Systems, devices, and methods for aligning a particle beam and performing a non-contact electrical measurement on a cell and/or non-contact electrical measurement cell vehicle using a registration cell
Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.
1. A method comprising:
receiving a recipe for a die included in a wafer, the die including a plurality of chips, each chip of the plurality of chips being divided into a plurality of tiles, each tile including a non-contact electronic measurement (NCEM)-enabled NCEM-enabled registration cell and a plurality of NCEM-enabled fill cells, the recipe including a position for the die within the wafer, a position of the NCEM-enabled registration cell, and a position of each NCEM-enabled cell of the plurality NCEM-enabled cells;
determining an expected position of a NCEM-enabled registration cell included a tile of the plurality of tiles;
directing an electron beam toward the NCEM-enabled registration cell;
receiving an indication of a response of the NCEM-enabled registration cell to the electron beam; and
determining an actual position of the NCEM-enabled registration cell using the response.
2. The method of claim 1 , further comprising:
aligning the electron beam using the actual position of the NCEM-enabled registration cell.
3. The method of claim 1 , further comprising:
aligning the electron beam using the actual position of the NCEM-enabled registration cell;
directing the aligned electron beam toward an NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells;
receiving a response of the NCEM-enabled fill cell to the aligned electron beam; and
providing an indication of the response to a processor.
4. The method of claim 1 , further comprising:
receiving parameters for motion of a movable stage upon which the wafer is positioned, wherein determining of the expected position of a NCEM-enabled registration cell included a tile of the plurality of tiles is based upon received parameters for the movable stage.
5. The method of claim 1 , further comprising:
aligning the electron beam using the actual position of the NCEM-enabled registration cell;
receiving parameters for motion of a movable stage upon which the wafer is positioned;
determining an expected position of a NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells using received parameters for the movable stage; and
directing the aligned electron beam toward the NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells.
6. The method of claim 5 , wherein the determining of the expected position the NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells is based on the recipe.
7. The method of claim 1 , further comprising:
aligning the electron beam using the actual position of the NCEM-enabled registration cell;
receiving parameters for motion of a movable stage upon which the wafer is positioned;
determining an expected position each NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells using received parameters for the movable stage and the recipe; and
directing the aligned electron beam toward each NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells.
8. The method of claim 7 , wherein the determining of the expected position each NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells is based on the recipe.
9. The method of claim 1 , further comprising:
receiving parameters for motion of an electron beam column that directs the electron beam toward the NCEM-enabled registration cell, wherein a direction of the of the electron beam emitted by the electron beam column is responsive to the received parameters for motion of the electron beam column.
10. The method of claim 1 , further comprising:
aligning the electron beam using the actual position of the NCEM-enabled registration cell;
receiving parameters for motion of an electron beam column that directs the electron beam toward the NCEM-enabled registration cell;
determining where to direct the electron beam so that it is incident upon a NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells using received parameters for motion of an electron beam column; and
directing the aligned electron beam toward the NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells.
11. The method of claim 10 , wherein the determining of the expected position the NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells is based on the recipe.
12. The method of claim 1 , further comprising:
aligning the electron beam using the actual position of the NCEM-enabled registration cell;
receiving parameters for motion of an electron beam column that directs the electron beam toward the NCEM-enabled registration cell;
determining where to direct the electron beam so that it is incident upon each NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells using received parameters for motion of an electron beam column; and
directing the aligned electron beam toward each NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells.
13. The method of claim 12 , wherein the determining of the expected position each NCEM-enabled fill cell of the plurality of NCEM-enabled fill cells is based on the recipe.
14. The method of claim 1 , wherein the NCEM-enabled registration cell comprises:
a substrate;
a power rail electrically coupled to a power supply and mechanically coupled to the substrate;
a ground rail electrically coupled to a ground and mechanically coupled to the substrate; and
a floating feature mechanically, but not electrically, coupled to the substrate, the floating feature being configured to provide an easily distinguishable feature when exposed to a non-contact electrical measurement.