IP Library › Granted Patent US 12,599,874
Granted Patent B2
US 12,599,874 · App. 17/737,809 · Granted Apr 14, 2026

Wastewater treatment system and method for semiconductor fabrication process

Inventors: Jiwon Chun (Seongnam-si, KR); Jongkeun Yi (Osan-si, KR); Chongmin Chung (Jeonju-si, KR); Kangwoo Cho (Pohang-si, KR); Baekmin Seong (Suwon-si, KR); Minuk Joo (Pohang-si, KR); Kyuwon Hwang (Incheon, KR)
Assignee: Samsung Electronics Co., Ltd.
B01D61/445B01D61/44B01D61/465B01D61/466B01D61/58C02F1/4693C02F2101/38C02F2103/346C02F2201/46115C23F1/46
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Quick Facts
Patent No.
US 12,599,874
App. No.
17/737,809
Granted
Apr 14, 2026
Kind
B2
Abstract

Disclosed are wastewater treatment systems and methods for semiconductor fabrication process. The method comprises performing first concentration on wastewater discharged from a semiconductor process chamber, and performing second concentration on concentrated wastewater or at least a portion of the wastewater concentrated by the first concentration. The step of performing the first concentration includes performing in a first electrodialysis apparatus an ion exchange between the wastewater and first treatment water. The step of performing the second concentration includes allowing the concentrated wastewater to circulate in a second electrodialysis apparatus, allowing second treatment water to circulate in the second electrodialysis apparatus, providing a power to an anode and a cathode of the second electrodialysis apparatus to perform an ion exchange between the second treatment water and the concentrated wastewater, and joining a portion of the concentrated wastewater to the second treatment water.

Claims (31)

1 . A wastewater treatment method for a semiconductor fabrication process, the method comprising:

processing wastewater discharged from a semiconductor process chamber to generate a wastewater with an increased solute concentration, comprising causing an ion exchange between the wastewater discharged from the semiconductor process chamber and a first treatment water in a first electrodialysis apparatus, wherein the wastewater discharged from the semiconductor process chamber repeatedly enters a chamber of the first electrodialysis apparatus directly from a wastewater tank via a wastewater inlet port and exits the chamber of the first electrodialysis apparatus directly back to the wastewater tank via a wastewater outlet port, and wherein the first treatment water repeatedly enters the chamber of the first electrodialysis apparatus directly from a first treatment water tank via a treatment water inlet port and exits the chamber of the first electrodialysis apparatus directly back to the first treatment water tank via a first treatment water outlet port,

wherein the first electrodialysis apparatus comprises a bipolar membrane-anion-exchange membrane-cation-exchange membrane (BP-A-C) type electrodialysis apparatus in which a plurality of bipolar membranes, a plurality of anion-exchange membranes, and a plurality of cation-exchange membranes are alternately arranged with each other between an anode and a cathode of the first electrodialysis apparatus, wherein the wastewater discharged from the semiconductor process chamber is introduced into each of a plurality of spaces in contact with a surface of each of the plurality of cation-exchange membranes that is directed toward the cathode, and wherein the first treatment water is introduced into each of a plurality of spaces in contact with a surface of each of the plurality of cation-exchange membranes that is directed toward the anode and into each of a plurality of spaces in contact with a surface of each of the plurality of anion-exchange membranes that is directed toward the anode; and

processing wastewater that comprises at least a portion of the wastewater with the increased solute concentration, comprising:

circulating the wastewater that comprises at least a portion of the wastewater with the increased solute concentration in a second electrodialysis apparatus;

circulating a second treatment water in the second electrodialysis apparatus;

causing an ion exchange between the second treatment water and the wastewater circulating in the second electrodialysis apparatus; and

combining a portion of the wastewater circulating in the second electrodialysis apparatus with the second treatment water.

2 . The wastewater treatment method of claim 1 , wherein the combining the portion of the wastewater circulating in the second electrodialysis apparatus with the second treatment water comprises:

separating the wastewater circulating in the second electrodialysis apparatus into reconcentration-target wastewater and additional treatment water, and

combining the additional treatment water with the second treatment water and circulating the combined additional treatment water and second treatment water in the second electrodialysis apparatus.

3 . The wastewater treatment method of claim 2 , wherein the separating the wastewater circulating in the second electrodialysis apparatus is performed when the wastewater circulating in the second electrodialysis apparatus is discharged from the second electrodialysis apparatus.

4 . The wastewater treatment method of claim 1 , further comprising separating the wastewater with the increased solute concentration into concentrated wastewater and residual wastewater,

wherein the residual wastewater is used as the second treatment water in the circulating of the second treatment water in the second electrodialysis apparatus.

5 . The wastewater treatment method of claim 1 , wherein the processing the wastewater discharged from the semiconductor process chamber further comprises:

measuring a pH value of the first treatment water; and

using the measured pH value of the first treatment water to determine whether the first treatment water requires replacing.

6 . The wastewater treatment method of claim 5 , wherein the determining whether the first treatment water requires replacing comprises determining whether the measured pH value of the first treatment water is less than a reference pH value.

7 . The wastewater treatment method of claim 6 , wherein the processing the wastewater discharged from the semiconductor process chamber further comprises replacing the first treatment water when the measured pH value of the first treatment water is equal to or less than the reference pH value.

8 . A wastewater treatment method for a semiconductor fabrication process, the method comprising:

providing wastewater into a chamber of an electrodialysis apparatus, wherein the wastewater repeatedly enters the chamber of the electrodialysis apparatus from a wastewater tank via a wastewater inlet port and exits the chamber of the electrodialysis apparatus back to the wastewater tank via a wastewater outlet port;

providing treatment water into the chamber, wherein the treatment water repeatedly enters the chamber of the electrodialysis apparatus from a treatment water tank via a treatment water inlet port and exits the chamber of the electrodialysis apparatus back to the treatment water tank via a treatment water outlet port;

providing power to an anode and a cathode of the electrodialysis apparatus to cause an ion exchange between the wastewater and the treatment water in the chamber;

wherein the electrodialysis apparatus comprises a bipolar membrane-anion-exchange membrane-cation-exchange membrane (BP-A-C) type electrodialysis apparatus in which a plurality of bipolar membranes, a plurality of anion-exchange membranes, and a plurality of cation-exchange membranes are alternately arranged with each other between the anode and the cathode, wherein the wastewater is introduced into each of a plurality of spaces in contact with a surface of each of the plurality of cation-exchange membranes that is directed toward the cathode, and wherein the treatment water is introduced into each of a plurality of spaces in contact with a surface of each of the plurality of cation-exchange membranes that is directed toward the anode and into each of a plurality of spaces in contact with a surface of each of the plurality of anion-exchange membranes that is directed toward the anode;

separating the wastewater discharged from the chamber into reconcentration-target wastewater and additional treatment water via a connection tube that connects the wastewater tank to the treatment water tank such that a portion of the wastewater flows through the connection tube from the wastewater tank;

providing the reconcentration-target wastewater into the chamber; and

providing both the treatment water discharged from the chamber and the additional treatment water into the chamber.

9 . The wastewater treatment method of claim 8 , wherein an amount of the reconcentration-target wastewater is greater than an amount of the additional treatment water.

10 . The wastewater treatment method of claim 8 , wherein a volume ratio between the wastewater and the treatment water provided into the chamber is about 1:5 to about 1:9.

11 . The wastewater treatment method of claim 8 , wherein the wastewater comprises tetramethylammonium hydroxide (TMAH).

12 . The wastewater treatment method of claim 8 , wherein a respective one of a plurality of spacers is positioned between each adjacent bipolar membrane and cation-exchange membrane, between each adjacent bipolar membrane and anion-exchange membrane, and between each adjacent anion-exchange membrane and cation-exchange membrane, and wherein each of the plurality of spacers comprises silicon.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2026
From: CHUNG, CHONGMIN; CHO, KANGWOO; JOO, MINUK
To: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
Reel/Frame 073871/0303 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2022
From: CHUN, JIWON; YI, JONGKEUN; SEONG, BAEKMIN; HWANG, KYUWON
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 059858/0259 →
Priority Claims (1)
KR 10-2021-0118678 · Sep 6, 2021 · national
Continuity (1)
Related Publication 20230071797A1 · Mar 9, 2023
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