Force sensor in an ultrasonic wire bonding device
A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.
1. A force sensor for determining a bonding force during wire bonding operations, the force sensor comprising:
a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element comprising a first portion and a second portion, and first and second opposing surfaces,
wherein the first opposing surface of the first portion has a positive electrode and the second opposing surface of the first portion has a negative electrode respectively,
the first opposing surface of the second portion has a negative electrode and the second opposing surface of the second portion has a positive electrode respectively, and
the piezoelectric sensing element is mounted in the ultrasonic transducer such that the first and second portions are arranged along a direction perpendicular to a longitudinal direction of the ultrasonic transducer.
2. The force sensor according to claim 1 , wherein the first second portions of the piezoelectric sensing element are arranged and separated along a vertical orientation.
3. The force sensor according to claim 2 , wherein the first and second portions are arranged such that symmetrical positive and negative electrodes are formed on each of the first and second opposing surfaces of the piezoelectric sensing element.
4. The force sensor according to claim 1 , wherein the piezoelectric sensing element further comprises an isolation wall arranged between the first portion and the second portion of the piezoelectric sensing element.
5. The force sensor according to claim 4 , wherein the isolation wall has a width of 1 mm to 2 mm.
6. The force sensor according to claim 1 , wherein the piezoelectric sensing element is located between a horn and a piezoelectric driver stack of the ultrasonic transducer.
7. The force sensor according to claim 6 , further comprising a first insulation plate disposed between the piezoelectric sensing element and the horn of the ultrasonic transducer, and a second insulation plate disposed between the piezoelectric sensing element and the piezoelectric driver stack of the ultrasonic transducer.
8. The force sensor according to claim 7 , further comprising a fixing mechanism which is threaded through an opening coaxially formed in each of the piezoelectric sensing element, the first and second insulation plates and the piezoelectric driver stack for fixing the piezoelectric sensing element, the first and second insulation plates and the piezoelectric driver to the horn of the ultrasonic transducer.
9. The force sensor according to claim 1 , further comprising a first conductive plate installed to contact the first opposing surface of the piezoelectric sensing element, and a second conductive plate installed to contact the second opposing surface of the piezoelectric sensing element.
10. The force sensor according to claim 9 , wherein the first and second conductive plates are respectively connected to a charge amplifier for converting current signals from the piezoelectric sensing element to voltage signals.
11. The force sensor according to claim 10 , wherein the first and second conductive plates have cross sectional areas with same shape and dimensions as the first and second opposing surfaces of the piezoelectric sensing element, such that the first and second opposing surfaces of the piezoelectric sensing element are fully contacted by the first and second conductive plates respectively.
12. An ultrasonic wire bonding device comprising:
an ultrasonic transducer and a force sensor, the force sensor comprising a piezoelectric sensing element mounted in the ultrasonic transducer, the piezoelectric sensing element comprising a first portion and a second portion, and first and second opposing surfaces,
wherein the first opposing surface of the first portion has a positive electrode and the second opposing surface of the first portion has a negative electrode respectively, and
the first opposing surface of the second portion has a negative electrode and the second opposing surface of the second portion has a positive electrode respectively.