Thermal hinge system
A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.
1. A system to conduct thermal energy between two hinged portions of an extended-reality headset device comprising:
a living hinge extending from a face front portion of the extended-reality headset device to a temple arm of the extended-reality headset device;
a first thermal management component connected to a first end of the living hinge; and
a second thermal management component connected to a second end, opposite the first end, of the living hinge,
wherein:
the living hinge comprises a material that is thermally conductive, and
the living hinge is configured to operate in a bent state and a non-bent state,
the bent state is configured such that a major length of the temple arm is substantially parallel to the face front portion, and
while in the non-bent state, the living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component.
2. The system of claim 1 , wherein each of the first thermal management component and the second thermal management component comprise a heat pipe or a vapor chamber.
3. The system of claim 1 , wherein the first thermal management component and the second thermal management component are connected to the living hinge via welding, thermosonic bonding, brazing, mechanical fastener, adhesive, or any combination thereof.
4. The system of claim 1 , wherein the living hinge has a curved cross-sectional shape.
5. The system of claim 1 , wherein the living hinge is electrically conductive.
6. The system of claim 1 , wherein the living hinge is biased toward the non-bent state.
7. The system to conduct thermal energy between two hinged portions of an extended-reality headset of claim 1 , wherein:
while in the non-bent state, the living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component at a first thermal-energy transfer rate, and
while in the bent state, the living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component at a second thermal-energy transfer rate that is lower than the first thermal-energy transfer rate.
8. A method of transferring thermal energy between two hinged portions of an extended-reality headset device comprising:
providing an electronic device comprising a face front portion of the extended-reality headset device comprising a first thermal management component and a temple arm of the extended-reality headset device comprising a second thermal management component, the face front portion and the temple arm being coupled by a mechanical articulation and a thermally conductive living hinge being bonded to the first thermal management component at one end and to the second thermal management component at an opposite, second end, wherein the thermally conductive living hinge is configured to operate in a bent state and a non-bent state, the bent state is configured such that a major length of the temple arm is substantially parallel to the face front portion, and while in the non-bent state, the thermally conductive living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component;
transferring thermal energy from an electronic structure provided in the face front portion to the first thermal management component;
transferring the thermal energy from the first thermal management component to the thermally conductive living hinge;
transferring the thermal energy from the thermally conductive living hinge to the second thermal management component; and
transferring the thermal energy from the second thermal management component to the temple arm.
9. The method of transferring thermal energy between two hinged portions of an extended-reality headset of claim 8 , wherein:
while in the non-bent state, the thermally conductive living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component at a first thermal-energy transfer rate, and
while in the bent state, the thermally conductive living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component at a second thermal-energy transfer rate that is lower than the first thermal-energy transfer rate.
10. An extended-reality headset device comprising:
a face front portion comprising a first thermal management component;
a temple arm comprising a second thermal management component;
a mechanical articulation coupling a first hinged portion to a second hinged portion; and
a living hinge bonded to the first thermal management component and the second thermal management component and extending through the mechanical articulation, wherein:
the living hinge comprises a material that is thermally conductive; and
the living hinge is configured to operate in a bent state and a non-bent state, the bent state is configured such that a major length of the temple arm is substantially parallel to the face front portion, and
while in the non-bent state, the living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component.
11. The extended-reality headset device of claim 10 , wherein the living hinge comprises an electrically conductive material.
12. The extended-reality headset device of claim 10 , wherein the living hinge is bonded to the first thermal management component and to the second thermal management component via welding, thermosonic bonding, brazing, mechanical fastener, adhesive, or any combination thereof.
13. The extended-reality headset device of claim 10 , wherein the living hinge comprises a curved cross-section.
14. The extended-reality headset device of claim 10 , wherein the living hinge is configured to be biased toward the straighten non-bent state.
15. The extended-reality headset device of claim 10 , wherein the first thermal management component and the second thermal management component may each independently comprise a vapor chamber, a heat pipe, a strip of thermally conductive material, or any combination thereof.
16. The extended-reality headset device of claim 10 , wherein at least one of the first thermal management component and the second thermal management component are constructed of a material associated with a flex circuit.
17. The extended-reality headset device of claim 10 , wherein the mechanical articulation comprises a barrel hinge.
18. The extended-reality headset device of claim 10 , further comprising a first thermal interface component in the face front portion and a second thermal interface component in the temple arm, the first thermal interface component and the second thermal interface component arranged such that they come into physical contact with each other when the living hinge is in the non-bent state and are spaced apart when the living hinge is in the bent state.
19. The extended-reality headset device of claim 10 , wherein the extended-reality headset device is an augmented-reality headset.
20. An extended-reality headset device of claim 9 , wherein:
while in the non-bent state, the living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component at a first thermal-energy transfer rate, and
while in the bent state, the living hinge is configured to conduct thermal energy generated from use of the extended-reality headset device from the first thermal management component to the second thermal management component at a second thermal-energy transfer rate that is lower than the first thermal-energy transfer rate.