Integrated circuit photodetector
An integrated circuit includes a photodetector. The photodetector includes one or more dielectric structures positioned in a trench in a semiconductor substrate. The photodetector includes a photosensitive material positioned in the trench and covering the one or more dielectric structures. A dielectric layer covers the photosensitive material. The photosensitive material has an index of refraction that is greater than the indices of refraction of the dielectric structures and the dielectric layer.
1. An integrated circuit comprising:
a semiconductor substrate;
one or more dielectric structures of dielectric material protruding from a surface of the semiconductor substrate; and
a photosensitive material positioned on the semiconductor substrate and covering the one or more dielectric structures, wherein the photosensitive material has an index of refraction that is higher than an index of refraction of the dielectric material of the one or more dielectric structures; and
control circuitry configured to bias the photosensitive material and the semiconductor substrate.
2. The integrated circuit of claim 1 , comprising a layer of dielectric material covering the photosensitive material, the dielectric material of the layer of dielectric material having an index of refraction that is less than an index of refraction of the photosensitive material.
3. The integrated circuit of claim 1 , wherein the control circuitry is configured to detect light incident on the photosensitive material based on an electrical current from the photosensitive material.
4. The integrated circuit of claim 1 , wherein the photosensitive material is positioned in a trench formed in the semiconductor substrate.
5. The integrated circuit of claim 4 , wherein the one or more dielectric structures protrude from a bottom of the trench.
6. The integrated circuit of claim 5 , wherein the one or more dielectric structures include one or more columns extending from the bottom of the trench.
7. The integrated circuit of claim 6 , wherein the columns terminate at or below a top of the trench.
8. The integrated circuit of claim 6 , wherein the photodetector further includes a dielectric sidewall covering of dielectric material positioned on a sidewall of the trench in contact with the photosensitive material, the dielectric material of the dielectric sidewall covering having an index of refraction that is less than the index of refraction of the photosensitive material.
9. The integrated circuit of claim 1 , further comprising a lens configured to focus light on the photosensitive material.
10. The integrated circuit of claim 1 , wherein the photosensitive material and the semiconductor substrate act as a photodetector that detects light by absorbing photons in the photosensitive layer and generating electrical signals indicative of the photons absorbed by the photosensitive material.
11. The integrated circuit of claim 10 , wherein the photodetector is a photodiode.
12. The integrated circuit of claim 1 , wherein the photosensitive material includes germanium.
13. A device, comprising:
a trench in a semiconductor substrate;
one or more dielectric structures of dielectric material protruding from a bottom surface of the trench; and
a photosensitive material in the trench covering the one or more dielectric structures, wherein the photosensitive material has an index of refraction that is higher than an index of refraction the dielectric material of the one or more dielectric structures.
14. The device of claim 13 , comprising a layer of dielectric material on the photosensitive material, wherein the dielectric material of the layer of dielectric material has an index of refraction that is less than the index of refraction of the photosensitive material.
15. The device of claim 13 , further comprising a dielectric sidewall coating of dielectric material on sidewalls of the trench, wherein the photosensitive material covers the dielectric sidewall coating on the sidewalls of the trench.
16. A device comprising:
a semiconductor substrate of an integrated circuit;
a trench in the semiconductor substrate;
a first pillar of dielectric material protruding from a bottom of the trench to a height lower than a top of the semiconductor substrate; and
a photosensitive material positioned on the semiconductor material, the photosensitive material covering the pillar of dielectric material and having an index of refraction greater than an index of refraction of the pillar of dielectric material.
17. The device of claim 16 , wherein a layer of dielectric material covers the photosensitive material, the dielectric layer having an index of refraction that is lower than the index of refraction of the photosensitive material.
18. The device of claim 16 , further comprising a lens configured to the light onto the photosensitive material.
19. The device of claim 16 , wherein the photosensitive material has a rounded top surface.
20. The device of claim 19 , comprising a second pillar of dielectric material protruding from the bottom of the trench to a same height as the first pillar of dielectric material.