forming a semiconductor structure according to claim 10 , wherein the third dielectric layer is in direct contact with sidewalls of the two lateral extending portions and a top surface of the U-shaped portion.
16 . The method for forming a semiconductor structure according to claim 10 , wherein the third dielectric layer seals a void in the recess of the U-shaped portion.
17 . The method for forming a semiconductor structure according to claim 10 , wherein adjacent ends of the two lateral extending portions are surrounded by the third dielectric layer in a top plan view.
18 . The method for forming a semiconductor structure according to claim 10 , wherein a straight line connecting the adjacent ends of the two lateral extending portions and another straight line along a length direction of any one of the two lateral extending portions are not parallel.
19 . The method for forming a semiconductor structure according to claim 10 , further comprising:
forming a plurality of bit lines on the substrate;
forming the first dielectric layer to fill spaces between the bit lines;
forming the second dielectric layer on the first dielectric layer and the bit lines;
forming a plurality of second openings through the second dielectric layer and the first dielectric layer between the bit lines;
forming the conductive layer on the bit lines and filling the second openings; and
performing the recess process to the conductive layer to form a plurality of storage node contacts, wherein the storage node contacts respectively comprise:
a plug portion disposed in one of the second opening; and
a contact pad portion on the plug portion, wherein a top surface of the contact pad portion is flush with top surfaces of the two lateral extending portions.